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1. 发明授权

US08550801B2 Imprint apparatus and method 有权
标题翻译：印刷装置和方法
公开(公告)号：US08550801B2
公开(公告)日：2013-10-08
申请号：US13230554
申请日：2011-09-12
申请人： Yohko Furutono , Shinji Mikami , Masayuki Hatano , Tetsuro Nakasugi
发明人： Yohko Furutono , Shinji Mikami , Masayuki Hatano , Tetsuro Nakasugi
IPC分类号： B29C59/02
CPC分类号： B29C59/022 , B29C35/0888 , B29C2035/0827 , B29C2059/023 , B82Y10/00 , B82Y40/00 , G03F7/0002
摘要： In one embodiment, an imprint apparatus includes a template holding part configured to hold a template for imprint. The apparatus further includes a template moving part configured to move the template to press the template onto a light curing resin on a transfer target substrate or to demold the template from the light curing resin. The apparatus further includes a light source configured to irradiate the light curing resin with light to cure the light curing resin. The apparatus further includes a demold control part configured to control a demold speed or a demold angle of the template, based on a position of a shot region from which the template is to be demolded, when demolding the template from the light curing resin.
摘要翻译：在一个实施例中，压印装置包括被配置为保持用于印记的模板的模板保持部分。该装置还包括模板移动部件，其构造成移动模板以将模板按压在转印目标基板上的光固化树脂上，或者从光固化树脂脱模模板。该装置还包括配置成用光照射光固化树脂以固化光固化树脂的光源。该设备还包括脱模控制部件，当脱模模板从光固化树脂脱模时，该脱模控制部件被配置为基于模板从其脱模的喷射区域的位置来控制模板的脱模速度或脱模角度。

2. 发明申请

US20120061882A1 IMPRINT APPARATUS AND METHOD 有权
标题翻译：印刷装置和方法
公开(公告)号：US20120061882A1
公开(公告)日：2012-03-15
申请号：US13230554
申请日：2011-09-12
申请人： Yohko Furutono , Shinji Mikami , Masayuki Hatano , Tetsuro Nakasugi
发明人： Yohko Furutono , Shinji Mikami , Masayuki Hatano , Tetsuro Nakasugi
IPC分类号： B29C35/08
CPC分类号： B29C59/022 , B29C35/0888 , B29C2035/0827 , B29C2059/023 , B82Y10/00 , B82Y40/00 , G03F7/0002
摘要： In one embodiment, an imprint apparatus includes a template holding part configured to hold a template for imprint. The apparatus further includes a template moving part configured to move the template to press the template onto a light curing resin on a transfer target substrate or to demold the template from the light curing resin. The apparatus further includes a light source configured to irradiate the light curing resin with light to cure the light curing resin. The apparatus further includes a demold control part configured to control a demold speed or a demold angle of the template, based on a position of a shot region from which the template is to be demolded, when demolding the template from the light curing resin.
摘要翻译：在一个实施例中，压印装置包括被配置为保持用于印记的模板的模板保持部分。该装置还包括模板移动部件，其构造成移动模板以将模板按压在转印目标基板上的光固化树脂上，或者从光固化树脂脱模模板。该装置还包括配置成用光照射光固化树脂以固化光固化树脂的光源。该设备还包括脱模控制部件，当脱模模板从光固化树脂脱模时，该脱模控制部件被配置为基于模板从其脱模的喷射区域的位置来控制模板的脱模速度或脱模角度。

3. 发明授权

US08180472B2 Control method for semiconductor manufacturing apparatus, control system for semiconductor manufacturing apparatus, and manufacturing method for semiconductor device 失效
标题翻译：半导体制造装置的控制方法，半导体制造装置的控制系统以及半导体装置的制造方法
公开(公告)号：US08180472B2
公开(公告)日：2012-05-15
申请号：US12497349
申请日：2009-07-02
申请人： Masayuki Hatano , Tetsuro Nakasugi
发明人： Masayuki Hatano , Tetsuro Nakasugi
IPC分类号： G06F19/00
CPC分类号： G05B19/41875 , G05B2219/31265 , G05B2219/32196 , Y02P90/22
摘要： A control method for a semiconductor manufacturing apparatus, comprising: generating, as log data, a history of operation states of the semiconductor manufacturing apparatus when a wafer is processed by the semiconductor manufacturing apparatus; specifying, based on the log data, processing results in which operation states of the semiconductor manufacturing apparatus are abnormal states out of processing results after the processing of the wafer processed by the semiconductor manufacturing apparatus as abnormal processing results; creating control data for the semiconductor manufacturing apparatus based on the processing results and the abnormal processing results; and controlling the processing by the semiconductor manufacturing apparatus using the control data.
摘要翻译：一种半导体制造装置的控制方法，包括：当半导体制造装置处理晶片时，产生作为对数数据的半导体制造装置的工作状态的历史; 基于对数数据，指定在由半导体制造装置处理的晶片处理之后的处理结果中作为异常处理结果的半导体制造装置的操作状态为异常状态的处理结果; 基于处理结果和异常处理结果创建半导体制造装置的控制数据; 以及使用控制数据来控制半导体制造装置的处理。

4. 发明授权

US08118585B2 Pattern formation method and a method for manufacturing a semiconductor device 有权
标题翻译：图案形成方法及半导体装置的制造方法
公开(公告)号：US08118585B2
公开(公告)日：2012-02-21
申请号：US12882944
申请日：2010-09-15
申请人： Masayuki Hatano , Suigen Kyoh , Tetsuro Nakasugi
发明人： Masayuki Hatano , Suigen Kyoh , Tetsuro Nakasugi
IPC分类号： A01J21/00
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00 , G03F9/00
摘要： In one embodiment, a pattern formation method is disclosed. The method can place a liquid resin material on a workpiece substrate. The method can press a template against the resin material and measuring distance between a lower surface of a projection of the template and an upper surface of the workpiece substrate. The template includes a pattern formation region and a circumferential region around the pattern formation region. A pattern for circuit pattern formation is formed in the pattern formation region and the projection is formed in the circumferential region. The method can form a resin pattern by curing the resin material in a state of pressing the template. In addition, the method can separate the template from the resin pattern.
摘要翻译：在一个实施例中，公开了图案形成方法。该方法可以将液态树脂材料放置在工件基板上。该方法可以将模板压靠树脂材料并测量模板的突起的下表面与工件基板的上表面之间的距离。模板包括图案形成区域和围绕图案形成区域的周边区域。在图案形成区域中形成用于电路图案形成的图案，并且在周向区域中形成突起。该方法可以通过在压制模板的状态下固化树脂材料来形成树脂图案。此外，该方法可以将模板与树脂图案分离。

5. 发明申请

US20110192300A1 IMPRINT METHOD AND IMPRINT APPARATUS 有权
标题翻译： IMPRINT方法和印刷装置
公开(公告)号：US20110192300A1
公开(公告)日：2011-08-11
申请号：US13023225
申请日：2011-02-08
申请人： Masayuki Hatano , Ikuo Yoneda , Tetsuro Nakasugi , Kenji Ooki
发明人： Masayuki Hatano , Ikuo Yoneda , Tetsuro Nakasugi , Kenji Ooki
IPC分类号： B41F1/40 , B41F9/01
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00
摘要： According to one embodiment, an imprint method is disclosed. The method can include forming a liquid droplet of a transfer material with a volume greater than a predetermined reference volume by dropping the transfer material onto a major surface of a processing substrate. The method can include reducing the volume of the liquid droplet to be less than the reference volume by volatilizing the liquid droplet. In addition, the method can include filling the transfer material into a recess provided in a transfer surface of a template by bringing the liquid droplet having the volume reduced to be less than the reference volume into contact with the transfer surface of the template.
摘要翻译：根据一个实施例，公开了压印方法。该方法可以包括通过将转印材料落到处理衬底的主表面上来形成体积大于预定参考体积的转印材料的液滴。该方法可以包括通过挥发液滴来将液滴的体积减小到小于参考体积。此外，该方法可以包括通过使体积减小到小于参考体积的液滴与模板的转印表面接触来将转印材料填充到设置在模板的转印表面中的凹部中。

6. 发明授权

US08202463B2 Imprint method 有权
标题翻译：印记法
公开(公告)号：US08202463B2
公开(公告)日：2012-06-19
申请号：US12426527
申请日：2009-04-20
申请人： Ikuo Yoneda , Tetsuro Nakasugi , Shinji Mikami
发明人： Ikuo Yoneda , Tetsuro Nakasugi , Shinji Mikami
IPC分类号： B29C59/00
CPC分类号： B29C37/006 , B29C35/0888 , B29C37/0053 , B29C2035/0827 , B29C2059/023 , B82Y10/00 , B82Y40/00 , G03F7/0002
摘要： An imprint method includes contacting a template on a first substrate. The template includes a pattern to be transferred on the first substrate. The first substrate includes a first semiconductor substrate, and a first light curable resin coated on the first semiconductor substrate. The method further includes separating the template from the first substrate, and removing particles adhered on the template. The particle removal includes: pressing the template on an adhesive member which is distinct from the first substrate. The adhesive member includes a dummy substrate, a particle removing film formed on the dummy substrate and configured to remove the particles, and a second light curable resin coated on the particle removing film. The second light curable resin is thicker than the first light curable resin.
摘要翻译：压印方法包括在第一衬底上接触模板。模板包括要在第一基板上转印的图案。第一基板包括第一半导体基板和涂覆在第一半导体基板上的第一光固化树脂。该方法还包括从第一基底分离模板，以及除去附着在模板上的颗粒。颗粒去除包括：将模板压在与第一基板不同的粘合剂构件上。所述粘合部件包括虚拟基板，形成在所述虚设基板上并构成为除去所述粒子的除粒膜，以及涂覆在所述除粒膜上的第二光固化树脂。第二光固化树脂比第一光固化树脂厚。

7. 发明申请

US20090315223A1 TEMPLATE AND PATTERN FORMING METHOD 审中-公开
标题翻译：模式和图案形成方法
公开(公告)号：US20090315223A1
公开(公告)日：2009-12-24
申请号：US12483705
申请日：2009-06-12
申请人： Ikuo Yoneda , Shinji Mikami , Takumi Ota , Tetsuro Nakasugi
发明人： Ikuo Yoneda , Shinji Mikami , Takumi Ota , Tetsuro Nakasugi
IPC分类号： B29C35/08 , B29C59/02
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00
摘要： A template includes a substrate, an element pattern formed on a surface of the substrate, and a light absorbing portion formed on or inside the substrate.
摘要翻译：模板包括基板，形成在基板的表面上的元件图案，以及形成在基板上或内部的光吸收部。

8. 发明申请

US20090267267A1 IMPRINT METHOD 有权
标题翻译： IMPRINT方法
公开(公告)号：US20090267267A1
公开(公告)日：2009-10-29
申请号：US12426527
申请日：2009-04-20
申请人： Ikuo Yoneda , Tetsuro Nakasugi , Shinji Mikami
发明人： Ikuo Yoneda , Tetsuro Nakasugi , Shinji Mikami
IPC分类号： B29C59/00
CPC分类号： B29C37/006 , B29C35/0888 , B29C37/0053 , B29C2035/0827 , B29C2059/023 , B82Y10/00 , B82Y40/00 , G03F7/0002
摘要： An imprint method includes contacting a template on a substrate, the template including a pattern to be transferred on the substrate, separating the template from the substrate, and removing particle adhered on the template before contacting the template on the substrate, the removing the particle including pressing the template on an adhesive member and separating the pressed template from the adhesive member, wherein adhesiveness of the adhesive member to the template is higher than adhesiveness of the adhesive member to the substrate.
摘要翻译：压印方法包括使基板上的模板接触，所述模板包括要在基板上转印的图案，将模板与基板分离，以及在与基板之间的模板接触之前除去附着在模板上的颗粒，除去包括将模板压在粘合剂构件上并将压制模板与粘合构件分离，其中粘合剂与模板的粘合性高于粘合剂与基材的粘合性。

9. 发明申请

US20110097827A1 PATTERN FORMATION METHOD AND A METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE 有权
标题翻译：图案形成方法和制造半导体器件的方法
公开(公告)号：US20110097827A1
公开(公告)日：2011-04-28
申请号：US12882944
申请日：2010-09-15
申请人： Masayuki HATANO , Suigen Kyoh , Tetsuro Nakasugi
发明人： Masayuki HATANO , Suigen Kyoh , Tetsuro Nakasugi
IPC分类号： H01L21/66 , B29C59/02
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00 , G03F9/00
摘要： In one embodiment, a pattern formation method is disclosed. The method can place a liquid resin material on a workpiece substrate. The method can press a template against the resin material and measuring distance between a lower surface of a projection of the template and an upper surface of the workpiece substrate. The template includes a pattern formation region and a circumferential region around the pattern formation region. A pattern for circuit pattern formation is formed in the pattern formation region and the projection is formed in the circumferential region. The method can form a resin pattern by curing the resin material in a state of pressing the template. In addition, the method can separate the template from the resin pattern.
摘要翻译：在一个实施例中，公开了图案形成方法。该方法可以将液态树脂材料放置在工件基板上。该方法可以将模板压靠树脂材料并测量模板的突起的下表面与工件基板的上表面之间的距离。模板包括图案形成区域和围绕图案形成区域的周边区域。在图案形成区域中形成用于电路图案形成的图案，并且在周向区域中形成突起。该方法可以通过在压制模板的状态下固化树脂材料来形成树脂图案。此外，该方法可以将模板与树脂图案分离。

10. 发明授权

US08973494B2 Imprint method and imprint apparatus 有权
标题翻译：压印方法和压印装置
公开(公告)号：US08973494B2
公开(公告)日：2015-03-10
申请号：US13023225
申请日：2011-02-08
申请人： Masayuki Hatano , Ikuo Yoneda , Tetsuro Nakasugi , Kenji Ooki
发明人： Masayuki Hatano , Ikuo Yoneda , Tetsuro Nakasugi , Kenji Ooki
IPC分类号： G03F7/00 , B82Y10/00
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00
摘要： According to one embodiment, an imprint method is disclosed. The method can include forming a liquid droplet of a transfer material with a volume greater than a predetermined reference volume by dropping the transfer material onto a major surface of a processing substrate. The method can include reducing the volume of the liquid droplet to be less than the reference volume by volatilizing the liquid droplet. In addition, the method can include filling the transfer material into a recess provided in a transfer surface of a template by bringing the liquid droplet having the volume reduced to be less than the reference volume into contact with the transfer surface of the template.
摘要翻译：根据一个实施例，公开了压印方法。该方法可以包括通过将转印材料落到处理衬底的主表面上来形成体积大于预定参考体积的转印材料的液滴。该方法可以包括通过挥发液滴来将液滴的体积减小到小于参考体积。此外，该方法可以包括通过使体积减小到小于参考体积的液滴与模板的转印表面接触来将转印材料填充到设置在模板的转印表面中的凹部中。

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