专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20050006083A1 Temperature-homogenizing device 有权
标题翻译：温度均化装置
公开(公告)号：US20050006083A1
公开(公告)日：2005-01-13
申请号：US10756064
申请日：2004-01-13
申请人： Yin-Yuan Chen , Wen-Ching Wu , Jui-Yuan Hsu
发明人： Yin-Yuan Chen , Wen-Ching Wu , Jui-Yuan Hsu
IPC分类号： H01L23/36 , H01L23/433 , H05K7/20
CPC分类号： H05K7/20436 , H01L23/36 , H01L23/433 , H01L2924/0002 , H05K7/20481 , H01L2924/00
摘要： A temperature-homogenizing device for uniformly dissipating heat generated from electronic components in an electronic device to a housing of the electronic device includes a first and a second higher thermally conductive layers and a first lower thermally conductive layer. The first lower thermally conductive layer is disposed between the first and the second higher thermally conductive layers, and made of a material or a medium having a lower thermal conductivity than each of the first and the second higher thermally conductive layers. By means of this temperature-homogenizing device, the heat is homogeneously distributed throughout the first and the second higher thermally conductive layers at a higher thermal conduction rate and transferred through the first lower thermally conductive layer at a lower thermal conduction rate so as to maintain homogeneous temperature distribution on the housing.
摘要翻译：用于将电子设备中的电子部件产生的热量均匀地散发到电子设备的壳体的温度均化装置包括第一和第二较高导热层和第一下部导热层。第一下部导热层设置在第一和第二较高导热层之间，并且由具有比每个第一和第二较高导热层的导热性低的材料或介质制成。通过该温度均化装置，热量以更高的热传导速率均匀地分布在第一和第二较高的导热层中，并以较低的热传导速率转移通过第一较低导热层，以保持均匀温度分布在房屋上。

2. 发明授权

US07066244B2 Temperature-homogenizing device 有权
标题翻译：温度均化装置
公开(公告)号：US07066244B2
公开(公告)日：2006-06-27
申请号：US10756064
申请日：2004-01-13
申请人： Yin-Yuan Chen , Wen-Ching Wu , Jui-Yuan Hsu
发明人： Yin-Yuan Chen , Wen-Ching Wu , Jui-Yuan Hsu
IPC分类号： F28F7/00
CPC分类号： H05K7/20436 , H01L23/36 , H01L23/433 , H01L2924/0002 , H05K7/20481 , H01L2924/00
摘要： A temperature-homogenizing device for uniformly dissipating heat generated from electronic components in an electronic device to a housing of the electronic device includes a first and a second higher thermally conductive layers and a first lower thermally conductive layer. The first lower thermally conductive layer is disposed between the first and the second higher thermally conductive layers, and made of a material or a medium having a lower thermal conductivity than each of the first and the second higher thermally conductive layers. By means of this temperature-homogenizing device, the heat is homogeneously distributed throughout the first and the second higher thermally conductive layers at a higher thermal conduction rate and transferred through the first lower thermally conductive layer at a lower thermal conduction rate so as to maintain homogeneous temperature distribution on the housing.
摘要翻译：用于将电子设备中的电子部件产生的热量均匀地散发到电子设备的壳体的温度均化装置包括第一和第二较高导热层和第一下部导热层。第一下部导热层设置在第一和第二较高导热层之间，并且由具有比每个第一和第二较高导热层的导热性低的材料或介质制成。通过该温度均化装置，热量以更高的热传导速率均匀地分布在第一和第二较高的导热层中，并以较低的热传导速率转移通过第一较低导热层，以保持均匀温度分布在房屋上。

3. 发明申请

US20080304238A1 ELECTRONIC DEVICE HAVING PASSIVE HEAT-DISSIPATING MECHANISM 审中-公开
标题翻译：具有被动热释放机构的电子设备
公开(公告)号：US20080304238A1
公开(公告)日：2008-12-11
申请号：US11938590
申请日：2007-11-12
申请人： Shih-Kai Chien , Yin-Yuan Chen , Ke-Cheng Lin , Jui-Yuan Hsu , Wen-Yi Yeh
发明人： Shih-Kai Chien , Yin-Yuan Chen , Ke-Cheng Lin , Jui-Yuan Hsu , Wen-Yi Yeh
IPC分类号： H05K7/20
CPC分类号： H05K7/20427
摘要： The present invention relates to an electronic device having a passive heat-dissipating mechanism. The electronic device includes a circuit board and a radiation enhancement layer. The circuit board has at least an electronic component thereon. The radiation enhancement layer is attached onto at least a portion of a surface of the electronic component for facilitating radiating the heat from the electronic component to the ambient air via natural convection. The radiation enhancement layer is made of a ceramic material.
摘要翻译：本发明涉及一种具有被动散热机构的电子设备。电子设备包括电路板和辐射增强层。电路板上至少有一个电子部件。辐射增强层附着在电子部件的表面的至少一部分上，以便于通过自然对流将热量从电子部件辐射到环境空气。辐射增强层由陶瓷材料制成。

4. 发明授权

US06710691B2 Transformer with an associated heat-dissipating plastic element 失效
标题翻译：具有相关散热塑料元件的变压器
公开(公告)号：US06710691B2
公开(公告)日：2004-03-23
申请号：US10246832
申请日：2002-09-18
申请人： Wen-Lung Yu , Yin-Yuan Chen
发明人： Wen-Lung Yu , Yin-Yuan Chen
IPC分类号： H01F2708
CPC分类号： H01F27/255 , H01F27/22 , H01F27/292
摘要： A transformer with an associated heat-dissipating plastic element is provided. The transformer includes a hollow main body, a core, a coil and a heat-dissipating plastic element. The core is installed inside the hollow main body while the coil wraps around the core. The heat-dissipating plastic element is also installed inside the hollow main body. The heat-dissipating plastic element encloses the core and the coil. Alternatively, the heat-dissipating plastic element encloses the hollow main body, the core and the coil so that heat generated by the coil may be directly conducted away to the exterior through the heat-dissipating plastic element.
摘要翻译：提供具有相关散热塑料元件的变压器。变压器包括中空主体，芯体，线圈和散热塑料元件。芯线安装在中空主体的内部，而线圈缠绕在芯上。散热塑料元件也安装在中空主体内部。散热塑料元件包围芯和线圈。或者，散热塑料元件包围中空主体，芯部和线圈，使得线圈产生的热量可以通过散热塑料元件直接传导到外部。

5. 发明授权

US09089006B2 Intelligent heater and temperature measuring device 有权
标题翻译：智能加热器和温度测量装置
公开(公告)号：US09089006B2
公开(公告)日：2015-07-21
申请号：US12941203
申请日：2010-11-08
申请人： Cheng-Hsien Cho , Yin-Yuan Chen
发明人： Cheng-Hsien Cho , Yin-Yuan Chen
IPC分类号： H05B6/12 , H05B6/06
CPC分类号： H05B6/062
摘要： An intelligent heater includes a first induction coil, a control panel, a power supply unit, a storage unit, a data transmission interface, and a controlling unit. The control panel includes an input unit for inputting, adding, amending, deleting or refreshing a cooking data and a display unit for showing an operating condition of the intelligent heater. The power supply unit is connected with the first induction coil for providing a first power to the first induction coil. The storage unit is used for storing the cooking data. The data transmission interface is used for transmitting the cooking data. The controlling unit is used for controlling the power supply unit to provide an electricity quantity of the first power to the first induction coil according to the cooking data, so that a heat quantity and a heating time required for heating a first foodstuff container are adaptively adjusted.
摘要翻译：智能加热器包括第一感应线圈，控制面板，电源单元，存储单元，数据传输接口和控制单元。控制面板包括用于输入，添加，修改，删除或刷新烹饪数据的输入单元和用于显示智能加热器的操作状态的显示单元。电源单元与第一感应线圈连接，用于向第一感应线圈提供第一功率。存储单元用于存储烹饪数据。数据传输接口用于传送烹饪数据。控制单元用于控制电源单元，以根据烹饪数据向第一感应线圈提供第一功率的电量，从而适应地调节对第一食品容器加热所需的热量和加热时间。

6. 发明授权

US08658950B2 Heating device capable of eliminating noise and adjusting desired heat quality or heating temperature by controlling frequency difference between two induction coils during a first time interval and disabling one of two induction coils during a second time interval 有权
标题翻译：加热装置能够通过在第一时间间隔期间控制两个感应线圈之间的频率差并且在第二时间间隔期间禁用两个感应线圈之一来消除噪音并调整所需的热质量或加热温度
公开(公告)号：US08658950B2
公开(公告)日：2014-02-25
申请号：US12725707
申请日：2010-03-17
申请人： Cheng-Hsien Cho , Yin-Yuan Chen
发明人： Cheng-Hsien Cho , Yin-Yuan Chen
IPC分类号： H05B6/12
CPC分类号： H05B3/12 , H05B6/065
摘要： A heating device includes a first induction coil, a second induction coil, a control panel, a power supply unit and a controlling unit. The control panel issues an adjusting signal. The power supply unit provides a first power and a second power to the first induction coil and the second induction coil, respectively. The controlling unit generates a control signal to the power supply unit according to the adjusting signal, thereby controlling the first power and the second power. Electrical energy is transmitted to the first induction coil and the second induction coil and the frequency difference between the first power and the second power is greater than 15 kHz or smaller than 1 kHz during a first time interval under control of the controlling unit. No electrical energy is transmitted to one of the first induction coil and the second induction coil during a second time interval under control of the controlling unit.
摘要翻译：加热装置包括第一感应线圈，第二感应线圈，控制面板，电源单元和控制单元。控制面板发出调整信号。电源单元分别向第一感应线圈和第二感应线圈提供第一功率和第二功率。控制单元根据调整信号向电源单元产生控制信号，从而控制第一功率和第二功率。在控制单元的控制下，在第一时间间隔期间，电能传递到第一感应线圈和第二感应线圈，并且第一功率和第二功率之间的频率差大于15kHz或小于1kHz。在控制单元的控制下，在第二时间间隔内不会将电能传递到第一感应线圈和第二感应线圈中的一个。

7. 发明授权

US06532423B2 Method for determining fluid flow characteristic curves of heat-dissipating system 失效
公开(公告)号：US06532423B2
公开(公告)日：2003-03-11
申请号：US09777489
申请日：2001-02-05
申请人： Yin-Yuan Chen , Chia-Kuan Liao , Chih-Jen Chen
发明人： Yin-Yuan Chen , Chia-Kuan Liao , Chih-Jen Chen
IPC分类号： G01F100
CPC分类号： H05K7/20172 , F28F27/00 , H01L23/467 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A method for determining a plurality of fluid flow characteristic curves of a heat-dissipating system, wherein each fluid flow characteristic curve is a relationship curve of one of an air pressure and an air flow and the air pressure and a rotating speed of the heat-dissipating system. The method includes steps of (a) determining a first fluid characteristic curve of the heat-dissipating system at a first condition, (b) obtaining a first variable and a second variable according to the first fluid characteristic curve, (c) calculating relative values of the air pressure, the air flow, the first variable and the second variable for obtaining a plurality of coefficients of a specific equation, (d) determining a third variable and a fourth variable of the heat-dissipating system at a second condition, and (e) replacing the first variable and the second variable of the specific equation with the third variable and the fourth variable respectively for obtaining a second fluid characteristic curve of the heat-dissipating system at the second condition.

8. 发明授权

US07289320B2 Electronic device with waterproof and heat-dissipating structure 有权
标题翻译：电子装置采用防水散热结构
公开(公告)号：US07289320B2
公开(公告)日：2007-10-30
申请号：US11180769
申请日：2005-07-13
申请人： Yung-Cheng Chang , Yin-Yuan Chen , Chien-Feng Chuang
发明人： Yung-Cheng Chang , Yin-Yuan Chen , Chien-Feng Chuang
IPC分类号： H05K7/20
CPC分类号： H05K7/20145
摘要： An electronic device includes a housing, a spacing structure, a printed circuit board and a fan. The housing has first and second openings. The spacing structure is arranged within the housing for partitioning a space within the housing into an air channel and a receptacle. The air channel is in communication with the first and second openings. The printed circuit board is disposed within the receptacle. The fan is disposed within the air channel for inhaling ambient air via the first opening and exhausting the air via the second opening so as to dissipate heat outside the electronic device.
摘要翻译：电子设备包括壳体，间隔结构，印刷电路板和风扇。壳体具有第一和第二开口。间隔结构布置在壳体内，用于将壳体内的空间分隔成空气通道和容器。空气通道与第一和第二开口连通。印刷电路板设置在容器内。风扇设置在空气通道内，用于经由第一开口吸入环境空气，并且经由第二开口排出空气，以便散发电子设备外部的热量。

9. 发明授权

US07215542B2 Electronic device having heat-dissipating structure for socket 有权
标题翻译：具有用于插座的散热结构的电子设备
公开(公告)号：US07215542B2
公开(公告)日：2007-05-08
申请号：US11173580
申请日：2005-07-01
申请人： Yin-Yuan Chen , Ren-Chun Chang , Chen-Yu Yu
发明人： Yin-Yuan Chen , Ren-Chun Chang , Chen-Yu Yu
IPC分类号： H05K7/20
CPC分类号： H05K7/20909
摘要： An electronic device having a heat-dissipating structure for a socket is disclosed. The electronic device comprises a case, a plurality of electronic components disposed in the case, an airflow inlet disposed at a first side of the case, a socket disposed at a second side of the case, wherein the second side is opposite to the first side and the electronic components are disposed between the first side and the second side, and an airflow directing plate disposed between the case and the electronic components and forming an airflow channel with the case for directing a portion of air at the airflow inlet to the socket through the airflow channel so as to dissipate heat of the socket. Through the design of the present invention, the heat of the socket of the electronic device can be dissipated efficiently to conform to the safety standard of the socket temperature.
摘要翻译：公开了一种具有用于插座的散热结构的电子设备。电子设备包括壳体，设置在壳体中的多个电子部件，设置在壳体的第一侧的气流入口，设置在壳体的第二侧的插座，其中第二侧与第一侧相对并且所述电子部件设置在所述第一侧和所述第二侧之间，以及气流引导板，其布置在所述壳体和所述电子部件之间，并且与所述壳体形成气流通道，用于将所述空气入口处的空气的一部分引导到所述插座，气流通道，以消散插座的热量。通过本发明的设计，可以有效地消散电子设备的插座的热量以符合插座温度的安全标准。

10. 发明申请

US20060198104A1 Electronic device with waterproof and heat-dissipating structure 有权
标题翻译：电子装置采用防水散热结构
公开(公告)号：US20060198104A1
公开(公告)日：2006-09-07
申请号：US11180769
申请日：2005-07-13
申请人： Yung-Cheng Chang , Yin-Yuan Chen , Chien-Feng Chuang
发明人： Yung-Cheng Chang , Yin-Yuan Chen , Chien-Feng Chuang
IPC分类号： H05K7/20
CPC分类号： H05K7/20145
摘要： An electronic device includes a housing, a spacing structure, a printed circuit board and a fan. The housing has first and second openings. The spacing structure is arranged within the housing for partitioning a space within the housing into an air channel and a receptacle. The air channel is in communication with the first and second openings. The printed circuit board is disposed within the receptacle. The fan is disposed within the air channel for inhaling ambient air via the first opening and exhausting the air via the second opening so as to dissipate heat outside the electronic device.
摘要翻译：电子设备包括壳体，间隔结构，印刷电路板和风扇。壳体具有第一和第二开口。间隔结构布置在壳体内，用于将壳体内的空间分隔成空气通道和容器。空气通道与第一和第二开口连通。印刷电路板设置在容器内。风扇设置在空气通道内，用于经由第一开口吸入环境空气，并且经由第二开口排出空气，以便散发电子设备外部的热量。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式