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    • 1. 发明授权
    • Semiconductor memory devices including recess-type control gate electrodes and methods of fabricating the semiconductor memory devices
    • 包括凹型控制栅电极的半导体存储器件和制造半导体存储器件的方法
    • US08148767B2
    • 2012-04-03
    • US11709860
    • 2007-02-23
    • Yoon-dong ParkJune-mo KooKyoung-lae Cho
    • Yoon-dong ParkJune-mo KooKyoung-lae Cho
    • H01L29/788
    • H01L21/28273B82Y10/00H01L21/28282H01L27/115H01L27/11521H01L27/11568H01L29/66825H01L29/66833H01L29/7881H01L29/792H01L29/7923
    • A semiconductor memory device includes a semiconductor substrate, a control gate electrode recessed in the semiconductor substrate, a storage node layer interposed between a sidewall of the control gate electrode and the semiconductor substrate, a tunneling insulation layer interposed between the storage node layer and the semiconductor substrate, a blocking insulation layer interposed between the storage node layer and the control gate electrode, and first and second channel regions formed around a surface of the semiconductor substrate to at least partially surround the control gate electrode. The semiconductor memory device may include a plurality of control gate electrodes, storage node layers, tunneling insulation layers, blocking insulation layers, and continuous first and second channel regions. A method of fabricating the semiconductor memory device includes etching the semiconductor substrate to form a plurality of holes, forming the tunneling insulation layers, storage node layers, blocking insulation layers, and control gate electrodes.
    • 半导体存储器件包括半导体衬底,凹入半导体衬底中的控制栅极电极,插在控制栅电极的侧壁和半导体衬底之间的存储节点层,介于存储节点层和半导体衬底之间的隧道绝缘层 衬底,介于存储节点层和控制栅电极之间的阻挡绝缘层,以及形成在半导体衬底的表面周围以至少部分地围绕控制栅电极的第一和第二沟道区。 半导体存储器件可以包括多个控制栅电极,存储节点层,隧道绝缘层,阻挡绝缘层以及连续的第一和第二沟道区。 制造半导体存储器件的方法包括蚀刻半导体衬底以形成多个孔,形成隧道绝缘层,存储节点层,阻挡绝缘层和控制栅电极。
    • 7. 发明申请
    • Nonvolatile memory device and method of fabricating the same
    • 非易失性存储器件及其制造方法
    • US20080157176A1
    • 2008-07-03
    • US11902511
    • 2007-09-21
    • Won-joo KimYoon-dong ParkJune-mo KooSuk-pil KimSung-jae Byun
    • Won-joo KimYoon-dong ParkJune-mo KooSuk-pil KimSung-jae Byun
    • H01L27/115H01L21/8247
    • H01L27/115H01L27/11521H01L27/11524H01L27/11568H01L29/42336H01L29/66803
    • A nonvolatile memory device having lower bit line contact resistance and a method of fabricating the same is provided. In the nonvolatile memory device, a semiconductor substrate of a first conductivity type may include first and second fins. A common bit line electrode may connect one end of the first fin to one end of the second fin. A plurality of control gate electrodes may cover the first and second fins and expand across the top surface of each of the first and second fins. A first string selection gate electrode may be positioned between the common bit line electrode and the plurality of control gate electrodes. The first string selection gate electrode may cover the first and second fins and expand across the top surface of each of the first and second fins. A second string selection gate electrode may be positioned between the first string selection gate electrode and the plurality of control gate electrodes. The second string selection gate electrode may cover the first and second fins and expand across the top surface of each of the first and second fins. The first fin under the first string selection gate electrode and the second fin under the second string selection gate electrode may have a second conductivity type opposite to the first conductivity type.
    • 提供一种具有较低位线接触电阻的非易失性存储器件及其制造方法。 在非易失性存储器件中,第一导电类型的半导体衬底可以包括第一和第二鳍片。 公共位线电极可将第一鳍片的一端连接到第二鳍片的一端。 多个控制栅极电极可以覆盖第一和第二鳍片并且跨越第一和第二鳍片中的每一个的顶表面膨胀。 第一串选择栅极可以位于公共位线电极和多个控制栅电极之间。 第一串选择栅电极可以覆盖第一和第二鳍片并且横跨第一和第二鳍片中的每一个的顶表面扩展。 第二串选择栅电极可以位于第一串选择栅电极和多个控制栅电极之间。 第二串选择栅电极可以覆盖第一和第二鳍片并且横跨第一和第二鳍片中的每一个的顶表面扩展。 第一串选择栅电极下的第一鳍和第二串选择栅电极下的第二鳍可以具有与第一导电类型相反的第二导电类型。
    • 9. 发明申请
    • Non-volatile memory device and method of fabricating the same
    • 非易失性存储器件及其制造方法
    • US20080123390A1
    • 2008-05-29
    • US11882694
    • 2007-08-03
    • Won-joo KimSuk-pil KimYoon-dong ParkJune-mo Koo
    • Won-joo KimSuk-pil KimYoon-dong ParkJune-mo Koo
    • G11C11/00H01L21/16
    • G11C11/5678G11C13/0004H01L27/24
    • A non-volatile memory device and a method of fabricating the same are provided. In the non-volatile memory device, at least one first semiconductor layer of a first conductivity type may be formed spaced apart from each other on a portion of a substrate. A plurality of first resistance variation storage layers may contact first sidewalls of each of the at least one first semiconductor layer. A plurality of second semiconductor layers of a second conductivity type, opposite to the first conductivity type, may be interposed between the first sidewalls of each of the at least one first semiconductor layer and the plurality of first resistance variation storage layers. A plurality of bit line electrodes may be connected to each of the plurality of first resistance variation storage layers.
    • 提供了一种非易失性存储器件及其制造方法。 在非易失性存储器件中,第一导电类型的至少一个第一半导体层可以在衬底的一部分上彼此间隔开形成。 多个第一电阻变化存储层可以接触至少一个第一半导体层中的每一个的第一侧壁。 与第一导电类型相反的第二导电类型的多个第二半导体层可以插入在至少一个第一半导体层和多个第一电阻变化存储层中的每一个的第一侧壁之间。 多个位线电极可以连接到多个第一电阻变化存储层中的每一个。