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    • 3. 发明申请
    • WAFER HOLDER WITH TAPERED REGION
    • 带有尖端区域的波形支架
    • US20130252424A1
    • 2013-09-26
    • US13426334
    • 2012-03-21
    • Yi-Hung LinLi-Ting WangTze-Liang Lee
    • Yi-Hung LinLi-Ting WangTze-Liang Lee
    • H01L21/306H01L21/324H01L21/302H01L21/683H01L21/477
    • H05B1/0233F27B17/0025F27D5/0037H01L21/306H01L21/477H01L21/67115H01L21/67303H01L21/683H01L21/68735H01L21/68757
    • An apparatus, a system and a method are disclosed. An exemplary apparatus includes a wafer holder including a first portion and a second portion. The first and second portions are formed of the same continuous material. The first portion includes a first upper surface and a first lower surface, and the second portion including a second upper surface and a second lower surface. The apparatus further includes an interface between the first and second portions. The interface provides for a transition such that the first upper surface of the first portion tends toward the second upper surface of the second portion. The apparatus further includes a tapered region formed in the first portion. The tapered region starts at a radial distance from a center line of the wafer holder and terminates at the interface. The tapered region has an initial thickness that gradually decreases to a final thickness.
    • 公开了一种装置,系统和方法。 示例性装置包括具有第一部分和第二部分的晶片保持器。 第一和第二部分由相同的连续材料形成。 第一部分包括第一上表面和第一下表面,第二部分包括第二上表面和第二下表面。 该装置还包括第一和第二部分之间的界面。 界面提供了使得第一部分的第一上表面趋向于第二部分的第二上表面的过渡。 该装置还包括形成在第一部分中的锥形区域。 锥形区域从距离晶片保持器的中心线的径向距离开始,并且在界面处终止。 锥形区域具有逐渐减小到最终厚度的初始厚度。
    • 4. 发明授权
    • Wafer holder with tapered region
    • 晶圆座具有锥形区域
    • US09099514B2
    • 2015-08-04
    • US13426334
    • 2012-03-21
    • Yi-Hung LinLi-Ting WangTze-Liang Lee
    • Yi-Hung LinLi-Ting WangTze-Liang Lee
    • A47G19/08H01L21/687H01L21/683H01L21/477H01L21/306H01L21/673
    • H05B1/0233F27B17/0025F27D5/0037H01L21/306H01L21/477H01L21/67115H01L21/67303H01L21/683H01L21/68735H01L21/68757
    • An apparatus, a system and a method are disclosed. An exemplary apparatus includes a wafer holder including a first portion and a second portion. The first and second portions are formed of the same continuous material. The first portion includes a first upper surface and a first lower surface, and the second portion including a second upper surface and a second lower surface. The apparatus further includes an interface between the first and second portions. The interface provides for a transition such that the first upper surface of the first portion tends toward the second upper surface of the second portion. The apparatus further includes a tapered region formed in the first portion. The tapered region starts at a radial distance from a center line of the wafer holder and terminates at the interface. The tapered region has an initial thickness that gradually decreases to a final thickness.
    • 公开了一种装置,系统和方法。 示例性装置包括具有第一部分和第二部分的晶片保持器。 第一和第二部分由相同的连续材料形成。 第一部分包括第一上表面和第一下表面,第二部分包括第二上表面和第二下表面。 该装置还包括第一和第二部分之间的界面。 界面提供了使得第一部分的第一上表面趋向于第二部分的第二上表面的过渡。 该装置还包括形成在第一部分中的锥形区域。 锥形区域从距离晶片保持器的中心线的径向距离开始,并且在界面处终止。 锥形区域具有逐渐减小到最终厚度的初始厚度。