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    • 6. 发明授权
    • Pattern forming method
    • 图案形成方法
    • US09046763B2
    • 2015-06-02
    • US12727025
    • 2010-03-18
    • Takeshi KoshibaIkuo YonedaTetsuro Nakasugi
    • Takeshi KoshibaIkuo YonedaTetsuro Nakasugi
    • B27N3/18G03F7/00B82Y10/00B82Y40/00
    • B05D1/322B82Y10/00B82Y40/00G03F7/0002
    • A pattern forming method includes determining an amount of curable resin to be formed on a substrate, the curable resin having volatility, the amount of the curable resin being determined by a calculation considering volatile loss of the curable resin, the calculation being performed for each of a plurality of regions of the substrate, forming the curable resin having the determined amount on the substrate, the forming the curable resin being performed for each of the plurality of regions of the substrate, contacting the curable resin formed on the substrate with a template, the template including a pattern to be filled with the curable resin by the contacting, and curing the curable resin under a condition where the curable resin is in contact with the template.
    • 图案形成方法包括确定在基材上形成的固化性树脂的量,所述固化性树脂具有挥发性,所述固化性树脂的量是通过考虑了固化性树脂的挥发性损失的计算而计算的, 基板的多个区域,在基板上形成具有确定量的固化树脂,对基板的多个区域中的每一个进行固化树脂的形成,使形成在基板上的可固化树脂与模板接触, 模板包括通过接触填充固化树脂的图案,并且在可固化树脂与模板接触的条件下固化可固化树脂。
    • 8. 发明申请
    • PATTERN FORMING METHOD
    • 图案形成方法
    • US20100237045A1
    • 2010-09-23
    • US12727025
    • 2010-03-18
    • Takeshi KOSHIBAIkuo YonedaTetsuro Nakasugi
    • Takeshi KOSHIBAIkuo YonedaTetsuro Nakasugi
    • B44C1/22B05D5/00B05D3/06
    • B05D1/322B82Y10/00B82Y40/00G03F7/0002
    • A pattern forming method includes determining an amount of curable resin to be formed on a substrate, the curable resin having volatility, the amount of the curable resin being determined by a calculation considering volatile loss of the curable resin, the calculation being performed for each of a plurality of regions of the substrate, forming the curable resin having the determined amount on the substrate, the forming the curable resin being performed for each of the plurality of regions of the substrate, contacting the curable resin formed on the substrate with a template, the template including a pattern to be filled with the curable resin by the contacting, and curing the curable resin under a condition where the curable resin is in contact with the template.
    • 图案形成方法包括确定在基材上形成的固化性树脂的量,所述固化性树脂具有挥发性,所述固化性树脂的量是通过考虑了固化性树脂的挥发性损失的计算而计算的, 基板的多个区域,在基板上形成具有确定量的固化树脂,对基板的多个区域中的每一个进行固化树脂的形成,使形成在基板上的可固化树脂与模板接触, 模板包括通过接触填充固化树脂的图案,并且在可固化树脂与模板接触的条件下固化可固化树脂。
    • 9. 发明授权
    • Imprint method
    • 印记法
    • US08202463B2
    • 2012-06-19
    • US12426527
    • 2009-04-20
    • Ikuo YonedaTetsuro NakasugiShinji Mikami
    • Ikuo YonedaTetsuro NakasugiShinji Mikami
    • B29C59/00
    • B29C37/006B29C35/0888B29C37/0053B29C2035/0827B29C2059/023B82Y10/00B82Y40/00G03F7/0002
    • An imprint method includes contacting a template on a first substrate. The template includes a pattern to be transferred on the first substrate. The first substrate includes a first semiconductor substrate, and a first light curable resin coated on the first semiconductor substrate. The method further includes separating the template from the first substrate, and removing particles adhered on the template. The particle removal includes: pressing the template on an adhesive member which is distinct from the first substrate. The adhesive member includes a dummy substrate, a particle removing film formed on the dummy substrate and configured to remove the particles, and a second light curable resin coated on the particle removing film. The second light curable resin is thicker than the first light curable resin.
    • 压印方法包括在第一衬底上接触模板。 模板包括要在第一基板上转印的图案。 第一基板包括第一半导体基板和涂覆在第一半导体基板上的第一光固化树脂。 该方法还包括从第一基底分离模板,以及除去附着在模板上的颗粒。 颗粒去除包括:将模板压在与第一基板不同的粘合剂构件上。 所述粘合部件包括虚拟基板,形成在所述虚设基板上并构成为除去所述粒子的除粒膜,以及涂覆在所述除粒膜上的第二光固化树脂。 第二光固化树脂比第一光固化树脂厚。