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    • 7. 发明申请
    • ELECTRICAL FUSES COMPRISING THIN FILM TRANSISTORS (TFTS), AND METHODS FOR PROGRAMMING SAME
    • 包含薄膜晶体管(TFTS)的电熔丝及其编程方法
    • US20070158781A1
    • 2007-07-12
    • US11306597
    • 2006-01-04
    • Babar KhanChandrasekharan KothandaramanKai Xiu
    • Babar KhanChandrasekharan KothandaramanKai Xiu
    • H01L29/00
    • H01L29/42384H01L23/345H01L23/5256H01L29/78669H01L2924/0002H01L2924/00
    • The present invention relates to electrical fuses that each comprises at least one thin film transistor. In one embodiment, the electrical fuse of the present invention comprises a hydrogenated thin film transistor with an adjacent heating element. Programming of such an electrical fuse can be effectuated by heating the hydrogenated thin film transistor so as to cause at least partial dehydrogenation. Consequentially, the thin film transistor exhibits detectible physical property change(s), which defines a programmed state. In an alternative embodiment of the present invention, the electrical fuse comprises a thin film transistor that is either hydrogenated or not hydrogenated. Programming of such an alternative electrical fuse can be effectuated by applying a sufficient high back gate voltage to the thin film transistor to cause state changes in the channel-gate interface. In this manner, the thin film transistor also exhibits detectible property change(s) to define a programmed state.
    • 本发明涉及电熔丝,每个电熔丝包括至少一个薄膜晶体管。 在一个实施例中,本发明的电熔丝包括具有相邻加热元件的氢化薄膜晶体管。 可以通过加热氢化薄膜晶体管来实现这种电熔丝的编程,从而至少部分脱氢。 因此,薄膜晶体管表现出可检测的物理特性变化,其定义了编程状态。 在本发明的替代实施例中,电熔丝包括被氢化或未氢化的薄膜晶体管。 可以通过向薄膜晶体管施加足够的高背栅电压来引起通道栅极界面的状态变化来实现这种替代电熔丝的编程。 以这种方式,薄膜晶体管还具有可检测的特性变化以限定编程状态。
    • 8. 发明授权
    • Method of forming active devices of different gatelengths using lithographic printed gate images of same length
    • 使用相同长度的平版印刷门图像形成不同长度的有源器件的方法
    • US06703312B2
    • 2004-03-09
    • US10151074
    • 2002-05-17
    • John Walter GolzBabar KhanJoyce C. LiuChristopher Joseph WaskiewiczTeresa Jacqueline Wu
    • John Walter GolzBabar KhanJoyce C. LiuChristopher Joseph WaskiewiczTeresa Jacqueline Wu
    • H01L21301
    • H01L21/823468H01L21/823456
    • As disclosed herein, a method is provided for simultaneously patterning features having a first width in a first portion such as a logic portion of an integrated circuit, and having a second width in a second portion such as an array portion of an integrated circuit. The method includes depositing a feature layer over a substrate and a hardmask material layer thereover. Photoresist patterns are then formed in the first and second portions with a critical dimension mask, and are then used to etch the hardmask material layer into hardmask patterns. Sidewall spacers are provided on sidewalls of the hardmask patterns in the second portion. Then, the feature layer is simultaneously etched in both first and second portions, using the hardmask patterns in the first portion to define features having a first width, and using the hardmask patterns and the sidewall spacers in the second portion to define features having a second width.
    • 如本文所公开的,提供了一种用于在诸如集成电路的逻辑部分的第一部分中同时构图具有第一宽度的特征的方法,并且在诸如集成电路的阵列部分的第二部分中具有第二宽度。 该方法包括在基底上沉积特征层,并在其上沉积硬掩模材料层。 然后用临界尺寸掩模在第一和第二部分中形成光致抗蚀剂图案,然后用于将硬掩模材料层蚀刻成硬掩模图案。 侧壁间隔件设置在第二部分中的硬掩模图案的侧壁上。 然后,使用第一部分中的硬掩模图案同时在第一和第二部分中蚀刻特征层,以限定具有第一宽度的特征,以及使用第二部分中的硬掩模图案和侧壁间隔物来限定具有第二部分的特征 宽度。