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1. 发明授权

US08436331B2 Memory device and method for manufacturing same 失效
标题翻译：存储器件及其制造方法
公开(公告)号：US08436331B2
公开(公告)日：2013-05-07
申请号：US12844374
申请日：2010-07-27
申请人： Yoko Iwakaji , Jun Hirota , Kyoichi Suguro , Moto Yabuki
发明人： Yoko Iwakaji , Jun Hirota , Kyoichi Suguro , Moto Yabuki
IPC分类号： H01L21/02
CPC分类号： H01L27/1021 , G11C13/0007 , G11C2213/71 , H01L27/2409 , H01L27/2481 , H01L45/04 , H01L45/1233 , H01L45/145 , H01L45/16 , H01L45/1675
摘要： According to one embodiment, a method for manufacturing a memory device is disclosed. The method includes forming a silicon diode. At least an upper portion of the silicon diode is made of a semiconductor material containing silicon and doped with impurity. The method includes forming a metal layer made of a metal on the silicon diode. The method includes forming a metal nitride layer made of a nitride of the metal on the metal layer. The method includes forming a resistance change film. In addition, the method includes reacting the metal layer with the silicon diode and the metal nitride layer by heat treatment to form an electrode film containing the metal, silicon, and nitrogen.
摘要翻译：根据一个实施例，公开了一种用于制造存储器件的方法。该方法包括形成硅二极管。至少硅二极管的上部由含有硅并掺杂杂质的半导体材料制成。该方法包括在硅二极管上形成由金属制成的金属层。该方法包括在金属层上形成由金属的氮化物制成的金属氮化物层。该方法包括形成电阻变化膜。此外，该方法包括通过热处理使金属层与硅二极管和金属氮化物层反应，以形成含有金属，硅和氮的电极膜。

2. 发明申请

US20110193049A1 MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME 失效
标题翻译：存储器件及其制造方法
公开(公告)号：US20110193049A1
公开(公告)日：2011-08-11
申请号：US12844374
申请日：2010-07-27
申请人： Yoko IWAKAJI , Jun Hirota , Kyoichi Suguro , Moto Yabuki
发明人： Yoko IWAKAJI , Jun Hirota , Kyoichi Suguro , Moto Yabuki
IPC分类号： H01L45/00 , H01L21/02
CPC分类号： H01L27/1021 , G11C13/0007 , G11C2213/71 , H01L27/2409 , H01L27/2481 , H01L45/04 , H01L45/1233 , H01L45/145 , H01L45/16 , H01L45/1675
摘要： According to one embodiment, a method for manufacturing a memory device is disclosed. The method includes forming a silicon diode. At least an upper portion of the silicon diode is made of a semiconductor material containing silicon and doped with impurity. The method includes forming a metal layer made of a metal on the silicon diode. The method includes forming a metal nitride layer made of a nitride of the metal on the metal layer. The method includes forming a resistance change film. In addition, the method includes reacting the metal layer with the silicon diode and the metal nitride layer by heat treatment to form an electrode film containing the metal, silicon, and nitrogen.
摘要翻译：根据一个实施例，公开了一种用于制造存储器件的方法。该方法包括形成硅二极管。硅二极管的至少上部由含有硅并掺杂杂质的半导体材料制成。该方法包括在硅二极管上形成由金属制成的金属层。该方法包括在金属层上形成由金属的氮化物制成的金属氮化物层。该方法包括形成电阻变化膜。此外，该方法包括通过热处理使金属层与硅二极管和金属氮化物层反应，以形成含有金属，硅和氮的电极膜。

3. 发明授权

US08609014B2 Template manufacturing method, semiconductor device manufacturing method and template 有权
标题翻译：模板制造方法，半导体器件制造方法和模板
公开(公告)号：US08609014B2
公开(公告)日：2013-12-17
申请号：US13150961
申请日：2011-06-01
申请人： Tsukasa Azuma , Tatsuhiko Higashiki , Kyoichi Suguro
发明人： Tsukasa Azuma , Tatsuhiko Higashiki , Kyoichi Suguro
IPC分类号： B29C67/20
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00
摘要： According to one embodiment, a template manufacturing method is a method for manufacturing a template for use in an imprint processing in which a pattern having irregularities are formed on a principal surface, and the pattern is brought into contact with a resist member formed on a substrate to be processed, to transfer the pattern to the resist member, the method including implanting charged particles at least into the bottoms of concave portions of the template.
摘要翻译：根据一个实施例，模板制造方法是用于制造在压印处理中使用的模板的方法，其中在主表面上形成具有凹凸的图案，并且图案与形成在基板上的抗蚀剂部件接触要被处理以将图案转印到抗蚀剂构件上，该方法包括将带电粒子至少注入到模板的凹部的底部中。

4. 发明授权

US08017466B2 Semiconductor device and manufacturing method for the same 失效
标题翻译：半导体器件及其制造方法相同
公开(公告)号：US08017466B2
公开(公告)日：2011-09-13
申请号：US12591162
申请日：2009-11-10
申请人： Kazuaki Nakajima , Kyoichi Suguro
发明人： Kazuaki Nakajima , Kyoichi Suguro
IPC分类号： H01L21/8238
CPC分类号： H01L21/823842 , H01L21/28079 , H01L29/4958 , H01L29/66545 , H01L29/6656 , H01L29/6659 , H01L29/7833 , Y10S438/976
摘要： In a semiconductor substrate on which are formed an N-type MOS transistor and a P-type MOS transistor, the gate electrode of the N-type MOS transistor comprises a tungsten film, which makes contact with a gate insulation film, and the gate electrode of the P-type MOS transistor comprises a tungsten film, which makes contact with a gate insulation film, and the concentration of carbon contained in the former tungsten film is less than the concentration of carbon contained in the latter tungsten film.
摘要翻译：在形成N型MOS晶体管和P型MOS晶体管的半导体衬底中，N型MOS晶体管的栅电极包括与栅极绝缘膜接触的钨膜和栅电极的P型MOS晶体管包括与栅极绝缘膜接触的钨膜，前者钨膜中所含的碳的浓度小于后者钨膜中所含的碳的浓度。

5. 发明申请

US20100062596A1 Semiconductor device and manufacturing method for the same 失效
标题翻译：半导体器件及其制造方法相同
公开(公告)号：US20100062596A1
公开(公告)日：2010-03-11
申请号：US12591162
申请日：2009-11-10
申请人： Kazuaki Nakajima , Kyoichi Suguro
发明人： Kazuaki Nakajima , Kyoichi Suguro
IPC分类号： H01L21/28
CPC分类号： H01L21/823842 , H01L21/28079 , H01L29/4958 , H01L29/66545 , H01L29/6656 , H01L29/6659 , H01L29/7833 , Y10S438/976
摘要： In a semiconductor substrate on which are formed an N-type MOS transistor and a P-type MOS transistor, the gate electrode of the N-type MOS transistor comprises a tungsten film, which makes contact with a gate insulation film, and the gate electrode of the P-type MOS transistor comprises a tungsten film, which makes contact with a gate insulation film, and the concentration of carbon contained in the former tungsten film is less than the concentration of carbon contained in the latter tungsten film.
摘要翻译：在形成N型MOS晶体管和P型MOS晶体管的半导体衬底中，N型MOS晶体管的栅电极包括与栅极绝缘膜接触的钨膜和栅电极的P型MOS晶体管包括与栅极绝缘膜接触的钨膜，前者钨膜中所含的碳的浓度小于后者钨膜中所含的碳的浓度。

6. 发明授权

US07667274B2 Semiconductor device and method of manufacturing the same 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US07667274B2
公开(公告)日：2010-02-23
申请号：US12071887
申请日：2008-02-27
申请人： Kazuaki Nakajima , Kyoichi Suguro
发明人： Kazuaki Nakajima , Kyoichi Suguro
IPC分类号： H01L29/45 , H01L29/78
CPC分类号： H01L21/76843 , H01L21/28518 , H01L21/76855 , H01L21/823814 , H01L21/823871 , H01L27/092
摘要： A semiconductor device is disclosed, which comprises a silicon substrate, a complementary MISFET circuit, an insulation film formed on the silicon substrate, a first contact hole formed in the insulation film, a first metal silicide layer formed on the bottom of the first contact hole, the first metal silicide layer being provided by a reaction of the n-channel impurity diffused region of the n-channel MISFET with a first metal, a second contact hole formed in the insulation film, a second metal silicide layer formed on the bottom of the second contact hole, the second metal silicide layer being provided by a reaction of the p-channel impurity diffused region of the p-channel MISFET with a second metal, and a work function of the second metal silicide layer being higher than that of the first metal silicide layer.
摘要翻译：公开了一种半导体器件，其包括硅衬底，互补MISFET电路，形成在硅衬底上的绝缘膜，形成在绝缘膜中的第一接触孔，形成在第一接触孔的底部上的第一金属硅化物层通过n沟道MISFET的n沟道杂质扩散区域与第一金属的反应提供第一金属硅化物层，形成在绝缘膜中的第二接触孔，形成在第二金属硅化物层的底部的第二金属硅化物层所述第二接触孔，所述第二金属硅化物层由所述p沟道MISFET的p沟道杂质扩散区域与第二金属的反应提供，并且所述第二金属硅化物层的功函数高于所述第二金属硅化物层的功函数第一金属硅化物层。

7. 发明申请

US20090203181A1 Semiconductor device manufacturing method, wiring and semiconductor device 有权
标题翻译：半导体器件制造方法，布线和半导体器件
公开(公告)号：US20090203181A1
公开(公告)日：2009-08-13
申请号：US12320655
申请日：2009-01-30
申请人： Kyoichi Suguro , Mitsuaki Izuha
发明人： Kyoichi Suguro , Mitsuaki Izuha
IPC分类号： H01L21/336
CPC分类号： H01L21/28052 , H01L21/823835 , H01L21/823842 , H01L21/823871 , H01L2924/0002 , H01L2924/00
摘要： In an embodiment of the present invention, a semiconductor layer having regions into which a p-type impurity, an n-type impurity and a (p+n) impurity are respectively introduced is formed as a surface layer by being heat-treated. An impurity segregation layer on these regions is removed, and a film of a metallic material is thereafter formed on the regions and is heat-treated, thereby forming a silicide film on the semiconductor layer. In another embodiment, an impurity is introduced into the impurity segregation layer, and a film of a metallic material is thereafter formed on the impurity segregation layer and is heat-treated to form a silicide film.
摘要翻译：在本发明的实施例中，通过热处理形成具有分别引入p型杂质，n型杂质和（p + n）杂质的区域的半导体层作为表面层。除去这些区域上的杂质偏析层，然后在该区域上形成金属材料膜，并进行热处理，从而在半导体层上形成硅化物膜。在另一个实施方案中，将杂质引入杂质偏析层中，然后在杂质偏析层上形成金属材料膜，并进行热处理以形成硅化物膜。

8. 发明授权

US07354819B2 Method of manufacturing CMOS with silicide contacts 失效
标题翻译：用硅化物触点制造CMOS的方法
公开(公告)号：US07354819B2
公开(公告)日：2008-04-08
申请号：US10701435
申请日：2003-11-06
申请人： Kazuaki Nakajima , Kyoichi Suguro
发明人： Kazuaki Nakajima , Kyoichi Suguro
IPC分类号： H01L21/8238
CPC分类号： H01L21/76843 , H01L21/28518 , H01L21/76855 , H01L21/823814 , H01L21/823871 , H01L27/092
摘要： A semiconductor device is disclosed, which comprises a silicon substrate, a complementary MISFET circuit, an insulation film formed on the silicon substrate, a first contact hole formed in the insulation film, a first metal silicide layer formed on the bottom of the first contact hole, the first metal silicide layer being provided by a reaction of the n-channel impurity diffused region of the n-channel MISFET with a first metal, a second contact hole formed in the insulation film, a second metal silicide layer formed on the bottom of the second contact hole, the second metal silicide layer being provided by a reaction of the p-channel impurity diffused region of the p-channel MISFET with a second metal, and a work function of the second metal silicide layer being higher than that of the first metal silicide layer.
摘要翻译：公开了一种半导体器件，其包括硅衬底，互补MISFET电路，形成在硅衬底上的绝缘膜，形成在绝缘膜中的第一接触孔，形成在第一接触孔的底部上的第一金属硅化物层通过n沟道MISFET的n沟道杂质扩散区域与第一金属的反应提供第一金属硅化物层，形成在绝缘膜中的第二接触孔，形成在第二金属硅化物层的底部的第二金属硅化物层所述第二接触孔，所述第二金属硅化物层由所述p沟道MISFET的p沟道杂质扩散区域与第二金属的反应提供，并且所述第二金属硅化物层的功函数高于所述第二金属硅化物层的功函数第一金属硅化物层。

9. 发明授权

US07349750B2 Method for optimizing an industrial product, system for optimizing an industrial product and method for manufacturing an industrial product 失效
公开(公告)号：US07349750B2
公开(公告)日：2008-03-25
申请号：US11480373
申请日：2006-07-05
申请人： Kazumi Nishinohara , Mitsutoshi Nakamura , Kyoichi Suguro , Koji Shirai , Ichiro Taguchi
发明人： Kazumi Nishinohara , Mitsutoshi Nakamura , Kyoichi Suguro , Koji Shirai , Ichiro Taguchi
IPC分类号： G06F19/00
CPC分类号： G05B19/41885 , G05B2219/45031 , Y02P90/20 , Y02P90/26
摘要： A method for optimizing a structure of an industrial product includes selecting control factors from among manufacturing parameters affecting a target characteristic, which is scheduled to be manufactured by a sequence of manufacturing processes; setting levels to the respective control factors; selecting a reference characteristic having a trade-off relation with the target characteristic from among characteristics of the structure; setting a reference value to the reference characteristic; selecting a prior adjustment factor affecting the reference characteristic; creating conditions for experiments assigning combinations of the levels to the respective control factors; determining an adjustment value of the prior adjustment factor so that each of characteristic values of the reference characteristic obtained by the experiments conforms substantially to the reference value; and determining experimental characteristic values of the target characteristic using the adjustment value.

10. 发明授权

US07327013B2 Stencil mask with charge-up prevention and method of manufacturing the same 失效
标题翻译：具有防止充电的模板面罩及其制造方法
公开(公告)号：US07327013B2
公开(公告)日：2008-02-05
申请号：US10743522
申请日：2003-12-23
申请人： Takeshi Shibata , Kyoichi Suguro
发明人： Takeshi Shibata , Kyoichi Suguro
IPC分类号： H01L29/06
CPC分类号： G03F1/20 , G03F1/40
摘要： A drive unit is described for switching circuit breakers on and off, in particular disconnecting switches and/or grounding switches of medium-voltage switchgear. The drive unit includes a reversible d.c. motor and a switching device containing two separately drivable and interlocked reversing switches, one assigned to each direction of rotation of the d.c. motor, their contacts performing the current reversal on the windings of the d.c. motor as required to reverse the direction of rotation. The drive unit further includes power contactors whose contacts have the required switching capacity for load switching. The all-or-nothing relays and safety switches are implemented by uniform low-power relays representing the direction of rotation, each having at least two electrically isolated relay contacts connected in parallel and also having an equalizing capacitor connected in parallel to each. Such drive units are used in connection with switchgear for power transmission and distribution.
摘要翻译：在模板掩模中，导电薄膜在其中具有第一开口。在除了第一开口之外的导电薄膜的区域中形成绝缘膜。在绝缘膜上形成导电支撑。第二个开口穿过导电支撑和绝缘膜并到达导电薄膜的表面。导电构件形成在第二开口中。导电构件电连接导电支撑件和导电薄膜。

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