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1. 发明授权

US09329647B2 Computing device having a spectrally selective radiation emission device 有权
标题翻译：具有光谱选择性辐射发射装置的计算装置
公开(公告)号：US09329647B2
公开(公告)日：2016-05-03
申请号：US14280954
申请日：2014-05-19
申请人： Microsoft Technology Licensing, LLC
发明人： Andrew Douglas Delano , Timothy Allen Jakoboski
IPC分类号： H05K7/20 , G06F1/20 , G21K5/02
CPC分类号： G06F1/203 , G06F1/1637 , G06F1/26 , G21K5/02 , H05K7/20427
摘要： A computing device having a spectrally selective radiation emission device is described. In one or more implementations, an apparatus includes a housing, one or more electrical components disposed within the housing, and a spectrally selective radiation emission device. The one or more electrical components are configured to generate heat during operation. The spectrally selective radiation emission device is disposed on the housing and configured to emit radiation when heated by the one or more electrical components at one or more wavelengths of electromagnetic energy and reflect radiation at one or more other wavelengths of electromagnetic energy.
摘要翻译：描述了具有光谱选择性辐射发射装置的计算装置。在一个或多个实施方案中，装置包括壳体，设置在壳体内的一个或多个电气部件和光谱选择性辐射发射装置。一个或多个电气部件被配置为在操作期间产生热量。光谱选择性辐射发射装置设置在壳体上并且被配置为当以一个或多个电磁能量波长的一个或多个电气部件加热时发射辐射，并且以一个或多个其它波长的电磁能量反射辐射。

2. 发明申请

US20140272217A1 METHODS AND STRUCTURES FOR THERMAL MANAGEMENT IN AN ELECTRONIC DEVICE 审中-公开
标题翻译：电子设备热管理的方法与结构
公开(公告)号：US20140272217A1
公开(公告)日：2014-09-18
申请号：US13865102
申请日：2013-04-17
申请人： APPLE INC.
发明人： Douglas J. WEBER , Naoto MATSUYUKI
IPC分类号： H05K7/20 , H05K13/00
CPC分类号： H05K13/00 , G02B5/281 , H04M1/0202 , H05K7/20427 , Y10T428/1317
摘要： The described embodiments relate generally to a structure and methods of forming a structure for improving thermal management in an electronic device. The structure including a casing; a cover glass; a multilayer film on an exterior surface of the casing and of the cover glass, adapted to reflect radiation in a first spectral region and to transmit radiation in a second spectral region. In embodiments consistent with the present disclosure a casing for a portable electronic device may include a reflective portion in an interior surface including a hot spot in the electronic device; and an emissive portion in the interior surface including an area non-overlapping a hot spot.
摘要翻译：所描述的实施例大体上涉及形成用于改善电子设备中的热管理的结构的结构和方法。该结构包括壳体; 盖玻璃; 壳体和盖玻璃的外表面上的多层膜，适于反射第一光谱区域中的辐射并在第二光谱区域中透射辐射。在符合本公开的实施例中，用于便携式电子设备的壳体可以包括在包括电子设备中的热点的内表面中的反射部分; 以及内表面中的发光部分，包括不重叠热点的区域。

3. 发明申请

US20080286544A1 Heat exchange enhancement 审中-公开
公开(公告)号：US20080286544A1
公开(公告)日：2008-11-20
申请号：US12138787
申请日：2008-06-13
申请人： Geoffrey Wen-Tai Shuy
发明人： Geoffrey Wen-Tai Shuy
IPC分类号： B32B7/02
CPC分类号： B60Q1/20 , F21S43/14 , F21S45/47 , F21S45/48 , F21V29/51 , F21V29/71 , F21V29/83 , F21Y2115/10 , F28D15/0233 , F28D15/0266 , F28F13/185 , F28F21/04 , H01L23/3731 , H01L23/3735 , H01L2924/0002 , H05K7/20427 , Y10T428/2495 , Y10T428/265 , H01L2924/00
摘要： A heat exchange device that includes a structural section and a thin layer of material attached to a surface of the structural section. The thin layer of material has a thickness less than 100 microns. The combination of the structural section and the thin layer of material has a higher thermal transfer coefficient than the structural section alone, the thermal transfer coefficient representing an ability to exchange thermal energy with an ambient gas.

4. 发明授权

US10881022B2 Thermal interface assembly 有权
公开(公告)号：US10881022B2
公开(公告)日：2020-12-29
申请号：US16032192
申请日：2018-07-11
申请人： TRW AUTOMOTIVE U.S. LLC
发明人： Darryl J. Edwards
IPC分类号： H05K7/20
CPC分类号： H05K7/2039 , H05K7/209 , H05K7/2089 , H05K7/20409 , H05K7/20509 , H05K7/20854 , H05K7/20863 , H05K7/20963 , H05K7/20972 , H05K7/20418 , H05K7/20427 , H05K7/20845 , H05K7/20909
摘要： A thermal interface assembly for transferring heat from a heat generating component to a heat dissipating component. The thermal interface assembly includes a plurality of discrete thermal sheets attached to a resilient pad.

5. 发明申请

US20170111989A1 SHIELDING CASE, PCB AND TERMINAL DEVICE 审中-公开
公开(公告)号：US20170111989A1
公开(公告)日：2017-04-20
申请号：US15077868
申请日：2016-03-22
申请人： Xiaomi Inc.
发明人： Dongliang Wang , Shaojie Wang , Shasha Shi
IPC分类号： H05K1/02
CPC分类号： H05K1/0212 , H05K7/20 , H05K7/2039 , H05K7/20418 , H05K7/20427 , H05K7/20436 , H05K7/20518 , H05K9/0024 , H05K9/0052 , H05K9/0081 , H05K2201/066 , H05K2201/0707 , H05K2201/10371
摘要： Described are a shielding case, a Printed Circuit Board (PCB) and a terminal device. The shielding case includes a first shielding case body (1) and a second shielding case body (2) which are interconnected with each other, wherein the second shielding case body (2) at least partially covers an outside of the first shielding case body (1), and a heat storage material (3) is accommodated between the first shielding case body (1) and the second shielding case body (2).

6. 发明授权

US09591789B2 Power semiconductor module and power module 有权
标题翻译：功率半导体模块和电源模块
公开(公告)号：US09591789B2
公开(公告)日：2017-03-07
申请号：US14364133
申请日：2012-11-09
申请人： Hitachi Automotive Systems, Ltd.
发明人： Eiichi Ide , Eiji Nishioka , Toshiaki Ishii , Junpei Kusukawa , Kinya Nakatsu , Nobutake Tsuyuno , Toshiya Satoh , Masahiko Asano
IPC分类号： H05K7/00 , H05K5/00 , H05K7/20 , H01L23/34 , H01L23/36 , H01L23/433 , H01L23/473 , H01L23/495 , H05K1/02 , H05K7/02
CPC分类号： H05K7/20427 , H01L23/34 , H01L23/36 , H01L23/4334 , H01L23/473 , H01L23/49524 , H01L23/49562 , H01L23/49575 , H01L25/072 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48472 , H01L2224/4903 , H01L2224/49175 , H01L2224/73265 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H05K1/0271 , H05K7/02 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An insulation film that strongly adheres to a power semiconductor module having a resin sealer and a conductor plate and has high thermal conductivity is provided.An insulation layer 700 is provided between a power semiconductor module 302 and a heat dissipation portion 307B. The power semiconductor module 302 includes a resin sealer 348, which covers a circumferential side surface of a conductor plate 315, and a plurality of recesses 348D are provided in the resin sealer 348. The insulation layer 700 is formed of a spray coated film 710, an insulation film 720, and a resin layer 730, and the spray coated film 710 is formed on the surface of the resin sealer 348 including recesses 348D to form a seamless flat surface. The planar size of each of the recesses 348D is greater than the planar size of each flat portion 711, which forms the spray coated film 710.
摘要翻译：绝缘层700设置在功率半导体模块302和散热部分307B之间。功率半导体模块302包括覆盖导体板315的周向侧表面的树脂密封件348和设置在树脂密封件348中的多个凹槽348D。绝缘层700由喷涂膜710形成，绝缘膜720和树脂层730，并且在包括凹槽348D的树脂密封剂348的表面上形成喷涂膜710以形成无缝平坦表面。每个凹槽348D的平面尺寸大于形成喷涂膜710的每个平坦部分711的平面尺寸。

7. 发明申请

US20150257308A1 GRAPHENE-BASED THERMAL MANAGEMENT SYSTEMS 有权
标题翻译：基于石墨的热管理系统
公开(公告)号：US20150257308A1
公开(公告)日：2015-09-10
申请号：US14202451
申请日：2014-03-10
申请人： The Boeing Company
发明人： Angela W. Li , Jeffrey H. Hunt , Wayne R. Howe
IPC分类号： H05K7/20
CPC分类号： H05K7/20427 , H01L23/373 , H01L2924/0002 , H01L2924/00
摘要： In one aspect, thermally managed electronic components are described herein. In some implementations, a thermally managed electronic component comprises an electronic component and a thermal management coating disposed on a surface of the electronic component. The thermal management coating comprises a graphene coating layer disposed on the surface of the component. The graphene coating layer may comprise a layer of aligned carbon nanoparticles. Moreover, the thermal management coating may further comprise an additional layer of aligned carbon nanoparticles disposed on the graphene coating layer. In another aspect, methods of applying a thermal management coating on an electronic component are disclosed. In some implementations, such a method comprises disposing a graphene coating layer on a surface of an electronic component. The graphene coating layer may comprise a layer of aligned carbon nanoparticles. Such a method may further comprise disposing an additional layer of aligned carbon nanoparticles on the graphene coating layer.
摘要翻译：在一个方面，这里描述了热管理的电子部件。在一些实施方案中，热管理的电子部件包括设置在电子部件的表面上的电子部件和热管理涂层。热处理涂层包括设置在部件表面上的石墨烯涂层。石墨烯涂层可以包括一层对准的碳纳米颗粒。此外，热处理涂层还可以包括设置在石墨烯涂层上的附加的对准碳纳米管层。另一方面，公开了在电子部件上施加热处理涂层的方法。在一些实施方案中，这种方法包括在电子部件的表面上设置石墨烯涂层。石墨烯涂层可以包括一层对准的碳纳米颗粒。这种方法可以进一步包括在石墨烯涂层上设置附加的对准的碳纳米管层。

8. 发明申请

US20140313668A1 PROTECTIVE DEVICE 审中-公开
标题翻译：保护装置
公开(公告)号：US20140313668A1
公开(公告)日：2014-10-23
申请号：US13873177
申请日：2013-04-29
申请人： FOXCONN TECHNOLOGY CO., LTD.
发明人： WEI-HANG HSU , JUI-WEN HUNG
IPC分类号： H05K7/20
CPC分类号： H01L23/00 , G06F1/1656 , G06F1/182 , G06F1/203 , H01L23/3677 , H01L23/427 , H01L23/60 , H01L2924/0002 , H05K7/20427 , H05K9/0028 , H01L2924/00
摘要： An exemplary protective device is for protecting an electronic component mounted on a printed circuit board. The protective device includes a protective board covering the electronic component, and a hard carbon film coated on an outer periphery of the protective board. The protective board is made of anti-EMI materials.
摘要翻译：示例性的保护装置用于保护安装在印刷电路板上的电子部件。保护装置包括覆盖电子部件的保护板和涂覆在保护板的外周上的硬碳膜。保护板由抗EMI材料制成。

9. 发明授权

US08581156B2 Apparatus with heating part 失效
标题翻译：带加热部件的装置
公开(公告)号：US08581156B2
公开(公告)日：2013-11-12
申请号：US12674769
申请日：2008-08-28
申请人： Mamoru Yabe
发明人： Mamoru Yabe
IPC分类号： H05B3/02
CPC分类号： H05K7/20427 , F21Y2115/10 , G02F2001/133628
摘要： An apparatus has a chassis has a chassis inner face and a chassis outer face, at least one heating part accommodated in the chassis, wherein at least a portion of the heating part faces the chassis inner face with an internal space therebetween, and a film having a first face and a second face bonded to at least a portion of the heating part facing the chassis inner face. The chassis outer face is located on a side opposite the chassis inner face portion and in contact with an external space and having a radiation film interposed therebetween. The film includes a convex part, a concave part, or a repeated pattern of convex and concave parts in the first face or the second face. At least one of the first face and the second face is in contact with the internal space.
摘要翻译：一种具有底盘的设备具有底盘内表面和底盘外表面，容纳在底盘中的至少一个加热部分，其中加热部件的至少一部分面向底盘内表面，其间具有内部空间，以及具有第一面和第二面，其接合到面对所述底盘内表面的所述加热部的至少一部分。底盘外表面位于与底盘内表面部分相对的一侧并且与外部空间接触并且其间具有辐射膜。该膜在第一面或第二面中包括凸部，凹部或凸部和凹部的重复图案。第一面和第二面中的至少一个与内部空间接触。

10. 发明申请

US20110114630A1 APPARATUS WITH HEATING PART 失效
标题翻译：装置加热部分
公开(公告)号：US20110114630A1
公开(公告)日：2011-05-19
申请号：US12674769
申请日：2008-08-28
申请人： Mamoru Yabe
发明人： Mamoru Yabe
IPC分类号： H05B3/02
CPC分类号： H05K7/20427 , F21Y2115/10 , G02F2001/133628
摘要： An apparatus has a chassis has a chassis inner face and a chassis outer face, at least one heating part accommodated in the chassis, wherein at least a portion of the heating part faces the chassis inner face with an internal space therebetween, and a film having a first face and a second face bonded to at least a portion of the heating part facing the chassis inner face. The chassis outer face is located on a side opposite the chassis inner face portion and in contact with an external space and having a radiation film interposed therebetween. The film includes a convex part, a concave part, or a repeated pattern of convex and concave parts in the first face or the second face. At least one of the first face and the second face is in contact with the internal space.
摘要翻译：一种具有底盘的设备具有底盘内表面和底盘外表面，容纳在底盘中的至少一个加热部分，其中加热部件的至少一部分面向底盘内表面，其间具有内部空间，以及具有第一面和第二面，其接合到面对所述底盘内表面的所述加热部的至少一部分。底盘外表面位于与底盘内表面部分相对的一侧并且与外部空间接触并且其间具有辐射膜。该膜在第一面或第二面中包括凸部，凹部或凸部和凹部的重复图案。第一面和第二面中的至少一个与内部空间接触。

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