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1. 发明申请

US20120049314A1 Thermoelectric module and method for fabricating the same 审中-公开
标题翻译：热电模块及其制造方法
公开(公告)号：US20120049314A1
公开(公告)日：2012-03-01
申请号：US13137503
申请日：2011-08-22
申请人： Yong Suk Kim , Sung Ho Lee , Young Soo Oh , Tae Kon Koo
发明人： Yong Suk Kim , Sung Ho Lee , Young Soo Oh , Tae Kon Koo
IPC分类号： H01L31/058 , H01L31/18
CPC分类号： H01L35/34 , H01L35/32
摘要： The present invention relates to a thermoelectric module. The thermoelectric module includes a first substrate and a second substrate opposed to each other and arranged to be separated from each other, a first electrode and a second electrode arranged in the inside surfaces of the first and the second substrates, respectively, a thermoelectric device inserted between the first and the second electrodes and electrically connected to the first and the second electrodes; and an elastic member filled between the first and the second substrates.
摘要翻译：本发明涉及一种热电模块。热电模块包括彼此相对并且彼此分离的第一基板和第二基板，分别布置在第一和第二基板的内表面中的第一电极和第二电极，插入的热电装置在第一和第二电极之间并且电连接到第一和第二电极; 以及填充在第一和第二基板之间的弹性构件。

2. 发明申请

US20120024335A1 MULTI-LAYERED THERMOELECTRIC DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：多层热电装置及其制造方法
公开(公告)号：US20120024335A1
公开(公告)日：2012-02-02
申请号：US12947037
申请日：2010-11-16
申请人： Sung Ho LEE , Yong Suk Kim , Young Soo Oh , Tae Kon Koo , Sung Kwon Wi
发明人： Sung Ho LEE , Yong Suk Kim , Young Soo Oh , Tae Kon Koo , Sung Kwon Wi
IPC分类号： H01L35/16 , H01L21/18 , H01L35/20
CPC分类号： H01L35/34 , H01L35/32
摘要： The present invention provides a multi-layered thermoelectric device and a method of manufacturing the same. The method for manufacturing a multi-layered thermoelectric device includes the steps of: forming a P-type semiconductor and an N-type semiconductor in a sheet type by mixing thermoelectric semiconductor materials at a preset component ratio; cutting the sheets according to a preset specification of the thermoelectric device; stacking sheets which are made by mixing the thermoelectric semiconductor materials at a preset component ratio and are cut into the same size for each of them; and forming a final thermoelectric device by compressing the stacked sheets. By using the method, scattering phenomenon due to a short wavelength of phonon occurs at a boundary of each layer, which results in active scattering of phonon. Therefore, it is possible to expect an effect of improving a thermoelectric figure of merit of a thermoelectric device.
摘要翻译：本发明提供一种多层热电装置及其制造方法。制造多层热电装置的方法包括以下步骤：通过以预设的分量比混合热电半导体材料来形成片状的P型半导体和N型半导体; 根据热电装置的预设规格切割片材; 通过将热电半导体材料以预设的分量比混合而制成的片材，并将它们分别切成相同的尺寸; 并通过压缩堆叠的片材形成最终的热电装置。通过使用该方法，在每层的边界发生由于短波长的声子引起的散射现象，这导致声子的主动散射。因此，可以预期提高热电装置的热电性能值的效果。

3. 发明申请

US20120042921A1 Method for manufacturing thermoelectric module and thermoelectric module manufactured from the same 审中-公开
标题翻译：制造由其制造的热电模块和热电模块的方法
公开(公告)号：US20120042921A1
公开(公告)日：2012-02-23
申请号：US12926671
申请日：2010-12-02
申请人： Yong Suk Kim , Sung Ho Lee , Young Soo Oh , Tae Kon Koo
发明人： Yong Suk Kim , Sung Ho Lee , Young Soo Oh , Tae Kon Koo
IPC分类号： H01L35/20 , H05K13/00 , H01L35/22
CPC分类号： H01L35/34 , H01L35/08 , Y10T29/49002
摘要： The present invention provides a method for manufacturing a thermoelectric module and a thermoelectric module manufactured from the same. The method includes the steps of: forming each of first and second green laminates; forming first and second preliminary electrodes by printing a conductive paste on each of the first and second green laminates; disposing thermoelectric elements on any one of the first and second preliminary electrodes; stacking the first and second green laminates in such a manner that the thermoelectric elements are interposed between the first and second preliminary electrodes; and firing the stacked first and second green sheet laminates, thereby forming the first and second electrodes, and first and second ceramic substrates, and simultaneously bonding the first ceramic substrate to the first electrode, the first and second electrodes to the thermoelectric elements, and the second ceramic substrate to the second electrode.
摘要翻译：本发明提供一种制造由其制造的热电模块和热电模块的方法。该方法包括以下步骤：形成第一和第二生坯层压板中的每一个; 通过在所述第一和第二层压板中的每一个上印刷导电浆料来形成第一和第二初级电极; 在所述第一和第二预备电极中的任何一个上设置热电元件; 堆叠第一和第二生坯层压板，使得热电元件插入在第一和第二初级电极之间; 以及烧结堆叠的第一和第二生片层压板，从而形成第一和第二电极以及第一和第二陶瓷衬底，并且同时将第一陶瓷衬底与第一电极，第一和第二电极接合到热电元件，并且第二陶瓷衬底到第二电极。

4. 发明申请

US20120023970A1 COOLING AND HEATING WATER SYSTEM USING THERMOELECTRIC MODULE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：使用热电模块的冷却和加热水系统及其制造方法
公开(公告)号：US20120023970A1
公开(公告)日：2012-02-02
申请号：US12947061
申请日：2010-11-16
申请人： Sung Ho Lee , Yong Suk Kim , Young Soo Oh , Tae Kon Koo , Sung Kwon Wi
发明人： Sung Ho Lee , Yong Suk Kim , Young Soo Oh , Tae Kon Koo , Sung Kwon Wi
IPC分类号： F25B21/02 , H05K13/00
CPC分类号： F25B21/02 , F24H1/142 , Y10T29/49002
摘要： Disclosed herein are a cooling and heating water system using a thermoelectric module and a method of manufacturing the same. The cooling and heating water system using a thermoelectric module includes first and second substrates disposed to be spaced apart from each other, while facing each other; a cooling water line formed in the first substrate so as to flow cooling water therethrough; a heating water line formed in the second substrate so as to flow heating water therethrough; first and second insulating layers disposed on the inner side surfaces of the first and second substrates, respectively; and a thermoelectric device interposed between the first and second insulating layers, whereby it is possible to variously control a temperature of drinking water without generating noise by using the thermoelectric module in cooling the drinking water.
摘要翻译：本文公开了使用热电模块的冷却和加热水系统及其制造方法。使用热电模块的冷却和加热水系统包括彼此相对设置的彼此间隔开的第一和第二基板; 在第一基板上形成冷却水线，以使冷却水流过其中; 在第二基板上形成的加热水线，使加热水通过其中; 分别设置在第一和第二基板的内侧表面上的第一和第二绝缘层; 以及插入在第一绝缘层和第二绝缘层之间的热电装置，由此通过在冷却饮用水中使用热电模块，可以不产生噪音来不同地控制饮用水的温度。

5. 发明申请

US20110259018A1 Thermoelectric module and method for manufacturing the same 审中-公开
标题翻译：热电模块及其制造方法
公开(公告)号：US20110259018A1
公开(公告)日：2011-10-27
申请号：US12805142
申请日：2010-07-14
申请人： Sung Ho Lee , Yong Suk Kim , Tae Kon Koo , Young Soo Oh , Sung Kwon Wi
发明人： Sung Ho Lee , Yong Suk Kim , Tae Kon Koo , Young Soo Oh , Sung Kwon Wi
IPC分类号： F25B21/02 , H01R43/00
CPC分类号： F25B21/02 , Y10T29/49117
摘要： Disclosed herein are a thermoelectric module including a first substrate and a second substrate that are opposite to each other and spaced from each other; first and second electrodes that are disposed on the inner side surfaces of the first and second substrates, respectively; and a thermoelectric element that is interposed between the first and second electrodes and is electrically bonded to the first and second electrodes, wherein at least any one of the first and second substrates has an insulating layer disposed on one surface and a fluid flowing line for moving a fluid transferring heat therein, and a method for manufacturing the same.
摘要翻译：本文公开了一种包括彼此相对并且彼此间隔开的第一基板和第二基板的热电模块; 分别设置在第一和第二基板的内侧表面上的第一和第二电极; 以及热电元件，其插入在所述第一和第二电极之间并电连接到所述第一和第二电极，其中所述第一和第二基板中的至少任一个具有设置在一个表面上的绝缘层和用于移动的流体流动线在其中传热的流体及其制造方法。

6. 发明申请

US20110252814A1 Thermal insulator for construction using thermoelectric module 审中-公开
标题翻译：使用热电模块的建筑用绝热体
公开(公告)号：US20110252814A1
公开(公告)日：2011-10-20
申请号：US12805143
申请日：2010-07-14
申请人： Sung Ho Lee , Yong Suk Kim , Tae Kon Koo , Young Soo Oh , Sung Kwon Wi
发明人： Sung Ho Lee , Yong Suk Kim , Tae Kon Koo , Young Soo Oh , Sung Kwon Wi
IPC分类号： F25B21/02
CPC分类号： E04B1/74
摘要： The present invention provides a thermal insulator for construction including: a thermoelectric module inserted in a wall or floor of a building and including a plurality of thermoelectric elements; a power supply module for supplying power to the thermoelectric module; and a power control module for controlling size and polarity of the power supplied to the thermoelectric module from the power supply module. This thermal insulator for construction can provide much better thermal insulation performance in comparison with a conventional thermal insulator, and it is possible to reduce thickness of the wall or floor in comparison with when using the conventional thermal insulator since the thermoelectric element has very small size. Further, it is possible to implement a cooling or heating effect only by changing polarity and size of applied current.
摘要翻译：本发明提供了一种用于结构的绝热体，包括：热电模块，其插入建筑物的墙壁或地板中并包括多个热电元件; 用于向所述热电模块供电的电源模块; 以及功率控制模块，用于控制从电源模块供应到热电模块的功率的大小和极性。与传统的隔热体相比，这种用于结构的热绝缘体可以提供更好的隔热性能，与使用常规热绝缘体相比，可以减小壁或底板的厚度，因为热电元件具有非常小的尺寸。此外，仅通过改变所施加的电流的极性和尺寸可以实现冷却或加热效果。

7. 发明申请

US20120049315A1 Thermoelectric module and method for fabricating the same 审中-公开
标题翻译：热电模块及其制造方法
公开(公告)号：US20120049315A1
公开(公告)日：2012-03-01
申请号：US13137545
申请日：2011-08-24
申请人： Yong Suk Kim , Sung Ho Lee , Yong Soo Oh , Tae Kon Koo
发明人： Yong Suk Kim , Sung Ho Lee , Yong Soo Oh , Tae Kon Koo
IPC分类号： H01L31/058 , H01L31/18
CPC分类号： H01L35/32 , H01L35/34
摘要： The present invention provides a thermoelectric module. The thermoelectric module includes a first substrate and a second substrate opposed to each other and arranged to be separated from each other, a first electrode and a second electrode arranged in an inside surface of the first and the second substrates, respectively, a thermoelectric device inserted between the first and the second electrodes and electrically connected to the first and the second electrodes and a hybrid filler inserted between the first substrate and the second substrate and provided with a high temperature part filler adjacent to a substrate at a side of a high temperature end to absorb heat among the first substrate and the second substrate and a low temperature part filler adjacent to a substrate at a side of a low temperature end to discharge heat.
摘要翻译：本发明提供一种热电模块。热电模块包括彼此相对并且彼此分离的第一基板和第二基板，分别布置在第一和第二基板的内表面中的第一电极和第二电极，插入的热电装置在第一和第二电极之间并且电连接到第一和第二电极以及插入在第一基板和第二基板之间的混合填料，并且在高温端的一侧设置有与基板相邻的高温部件填料以在第一基板和第二基板之间吸收热量和在低温端侧与基板相邻的低温部件填料以放热。

8. 发明申请

US20110290293A1 Thermoelectric module and method for manufacturing the same 审中-公开
标题翻译：热电模块及其制造方法
公开(公告)号：US20110290293A1
公开(公告)日：2011-12-01
申请号：US12923079
申请日：2010-08-31
申请人： Yong Suk Kim , Sung Ho Lee , Tae Kon Koo , Yong Soo Oh
发明人： Yong Suk Kim , Sung Ho Lee , Tae Kon Koo , Yong Soo Oh
IPC分类号： H01L35/02 , H01L35/34 , H01L21/02
CPC分类号： H01L35/08
摘要： Disclosed herein is a thermoelectric module. The thermoelectric module includes: first and second substrates that are disposed to be separated from each other, facing each other and includes first and second grooves each formed on inner sides thereof; first and second electrodes that are received in the first and second grooves, respectively; and a thermoelectric device that is interposed between the first and second electrodes and is electrically bonded to the first and second electrodes. As a result, the present invention provide a thermoelectric module and a method for manufacturing the same capable of improving the figure of merit and reliability of the thermoelectric module.
摘要翻译：这里公开了一种热电模块。热电模块包括：第一和第二基板，被设置成彼此分离，彼此面对，并且包括各自形成在其内侧的第一和第二槽; 分别容纳在第一和第二凹槽中的第一和第二电极; 以及插入在第一和第二电极之间并且电连接到第一和第二电极的热电装置。结果，本发明提供一种能够提高热电模块的品质因数和可靠性的热电模块及其制造方法。

9. 发明授权

US08012778B2 LED package and fabricating method thereof 有权
标题翻译： LED封装及其制造方法
公开(公告)号：US08012778B2
公开(公告)日：2011-09-06
申请号：US12259576
申请日：2008-10-28
申请人： Yong Suk Kim , Young Soo Oh , Hyoung Ho Kim , Taek Jung Lee , Seog Moon Choi
发明人： Yong Suk Kim , Young Soo Oh , Hyoung Ho Kim , Taek Jung Lee , Seog Moon Choi
IPC分类号： H01L21/00
CPC分类号： H01L33/642 , H01L33/486 , H01L33/641 , H01L2224/16225
摘要： The invention provides an LED package capable of effectively releasing heat emitted from an LED chip out of the package and a fabrication method thereof. For this purpose, at least one groove is formed on an underside surface of the substrate to package the LED chip and the groove is filled with carbon nanotube material. In the LED package, a substrate having at least one groove on the underside surface is prepared. A plurality of electrodes are formed on a top surface of the substrate. Also, at least the one LED chip is mounted over the substrate to have both terminals electrically connected to the upper electrodes. In addition, carbon nanotube filler is filled in the groove of the substrate.
摘要翻译：本发明提供一种LED封装，其能够有效地从LED封装中散发从LED芯片发出的热量及其制造方法。为此，在基板的下侧表面上形成至少一个凹槽以封装LED芯片，并且凹槽填充有碳纳米管材料。在LED封装中，准备在底面上具有至少一个沟槽的衬底。多个电极形成在基板的顶表面上。此外，至少将一个LED芯片安装在基板上，以使两个端子电连接到上电极。此外，碳纳米管填料填充在基板的槽中。

10. 发明授权

US07453093B2 LED package and fabricating method thereof 有权
标题翻译： LED封装及其制造方法
公开(公告)号：US07453093B2
公开(公告)日：2008-11-18
申请号：US11489578
申请日：2006-07-20
申请人： Yong Suk Kim , Young Soo Oh , Hyoung Ho Kim , Taek Jung Lee , Seog Moon Choi
发明人： Yong Suk Kim , Young Soo Oh , Hyoung Ho Kim , Taek Jung Lee , Seog Moon Choi
IPC分类号： H01L27/15 , H01L23/34
CPC分类号： H01L33/642 , H01L33/486 , H01L33/641 , H01L2224/16225
摘要： The invention provides an LED package capable of effectively releasing heat emitted from an LED chip out of the package and a fabrication method thereof. For this purpose, at least one groove is formed on an underside surface of the substrate to package the LED chip and the groove is filled with carbon nanotube material. In the LED package, a substrate having at least one groove on the underside surface is prepared. A plurality of electrodes are formed on a top surface of the substrate. Also, at least the one LED chip is mounted over the substrate to have both terminals electrically connected to the upper electrodes. In addition, carbon nanotube filler is filled in the groove of the substrate.
摘要翻译：本发明提供一种LED封装，其能够有效地从LED封装中散发从LED芯片发出的热量及其制造方法。为此，在基板的下侧表面上形成至少一个凹槽以封装LED芯片，并且凹槽填充有碳纳米管材料。在LED封装中，准备在底面上具有至少一个沟槽的衬底。多个电极形成在基板的顶表面上。此外，至少将一个LED芯片安装在基板上，以使两个端子电连接到上电极。此外，碳纳米管填料填充在基板的槽中。

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