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    • 5. 发明授权
    • Multi-zone illuminator for rapid thermal processing
    • 用于快速热处理的多区域照明器
    • US5937142A
    • 1999-08-10
    • US678321
    • 1996-07-11
    • Mehrdad M. MoslehiYong Jin LeeAhmad KermaniWilliam J. Messner
    • Mehrdad M. MoslehiYong Jin LeeAhmad KermaniWilliam J. Messner
    • C23C16/48C30B25/10C30B25/14H01L21/00A21B2/00C23C16/00
    • H01L21/67248C23C16/481C30B25/105C30B25/14H01L21/67115
    • A system for rapid thermal processing of a substrate in a process chamber while measuring and controlling the temperature at the substrate to establish substantially uniform substrate temperature in real time. The system includes an axisymmetrical multi-zone illuminator having a plurality of substantially concentric rings of heating lamps to direct optical power toward said substrate, a fluid cooled optical reflector facing the substrate frontside and having a relatively high optical reflectivity. The system also includes a multizone temperature measurement system having a plurality of pyrometry sensors coupled to said multi-zone illuminator, a system for real-time measurement and compensation of substrate emissivity and illuminator lamp light interference effects, and a multi-variable temperature controller for providing multi-zone real-time temperature control. The system also incorpotates a plurality of illuminator lamp power supplies.
    • 一种用于在处理室中快速热处理衬底的系统,同时测量和控制衬底上的温度以实时实现基本上均匀的衬底温度。 该系统包括轴对称多区域照明器,其具有多个基本上同心的加热灯环,以将光焦度引导到所述衬底,面向衬底前侧并具有相对高的光学反射率的流体冷却的光学反射器。 该系统还包括多区域温度测量系统,其具有耦合到所述多区域照明器的多个高温测量传感器,用于实时测量和补偿衬底发射率和照明器灯光干涉效应的系统,以及多变量温度控制器 提供多区域实时温度控制。 该系统还包括多个照明灯电源。
    • 6. 发明授权
    • Method and apparatus for thin film deposition using an active shutter
    • 使用主动快门进行薄膜沉积的方法和装置
    • US06444103B1
    • 2002-09-03
    • US09662575
    • 2000-09-15
    • Mehrdad M. MoslehiYong Jin LeeCecil J. DavisAjit P. Paranjpe
    • Mehrdad M. MoslehiYong Jin LeeCecil J. DavisAjit P. Paranjpe
    • C23C1434
    • H01J37/3447C23C14/3464C23C14/564
    • Material is deposited from an active shutter onto a substrate located in a processing chamber housing with a shutter target coupled to a shutter target assembly. A first target assembly located in the housing supports a target for physical-vapor deposition of a first material onto the substrate. A shutter is selectively moveable to extend into a closed or activated position and to retract into an open position. The shutter target assembly is coupled to the shutter such that when the shutter is in the closed position, the shutter target assembly is positioned to allow deposition of material from the shutter target onto the substrate. When the shutter is in the open position, the first target is positioned to deposit material onto the substrate. Alternating layers of materials may be deposited by the shutter target and first target by cycling the shutter between an open position and a closed position.
    • 材料从活动快门沉积到位于处理室壳体中的基板上,其中快门目标件联接到快门目标组件。 位于壳体中的第一目标组件支撑用于将第一材料物理 - 气相沉积到衬底上的靶。 快门选择性地可移动以延伸到关闭或启动位置并缩回到打开位置。 快门目标组件联接到快门,使得当快门处于关闭位置时,快门目标组件被定位成允许材料从快门目标物体沉积到基板上。 当快门处于打开位置时,第一目标定位成将材料沉积到基板上。 通过在打开位置和关闭位置之间循环活门,可以通过快门目标和第一目标来沉积材料的交替层。
    • 7. 发明授权
    • High-performance energy transfer system and method for thermal processing applications
    • 高性能能量转移系统和热处理应用方法
    • US06188044B1
    • 2001-02-13
    • US09067142
    • 1998-04-27
    • Yong Jin LeeMehrdad M. MoslehiJalil KamaliSergey Belikov
    • Yong Jin LeeMehrdad M. MoslehiJalil KamaliSergey Belikov
    • F27B514
    • H01L21/67115C23C16/481
    • An apparatus and method supports thermal processing of a microelectronic device such as a semiconductor chip in a substrate by heating the substrate with secondary radiation from an energy transfer device 40, which has a first set of energy transfer regions comprised of an emissive and thermally conductive material, and a second set of thermally insulating regions comprised of a reduced emissivity and reduced thermal conductivity material or free space. A multi-zone radiant energy source 30 provides radiative energy to energy transfer device 40, with a process controller 36, preferably a multi-zone controller, altering the amount of energy provided by each heat zone associated with each emissive region of energy transfer device 40. Sensors detect the thermal energy level of each energy transfer region to allow controller 36 to adjust the secondary radiation emitted by each region in real time, resulting in a predetermined and controlled distribution of thermal energy on substrate 20. Energy transfer device 40 can have plural emissive and thermally conductive concentric rings separated from each other by reduced emissivity and reduced thermal conductivity regions such as free space gaps 42. Alternatively, a solid plate 54 having an emissive coating or emissive surface 52 can have reduced emissivity and reduced conductivity isolation regions such as trenches 56 for defining the multi-zone high-emissivity and high thermal conductivity energy transfer regions.
    • 一种装置和方法通过用来自能量转移装置40的二次辐射加热衬底来支持诸如半导体芯片之类的微电子器件的热处理,该能量转移装置具有由发射和导热材料组成的第一组能量转移区 以及由减少的发射率和降低的热导率材料或自由空间组成的第二组热绝缘区域。 多区域辐射能源30向能量传递装置40提供辐射能,其中过程控制器36,优选多区域控制器,改变与能量传递装置40的每个发射区域相关联的每个加热区域提供的能量的量 传感器检测每个能量传递区域的热能级别,以允许控制器36实时地调整每个区域发射的次级辐射,从而导致基板20上预定和受控的热能分布。能量传递装置40可以具有多个 发射和导热的同心环通过降低的发射率和降低的热导率区域(例如自由空间间隙42)彼此分离。或者,具有发射涂层或发射表面52的固体板54可以具有降低的发射率和降低的电导率隔离区域,例如 用于定义多区高发射率和高导热性的沟槽56 ergy转移区域。
    • 8. 发明授权
    • Method for automated calibration of temperature sensors in rapid thermal
processing equipment
    • 快速热处理设备中温度传感器的自动校准方法
    • US6004029A
    • 1999-12-21
    • US680244
    • 1996-07-10
    • Mehrdad M. MoslehiYong Jin Lee
    • Mehrdad M. MoslehiYong Jin Lee
    • G01J5/10G01J5/52G01K1/14G01K15/00F27D11/00H01L21/02
    • G01K1/146G01J5/10G01J5/522G01K15/00
    • This invention presents an automatic calibration system and method for calibration of a substrate temperature sensor in a thermal processing equipment, such as a rapid thermal processing system. The calibration system includes a temperature-sensitive probe associated with the substrate temperature sensor to calibrate the substrate temperature sensor and an actuator to position the temperature-sensitive probe relative to the substrate during a calibration cycle. The actuator and temperature-sensitive probe of the automatic calibration system can be incorporated into the thermal processing equipment in order to maintain the thermal processing equipment cleanliness and integrity during a calibration cycle, and to allow rapid automated calibration. In the preferred embodiment of this invention, the temperature-sensitive probe and its actuator are implemented in the gas showerhead assembly of a rapid thermal processing system.
    • 本发明提出了一种用于在诸如快速热处理系统的热处理设备中校准衬底温度传感器的自动校准系统和方法。 校准系统包括与衬底温度传感器相关联的温度敏感探针以校准衬底温度传感器,以及在校准周期期间相对于衬底定位温度敏感探针的致动器。 自动校准系统的致动器和温度敏感探头可以并入热处理设备,以便在校准周期内保持热处理设备的清洁度和完整性,并允许快速自动校准。 在本发明的优选实施例中,温度敏感探针及其致动器被实现在快速热处理系统的气体喷头组件中。
    • 10. 发明授权
    • High-performance energy transfer method for thermal processing applications
    • 用于热处理应用的高性能能量传递方法
    • US06753272B1
    • 2004-06-22
    • US09669039
    • 2000-09-25
    • Yong Jin LeeMehrdad M. MoslehiJalil KamaliSergey Belikov
    • Yong Jin LeeMehrdad M. MoslehiJalil KamaliSergey Belikov
    • H01L21324
    • H01L21/67115C23C16/481
    • An apparatus and method supports thermal processing of a microelectronic device such as a semiconductor chip in a substrate by heating the substrate with secondary radiation from an energy transfer device 40, which has a first set of energy transfer regions comprised of an emissive and thermally conductive material, and a second set of thermally insulating regions comprised of a reduced emissivity and reduced thermal conductivity material or free space. A multi-zone-radiant energy source 30 provides radiative energy to energy transfer device 40, with a process controller 36, preferably a multi-zone controller, altering the amount of energy provided by each heat zone associated with each emissive region of energy transfer device 40. Sensors detect the thermal energy level of each energy transfer region to allow controller 36 to adjust the secondary radiation emitted by each region in real time, resulting in a predetermined and controlled distribution of thermal energy on substrate 20. Energy transfer device 40 can have plural emissive and thermally conductive concentric rings separated from each other by reduced emissivity and reduced thermal conductivity regions such as free space gaps 42. Alternatively, a solid plate 54 having an emissive coating or emissive surface 52 can have reduced emissivity and reduced conductivity isolation regions such as trenches 56 for defining the multi-zone high-emissivity and high thermal conductivity energy transfer regions.
    • 一种装置和方法通过用来自能量转移装置40的二次辐射加热衬底来支持诸如半导体芯片之类的微电子器件的热处理,该能量转移装置具有由发射和导热材料组成的第一组能量转移区 以及由减少的发射率和降低的热导率材料或自由空间组成的第二组热绝缘区域。 多区域辐射能量源30向能量传递装置40提供辐射能,其中过程控制器36,优选地,多区域控制器,改变与能量传递装置的每个发射区域相关联的每个加热区域提供的能量的量 传感器检测每个能量转移区域的热能水平,以允许控制器36实时地调整由每个区域发射的次级辐射,从而导致基板20上预定和受控的热能分布。能量传递装置40可具有 多个发射和导热的同心环通过降低的发射率和降低的热导率区域(例如自由空间间隙42)彼此分离。或者,具有发射涂层或发射表面52的固体板54可以具有降低的发射率和降低的电导率隔离区域, 作为用于限定多区高发射率和高热导率的沟槽56 ergy转移区域。