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1. 发明授权

US09236172B2 Conductor pattern and coil parts having the same 有权
标题翻译：导体图案和具有相同的线圈部件
公开(公告)号：US09236172B2
公开(公告)日：2016-01-12
申请号：US13420540
申请日：2012-03-14
申请人： Sang Moon Lee , Yong Suk Kim , Jeong Bok Kwak , Young Seuck Yoo , Sung Kwon Wi
发明人： Sang Moon Lee , Yong Suk Kim , Jeong Bok Kwak , Young Seuck Yoo , Sung Kwon Wi
IPC分类号： H01F5/00 , H01F27/28
CPC分类号： H01F5/003
摘要： A conductor pattern of a coil part formed in a spiral shape on a magnetic substrate, which includes: a primary conductor pattern; and a secondary conductor pattern formed on the primary conductor pattern. The primary conductor pattern is formed to have a longitudinal section including a first horizontal portion and a first vertical portion electrically connected to an end portion of one surface of the first horizontal portion. The secondary conductor pattern is formed to have a longitudinal section including a second horizontal portion corresponding to the first horizontal portion and a second vertical portion electrically connected to an end portion of one surface of the second horizontal portion.
摘要翻译：在磁性基板上形成为螺旋状的线圈部的导体图案，其包括：主导体图案; 以及形成在主导体图案上的次级导体图案。主导体图案形成为具有电连接到第一水平部分的一个表面的端部的第一水平部分和第一垂直部分的纵向部分。次级导体图案形成为具有包括对应于第一水平部分的第二水平部分的纵向部分和与第二水平部分的一个表面的端部电连接的第二垂直部分。

2. 发明授权

US08704265B2 Light emitting device package and lighting apparatus using the same 有权
标题翻译：发光装置封装及使用其的照明装置
公开(公告)号：US08704265B2
公开(公告)日：2014-04-22
申请号：US12675582
申请日：2008-08-27
申请人： Bu Wan Seo , Sung Woo Kim , Hoon Hur , Yong Suk Kim
发明人： Bu Wan Seo , Sung Woo Kim , Hoon Hur , Yong Suk Kim
IPC分类号： H01L33/00 , H01L29/40 , H01L29/207 , H01L23/48
CPC分类号： H01L25/0753 , H01L33/50 , H01L2224/48137 , H01L2224/48227 , H05B33/0821 , H05B33/0857 , Y02B20/341 , H01L2224/48091 , H01L2924/00014
摘要： In one embodiment, the light emitting device package includes a package body, electrodes attached to the package body, and at least two light emitting devices electrically connected to the electrodes. Each light emitting device emits light of a different color from the other light emitting devices. A protective layer is formed over the at least two light emitting devices, and a phosphor layer formed over the protective layer. Other embodiments include other structures such a individual phosphor layers on each light emitting device. And, a light apparatus including a package may include a single driver driving the light emitting devices of the package.
摘要翻译：在一个实施例中，发光器件封装包括封装主体，附接到封装体的电极以及电连接到电极的至少两个发光器件。每个发光装置发射与其他发光装置不同颜色的光。在至少两个发光器件上形成保护层，并且形成在保护层上方的荧光体层。其他实施例包括其他结构，例如每个发光器件上的各个荧光体层。并且，包括封装的光装置可以包括驱动封装的发光器件的单个驱动器。

3. 发明授权

US08568014B2 Back-light unit 有权
标题翻译：背光单元
公开(公告)号：US08568014B2
公开(公告)日：2013-10-29
申请号：US13003056
申请日：2008-11-18
申请人： Yong Suk Kim
发明人： Yong Suk Kim
IPC分类号： G09F13/10
CPC分类号： G02F1/133608 , G02F2201/54
摘要： A back-light unit is disclosed. An object of the present invention is to provide a back-light unit that is able to improve structural stability and mass-production efficiency. The back-light unit includes a circuit substrate comprising a plurality of light sources arranged thereon, an optical sheet positioned on the circuit substrate, a plurality of supporting parts arranged between the circuit substrate and the optical sheet to support the optical sheet, which are installed to the circuit substrate by using surface-mount technology (SMT).
摘要翻译：公开了背光单元。本发明的目的是提供能够提高结构稳定性和批量生产效率的背光单元。背光单元包括：电路基板，包括布置在其上的多个光源;位于电路基板上的光学片;布置在电路基板和光学片之间的多个支撑部件，用于支撑光学片，通过使用表面贴装技术（SMT）到电路基板。

4. 发明申请

US20130169399A1 THIN FILM-TYPE COIL COMPONENT AND METHOD OF FABRICATING THE SAME 有权
公开(公告)号：US20130169399A1
公开(公告)日：2013-07-04
申请号：US13417832
申请日：2012-03-12
申请人： Young Seuck YOO , Young Ghyu Ahn , Yong Suk Kim , Sung Kwon Wi , Sang Soo Park , Kang Heon Hur
发明人： Young Seuck YOO , Young Ghyu Ahn , Yong Suk Kim , Sung Kwon Wi , Sang Soo Park , Kang Heon Hur
IPC分类号： H01F27/28 , B05D5/12
CPC分类号： H01F27/2804 , H01F17/0013 , H01F27/29 , H01F41/042 , H01F2027/2809
摘要： There is provided a thin film-type coil component having a size equal to or less than 0806 and including a ceramic main body, external electrodes including a plurality of first external electrodes formed on one surface of the ceramic main body and a plurality of second external electrodes formed on the other surface facing one surface of the ceramic main body, and a coil unit including a plurality of coil layers stacked in the ceramic main body, thereby obtaining low direct current (DC) resistance.

5. 发明申请

US20120145211A1 THERMOELECTRIC DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：热电装置及其制造方法
公开(公告)号：US20120145211A1
公开(公告)日：2012-06-14
申请号：US13305251
申请日：2011-11-28
申请人： Sung Ho LEE , Dong Hyeok Choi , Yong Suk Kim
发明人： Sung Ho LEE , Dong Hyeok Choi , Yong Suk Kim
IPC分类号： H01L35/28 , H01L35/34
CPC分类号： H01L35/32 , H01L35/34
摘要： The present invention provides a thermoelectric device including: thermoelectric sheets made of a thermoelectric semiconductor and laminated in multi-layers; and a metal sheet interposed between the thermoelectric sheets, and a method of manufacturing the same.
摘要翻译：本发明提供一种热电装置，包括：由热电半导体制成的层叠多层的热电片; 以及置于热电板之间的金属片及其制造方法。

6. 发明申请

US20120049314A1 Thermoelectric module and method for fabricating the same 审中-公开
标题翻译：热电模块及其制造方法
公开(公告)号：US20120049314A1
公开(公告)日：2012-03-01
申请号：US13137503
申请日：2011-08-22
申请人： Yong Suk Kim , Sung Ho Lee , Young Soo Oh , Tae Kon Koo
发明人： Yong Suk Kim , Sung Ho Lee , Young Soo Oh , Tae Kon Koo
IPC分类号： H01L31/058 , H01L31/18
CPC分类号： H01L35/34 , H01L35/32
摘要： The present invention relates to a thermoelectric module. The thermoelectric module includes a first substrate and a second substrate opposed to each other and arranged to be separated from each other, a first electrode and a second electrode arranged in the inside surfaces of the first and the second substrates, respectively, a thermoelectric device inserted between the first and the second electrodes and electrically connected to the first and the second electrodes; and an elastic member filled between the first and the second substrates.
摘要翻译：本发明涉及一种热电模块。热电模块包括彼此相对并且彼此分离的第一基板和第二基板，分别布置在第一和第二基板的内表面中的第一电极和第二电极，插入的热电装置在第一和第二电极之间并且电连接到第一和第二电极; 以及填充在第一和第二基板之间的弹性构件。

7. 发明授权

US08106306B2 Ceramic multi-layer circuit substrate and manufacturing method thereof 有权
标题翻译：陶瓷多层电路基板及其制造方法
公开(公告)号：US08106306B2
公开(公告)日：2012-01-31
申请号：US12405729
申请日：2009-03-17
申请人： Won Hee Yoo , Byeung Gyu Chang , Taek Jung Lee , Yong Suk Kim
发明人： Won Hee Yoo , Byeung Gyu Chang , Taek Jung Lee , Yong Suk Kim
IPC分类号： H05K1/00
CPC分类号： H05K3/4629 , B32B18/00 , C04B37/005 , C04B2237/04 , C04B2237/32 , C04B2237/52 , C04B2237/562 , C04B2237/565 , C04B2237/595 , C04B2237/62 , C04B2237/68 , C04B2237/704 , C04B2237/708 , H05K1/0306 , H05K3/1291 , H05K3/4617 , H05K2201/0195 , H05K2201/096 , H05K2201/10378 , H05K2203/1126 , H05K2203/1476
摘要： Provided is a method of manufacturing a ceramic multi-layer circuit substrate. A plurality of ceramic blocks, in each of which one or more ceramic green sheets having via-electrodes are layered one atop the other, are formed and are then fired. The fired ceramic blocks are aligned with each other. One or more bonding green sheets each having bonding electrodes in positions corresponding to the via-electrodes of the ceramic blocks are prepared. Each of the bonding green sheets is interposed between a pair of the ceramic blocks opposing each other. The ceramic blocks and the bonding green sheets are bonded and are then fired.
摘要翻译：提供一种制造陶瓷多层电路基板的方法。形成多个陶瓷块，每个陶瓷块中的一个或多个具有通孔电极的陶瓷生片分别彼此层叠，然后烧制。烧制的陶瓷块彼此对准。制备一个或多个接合生片，每个接合生片具有与陶瓷块的通孔电极对应的位置的接合电极。每个接合生片被插入在彼此相对的一对陶瓷块之间。陶瓷块和接合生片结合，然后烧制。

8. 发明申请

US20110148447A1 MULTILAYER CERAMIC SUBSTRATE AND PROBE BOARD USING PILLAR-TYPE CONDUCTOR AND FABRICATING METHODS OF THE SAME 审中-公开
标题翻译：多层陶瓷基板和探针板使用支柱导体及其制作方法
公开(公告)号：US20110148447A1
公开(公告)日：2011-06-23
申请号：US12836955
申请日：2010-07-15
申请人： Won Hee YOO , Byeung Gyu Chang , Yong Suk Kim
发明人： Won Hee YOO , Byeung Gyu Chang , Yong Suk Kim
IPC分类号： G01R1/067 , C04B35/74 , H05K1/11
CPC分类号： B32B18/00 , C04B35/63436 , C04B35/63456 , C04B37/026 , C04B2237/04 , C04B2237/12 , C04B2237/32 , C04B2237/40 , C04B2237/52 , C04B2237/592 , C04B2237/62 , C04B2237/68 , C04B2237/72 , G01R1/06711 , G01R3/00 , H05K3/4007 , H05K3/4046 , H05K3/4061 , H05K3/4629 , H05K2201/0367 , H05K2203/025
摘要： There are provided a multilayer ceramic substrate and a probe board formed using a pillar-type conductor formed by including preparing a ceramic sheet having at least one through hole; filling the inside of the through hole with a conductive material; firing the ceramic sheet so that the conductive material is fired to form a pillar-type conductor; and removing the ceramic sheet so that the pillar-type conductor remains, and fabricating methods of the same. The multilayer ceramic substrate and the probe board use the pillar-type conductor that can fill the unfilled region formed within the ceramic sintered body, such that the electrical characteristics and surface flatness thereof are improved. In addition, the multilayer ceramic substrate and the probe board formed by using the pillar-type conductor with the improved adhesion and electrical characteristics between the ceramic sintered body and the connecting pad, and the fabricating methods of the same are provided.
摘要翻译：提供了一种多层陶瓷基板和使用柱状导体形成的探针板，所述柱状导体通过包括制备具有至少一个通孔的陶瓷片而形成; 用导电材料填充通孔的内部; 烧制陶瓷片，使得导电材料被烧制以形成柱状导体; 并且去除陶瓷片以使柱状导体残留，并且制造其方法。多层陶瓷基板和探针板使用可以填充陶瓷烧结体内形成的未填充区域的柱状导体，使得其电特性和表面平坦性得到改善。此外，提供了通过使用具有改善的陶瓷烧结体和连接焊盘之间的粘合性和电特性的柱状导体形成的多层陶瓷基板和探针板及其制造方法。

9. 发明申请

US20100300733A1 Multilayer ceramic board and manufacturing method thereof 审中-公开
标题翻译：多层陶瓷板及其制造方法
公开(公告)号：US20100300733A1
公开(公告)日：2010-12-02
申请号：US12458780
申请日：2009-07-22
申请人： Yong Suk Kim , Byeung Gyu Chang , Won Hee Yoo , Yong Soo Oh
发明人： Yong Suk Kim , Byeung Gyu Chang , Won Hee Yoo , Yong Soo Oh
IPC分类号： H05K1/09 , B05D5/12 , B32B38/00
CPC分类号： H05K3/28 , C04B37/006 , C04B2237/125 , C04B2237/365 , C04B2237/62 , H05K1/0269 , H05K1/0306 , H05K1/113 , H05K3/108 , H05K3/388 , H05K3/4629 , H05K2201/0112 , H05K2201/0175 , H05K2201/0179 , H05K2201/096 , H05K2201/09918 , H05K2203/1383 , H05K2203/166
摘要： The present invention relates to a multilayer ceramic board and manufacturing method thereof. The multilayer ceramic board includes: a ceramic stacked structure in which multiple ceramic layers are stacked and interconnected to one another through vias; diffused reflection preventing patterns which expose the vias provided on each of the uppermost ceramic layer and the lowermost ceramic layer, and are disposed on each of a top surface and a bottom surface of the ceramic stacked structure; and contact pads which are electrically connected to the vias exposed by the diffused reflection preventing patterns.
摘要翻译：本发明涉及一种多层陶瓷板及其制造方法。多层陶瓷板包括：陶瓷层叠结构，其中多个陶瓷层通过通孔彼此堆叠并彼此互连; 扩散反射防止图案，其暴露设置在最上层陶瓷层和最下层陶瓷层中的每一个上的通孔，并且设置在陶瓷堆叠结构的顶表面和底表面中的每一个上; 以及电连接到由扩散反射防止图案暴露的通孔的接触焊盘。

10. 发明授权

US07689753B2 Method of operating wireless USB apparatus by receiving operation state information and wireless USB apparatus using the same 失效
标题翻译：通过接收操作状态信息来操作无线USB设备的方法和使用其的无线USB设备
公开(公告)号：US07689753B2
公开(公告)日：2010-03-30
申请号：US11598747
申请日：2006-11-14
申请人： Dong Won Kwak , Yong Suk Kim , Chang Mo Chung
发明人： Dong Won Kwak , Yong Suk Kim , Chang Mo Chung
IPC分类号： G06F13/14
CPC分类号： H04W48/16 , H04W28/26 , H04W48/08 , H04W88/04 , H04W88/06 , H04W92/02
摘要： A method of operating a wireless universal serial bus (USB) apparatus and the wireless USB apparatus using the same. The method including: receiving operation state information from a neighboring wireless USB apparatus in a beacon period (BP); the wireless USB apparatus, which is operating as a host in a first cluster by using the operation state information, identifying a distributed reservation protocol (DRP) corresponding to a second cluster; and the wireless USB apparatus, which is operating as the host in the first cluster, participating in the second cluster as a device by transmitting and receiving data in the DRP corresponding to the second cluster. Accordingly, the wireless USB apparatus which operates as a host may participate in a neighboring WUSB cluster as a device.
摘要翻译：一种操作无线通用串行总线（USB）设备的方法和使用其的无线USB设备。该方法包括：在信标周期（BP）中从相邻的无线USB设备接收操作状态信息; 所述无线USB装置通过使用所述操作状态信息在第一集群中作为主机运行，识别与第二集群对应的分布式预留协议（DRP）; 以及作为第一群集中的主机操作的无线USB装置，通过在对应于第二群集的DRP中发送和接收数据来作为设备参与第二群集。因此，作为主机操作的无线USB装置可以作为设备参与相邻的WUSB群集。

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