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1. 发明授权

US09673527B2 Folded patch antenna platform 有权
公开(公告)号：US09673527B2
公开(公告)日：2017-06-06
申请号：US14126950
申请日：2012-07-06
申请人： Yong-Kyu Yoon , Gloria Jung-a Kim , Xiaoyu Cheng
发明人： Yong-Kyu Yoon , Gloria Jung-a Kim , Xiaoyu Cheng
IPC分类号： H01Q9/04 , H01Q1/24 , H01Q1/27 , H01Q1/38 , H01Q5/364
CPC分类号： H01Q9/0442 , H01Q1/24 , H01Q1/273 , H01Q1/38 , H01Q5/364 , H01Q9/0414
摘要： Various systems and methods are provided for folded patch antennas. In one embodiment, among others, a folded patch antenna includes a patch disposed on an outer side of a flexible substrate and a ground plane disposed on an inner side of the flexible substrate opposite the patch. The flexible substrate is folded to form an enclosed cavity defined by the inner side of the flexible substrate. The ground plane may provide electromagnetic interference (EMI) shielding of the cavity. In another embodiment, among others, a folded patch antenna platform includes a flexible substrate, a folded patch antenna, and a transceiver mounted on the flexible substrate. The folded patch antenna includes a patch communicatively coupled to the transceiver and a ground plane, which are disposed on opposite sides of the flexible substrate.

2. 发明申请

US20140139385A1 FOLDED PATCH ANTENNA PLATFORM 有权
标题翻译：折叠式天线平台
公开(公告)号：US20140139385A1
公开(公告)日：2014-05-22
申请号：US14126950
申请日：2012-07-06
申请人： Yong-Kyu Yoon , Gloria Jung-a Kim , Xiaoyu Cheng
发明人： Yong-Kyu Yoon , Gloria Jung-a Kim , Xiaoyu Cheng
IPC分类号： H01Q9/04
CPC分类号： H01Q9/0442 , H01Q1/24 , H01Q1/273 , H01Q1/38 , H01Q5/364 , H01Q9/0414
摘要： Various systems and methods are provided for folded patch antennas. In one embodiment, among others, a folded patch antenna includes a patch disposed on an outer side of a flexible substrate and a ground plane disposed on an inner side of the flexible substrate opposite the patch. The flexible substrate is folded to form an enclosed cavity defined by the inner side of the flexible substrate. The ground plane may provide electromagnetic interference (EMI) shielding of the cavity. In another embodiment, among others, a folded patch antenna platform includes a flexible substrate, a folded patch antenna, and a transceiver mounted on the flexible substrate. The folded patch antenna includes a patch communicatively coupled to the transceiver and a ground plane, which are disposed on opposite sides of the flexible substrate.
摘要翻译：为折叠贴片天线提供了各种系统和方法。在一个实施例中，折叠贴片天线包括布置在柔性基板的外侧上的贴片和布置在与贴片相对的柔性基板的内侧上的接地平面。柔性基底被折叠以形成由柔性基底的内侧限定的封闭空腔。接地层可以提供空腔的电磁干扰（EMI）屏蔽。在另一个实施例中，折叠贴片天线平台包括柔性基板，折叠贴片天线和安装在柔性基板上的收发器。折叠的贴片天线包括通信地耦合到收发器的接头和设置在柔性基板的相对侧上的接地平面。

3. 发明授权

US09353461B2 Fabrication of nanoporous membrane 有权
标题翻译：纳米孔膜的制备
公开(公告)号：US09353461B2
公开(公告)日：2016-05-31
申请号：US14116403
申请日：2012-05-10
申请人： Pitfee Jao , Yong-Kyu Yoon , Gloria Jung-a Kim
发明人： Pitfee Jao , Yong-Kyu Yoon , Gloria Jung-a Kim
IPC分类号： B29C65/74 , B01D67/00 , D01D5/00 , B01D71/44 , D04H1/728 , D01F9/08
CPC分类号： D01D5/0076 , B01D67/0032 , B01D71/44 , B01D2323/39 , B29C65/7451 , B29C65/7461 , D01D5/0069 , D01F9/08 , D04H1/728 , Y10T156/1062
摘要： Various methods and systems are provided for fabrication of nanoporous membranes. In one embodiment, among others, a system includes electrode pairs including substantially parallel electrodes, a controllable power supply to control the electrical potential of each of the electrode pairs, and a syringe to eject an electrically charged solution from a needle to form a nanofiber. The orientation of the nanofiber in a nanofiber layer is determined by the electrical potentials of the electrode pairs. In another embodiment, a method includes providing a nanoporous membrane including nanofiber layers between a transferor and a mainmold of a stamp-through-mold (STM) where adjacent nanofiber layers are approximately aligned in different directions. A patterned membrane is sheared from the nanoporous membrane using the transferor and the mainmold of the STM and transferred to a substrate.
摘要翻译：提供了用于制造纳米多孔膜的各种方法和系统。在一个实施例中，系统包括电极对，其包括基本上平行的电极，用于控制每个电极对的电位的可控电源，以及用于从针头喷射带电溶液以形成纳米纤维的注射器。纳米纤维层中纳米纤维的取向取决于电极对的电位。在另一个实施方案中，一种方法包括提供一纳米多孔膜，该纳米多孔膜包括在相邻的纳米纤维层在不同方向上大致对齐的转印模和模印模（STM）的主模之间的纳米纤维层。使用转移器和STM的主模，从纳米多孔膜剪切图案化的膜并转移到基底。

4. 发明申请

US20140124131A1 FABRICATION OF NANOPOROUS MEMBRANE 有权
标题翻译：纳米膜的制备
公开(公告)号：US20140124131A1
公开(公告)日：2014-05-08
申请号：US14116403
申请日：2012-05-10
申请人： Pitfee Jao , Yong-Kyu Yoon , Gloria Jung-a Kim
发明人： Pitfee Jao , Yong-Kyu Yoon , Gloria Jung-a Kim
IPC分类号： D01D5/00
CPC分类号： D01D5/0076 , B01D67/0032 , B01D71/44 , B01D2323/39 , B29C65/7451 , B29C65/7461 , D01D5/0069 , D01F9/08 , D04H1/728 , Y10T156/1062
摘要： Various methods and systems are provided for fabrication of nanoporous membranes. In one embodiment, among others, a system includes electrode pairs including substantially parallel electrodes, a controllable power supply to control the electrical potential of each of the electrode pairs, and a syringe to eject an electrically charged solution from a needle to form a nanofiber. The orientation of the nanofiber in a nanofiber layer is determined by the electrical potentials of the electrode pairs. In another embodiment, a method includes providing a nanoporous membrane including nanofiber layers between a transferor and a mainmold of a stamp-through-mold (STM) where adjacent nanofiber layers are approximately aligned in different directions. A patterned membrane is sheared from the nanoporous membrane using the transferor and the mainmold of the STM and transferred to a substrate.
摘要翻译：提供了用于制造纳米多孔膜的各种方法和系统。在一个实施例中，系统包括电极对，其包括基本上平行的电极，用于控制每个电极对的电位的可控电源，以及用于从针头喷射带电溶液以形成纳米纤维的注射器。纳米纤维层中纳米纤维的取向取决于电极对的电位。在另一个实施方案中，一种方法包括提供一纳米多孔膜，该纳米多孔膜包括在相邻的纳米纤维层在不同方向上大致对齐的转印模和模印模（STM）的主模之间的纳米纤维层。使用转移器和STM的主模具从纳米多孔膜剪切图案化的膜并转移到基底。

5. 发明授权

US08690865B2 Methods and devices for thermal treatment 有权
标题翻译：热处理方法和装置
公开(公告)号：US08690865B2
公开(公告)日：2014-04-08
申请号：US11597969
申请日：2005-05-31
申请人： Mark R. Prausnitz , Mark G. Allen , Jung-Hwan Park , Yong-Kyu Yoon , Jin-Woo Park
发明人： Mark R. Prausnitz , Mark G. Allen , Jung-Hwan Park , Yong-Kyu Yoon , Jin-Woo Park
IPC分类号： A61B18/08 , A61N1/30
CPC分类号： A61K9/0004 , A61B5/14514 , A61B18/082 , A61B18/10 , A61B2018/00005 , A61B2018/00613 , A61K9/7023 , A61K41/0047 , A61M37/0015 , A61M37/0092 , A61M2037/0007 , A61M2037/0046 , A61N1/0412 , A61N1/0476 , A61N1/0492 , A61N1/327
摘要： The present invention comprises methods and devices for thermal treatment of a barrier to increase the permeability of the barrier. One form of increasing the permeability of the barrier comprises forming micropores which may be used for administration of active agents across the barrier, or may be used for sampling or collecting fluids, or may be used for detecting, measuring or determining analytes, or may be used for monitoring of physiological or other conditions. Devices of the present invention may comprise microheaters that are activated by inductive or ohmic heating power supply components.
摘要翻译：本发明包括用于热处理屏障以增加屏障的渗透性的方法和装置。增加屏障渗透性的一种形式包括形成微孔，该微孔可用于通过阻挡层施用活性剂，或可用于取样或收集流体，或可用于检测，测量或确定分析物，或者可以是用于监测生理或其他条件。本发明的装置可以包括由电感或欧姆加热电源部件激活的微热电。

6. 发明申请

US20080045879A1 Methods and Devices for Thermal Treatment 有权
标题翻译：热处理方法和装置
公开(公告)号：US20080045879A1
公开(公告)日：2008-02-21
申请号：US11597969
申请日：2005-05-31
申请人： Mark Prausnitz , Mark Allen , Jung-Hwan Park , Yong-Kyu Yoon , Jin-Woo Park
发明人： Mark Prausnitz , Mark Allen , Jung-Hwan Park , Yong-Kyu Yoon , Jin-Woo Park
IPC分类号： A61N1/30
CPC分类号： A61K9/0004 , A61B5/14514 , A61B18/082 , A61B18/10 , A61B2018/00005 , A61B2018/00613 , A61K9/7023 , A61K41/0047 , A61M37/0015 , A61M37/0092 , A61M2037/0007 , A61M2037/0046 , A61N1/0412 , A61N1/0476 , A61N1/0492 , A61N1/327
摘要： The present invention comprises methods and devices for thermal treatment of a barrier to increase the permeability of the barrier. One form of increasing the permeability of the barrier comprises forming micropores which may be used for administration of active agents across the barrier, or may be used for sampling or collecting fluids, or may be used for detecting, measuring or determining analytes, or may be used for monitoring of physiological or other conditions. Devices of the present invention may comprise microheaters that are activated by inductive or ohmic heating power supply components.
摘要翻译：本发明包括用于热处理屏障以增加屏障的渗透性的方法和装置。增加屏障渗透性的一种形式包括形成微孔，该微孔可用于通过阻挡层施用活性剂，或可用于取样或收集流体，或可用于检测，测量或确定分析物，或者可以是用于监测生理或其他条件。本发明的装置可以包括由电感或欧姆加热电源部件激活的微热电。

7. 发明申请

US20130306356A1 METHOD FOR MAKING ELECTRICALLY CONDUCTIVE THREE-DIMENSIONAL STRUCTURES 有权
标题翻译：制造电导三维结构的方法
公开(公告)号：US20130306356A1
公开(公告)日：2013-11-21
申请号：US13873961
申请日：2013-04-30
申请人： Mark G. Allen , Seong-O Choi , Jung-Hwan Pauk , Xiaosong Wu , Yanzhu Zhao , Yong-Kyu Yoon , Swaminathan Rajaraman
发明人： Mark G. Allen , Seong-O Choi , Jung-Hwan Pauk , Xiaosong Wu , Yanzhu Zhao , Yong-Kyu Yoon , Swaminathan Rajaraman
IPC分类号： H01B13/00 , H05K1/02
CPC分类号： B32B3/30 , A61B5/685 , A61B2562/125 , A61M37/0015 , A61M2037/0053 , A61N1/327 , C25D1/003 , C25D1/10 , C25D5/022 , H01B13/00 , H05K1/02 , H05K3/20 , H05K3/4007 , H05K2201/0367 , H05K2201/09045 , H05K2201/09118 , H05K2203/0113 , Y10T428/2958 , Y10T428/298
摘要： Methods are provided for fabricating three-dimensional electrically conductive structures. Three-dimensional electrically conductive microstructures are also provided. The method may include providing a mold having at least one microdepression which defines a three-dimensional structure; filling the microdepression of the mold with at least one substrate material; molding the at least one substrate material to form a substrate; and depositing and patterning of at least one electrically conductive layer either during the molding process or subsequent to the molding process to form an electrically conductive structure. In one embodiment, the three-dimensional electrically conductive microstructure comprises an electrically functional microneedle array comprising two or more microneedles, each including a high aspect ratio, polymeric three dimensional substrate structure which is at least substantially coated by an electrically conductive layer.
摘要翻译：提供用于制造三维导电结构的方法。还提供三维导电微结构。该方法可以包括提供具有限定三维结构的至少一个微压缩的模具; 用至少一种基底材料填充模具的微压; 模制所述至少一种基底材料以形成基底; 以及在模制过程期间或在模制过程之后沉积和图案化至少一个导电层以形成导电结构。在一个实施例中，三维导电微结构包括电功能微针阵列，其包括两个或更多个微针，每个微针包括高纵横比，至少基本上被导电层涂覆的聚合物三维衬底结构。

8. 发明申请

US20100195082A1 Device, System, And Method For Multidirectional Ultraviolet Lithography 审中-公开
标题翻译：用于多向紫外光刻的装置，系统和方法
公开(公告)号：US20100195082A1
公开(公告)日：2010-08-05
申请号：US12694936
申请日：2010-01-27
申请人： Yong-Kyu Yoon , JungKwun Kim , Mark G. Allen
发明人： Yong-Kyu Yoon , JungKwun Kim , Mark G. Allen
IPC分类号： G03B27/58 , G03F7/20 , B65D85/00
CPC分类号： G03F7/201
摘要： A system according to an embodiment of the present invention comprises a movable stage having a top surface. A photosensitive material may be deposited on the top surface and a mask may be placed on the photosensitive material. A vessel, having a top portion, one or more flexible sides, and a transparent base, is configured to be placed adjacent to the mask. The base is configured to be movable relative to the top portion of the vessel. In this way, the movable stage, photosensitive material, and mask may move in conjunction with the base of the vessel.
摘要翻译：根据本发明的实施例的系统包括具有顶表面的可移动台。感光材料可以沉积在顶表面上，并且掩模可以放置在感光材料上。具有顶部，一个或多个柔性侧面和透明基底的容器构造成邻近掩模放置。基部构造成相对于容器的顶部可移动。以这种方式，可移动台，感光材料和面罩可以与容器的底部一起移动。

9. 发明申请

US20060017650A1 Surface micromachined millimeter-scale RF system and method 失效
标题翻译：表面微加工毫米级RF系统和方法
公开(公告)号：US20060017650A1
公开(公告)日：2006-01-26
申请号：US11145911
申请日：2005-06-06
申请人： Mark Allen , Yong-Kyu Yoon , Jin-Woo Park , Yeun-Ho Joung , Florent Cros , Ioannis Papapolymerou , Emmanouil Tentzeris , Bo Pan
发明人： Mark Allen , Yong-Kyu Yoon , Jin-Woo Park , Yeun-Ho Joung , Florent Cros , Ioannis Papapolymerou , Emmanouil Tentzeris , Bo Pan
IPC分类号： H01Q9/30
CPC分类号： H01Q19/32 , H01Q9/0407 , H01Q9/30
摘要： A surface micromachined electromagnetically radiating antenna includes a coplanar waveguide on a ground plane coated substrate having a conductor path. The conductor path is coupled to a monopole conductor, which has a generally-cylindrical backbone erected vertically from the substrate and a metal layer deposited on the backbone at a predetermined thickness. The antenna may be fabricated by depositing an epoxy on the ground plane coated substrate to a predetermined depth and according to a pattern. The epoxy is exposed to an ultraviolet source that develops one or more columns according to the pattern. A seed layer of metal may be formed on the developed column. A conductive metal is electrodeposited over the column surface to produce the monopole antenna. Other antenna may be created by adding monopoles and/or conductive metal patches and/or strips that are positioned atop the monopoles and elevated from the substrate.
摘要翻译：表面微加工电磁辐射天线包括在具有导体路径的接地平面涂覆的基板上的共面波导。导体路径耦合到单极导体，单极导体具有从衬底垂直竖立的通常为圆柱形的主体和以预定厚度沉积在骨架上的金属层。天线可以通过在接地平面涂覆的基底上沉积环氧树脂至预定深度并根据图案来制造。环氧树脂暴露于根据图案形成一个或多个柱的紫外线源。可以在显影柱上形成金属种子层。将导电金属电沉积在柱表面上以产生单极天线。可以通过添加单极子和/或定位在单极子顶部并从衬底升高的导电金属贴片和/或条带来产生其它天线。

10. 发明授权

US09330820B2 Method for making electrically conductive three-dimensional structures 有权
标题翻译：制造导电三维结构的方法
公开(公告)号：US09330820B2
公开(公告)日：2016-05-03
申请号：US13873961
申请日：2013-04-30
申请人： Mark G. Allen , Seong-O Choi , Jung-Hwan Pauk , Xiaosong Wu , Yanzhu Zhao , Yong-Kyu Yoon , Swaminathan Rajaraman
发明人： Mark G. Allen , Seong-O Choi , Jung-Hwan Pauk , Xiaosong Wu , Yanzhu Zhao , Yong-Kyu Yoon , Swaminathan Rajaraman
IPC分类号： H01B13/00 , A61B5/00 , A61M37/00 , H05K1/02 , C25D1/00 , C25D1/10 , C25D5/02 , A61N1/32 , H05K3/40 , H05K3/20
CPC分类号： B32B3/30 , A61B5/685 , A61B2562/125 , A61M37/0015 , A61M2037/0053 , A61N1/327 , C25D1/003 , C25D1/10 , C25D5/022 , H01B13/00 , H05K1/02 , H05K3/20 , H05K3/4007 , H05K2201/0367 , H05K2201/09045 , H05K2201/09118 , H05K2203/0113 , Y10T428/2958 , Y10T428/298
摘要： Methods are provided for fabricating three-dimensional electrically conductive structures. Three-dimensional electrically conductive microstructures are also provided. The method may include providing a mold having at least one microdepression which defines a three-dimensional structure; filling the microdepression of the mold with at least one substrate material; molding the at least one substrate material to form a substrate; and depositing and patterning of at least one electrically conductive layer either during the molding process or subsequent to the molding process to form an electrically conductive structure. In one embodiment, the three-dimensional electrically conductive microstructure comprises an electrically functional microneedle array comprising two or more microneedles, each including a high aspect ratio, polymeric three dimensional substrate structure which is at least substantially coated by an electrically conductive layer.
摘要翻译：提供用于制造三维导电结构的方法。还提供三维导电微结构。该方法可以包括提供具有限定三维结构的至少一个微压缩的模具; 用至少一种基底材料填充模具的微压缩; 模制所述至少一种基底材料以形成基底; 以及在模制过程期间或在模制过程之后沉积和图案化至少一个导电层以形成导电结构。在一个实施例中，三维导电微结构包括电功能微针阵列，其包括两个或更多个微针，每个微针包括高纵横比，至少基本上被导电层涂覆的聚合物三维衬底结构。

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