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    • 8. 发明授权
    • Method of multi-angled bump processing for magnetic pole fabrication and systems thereof
    • 用于磁极制造的多角度凸块加工方法及其系统
    • US08085497B2
    • 2011-12-27
    • US12341834
    • 2008-12-22
    • Wen-Chien David HsiaoVladimir NikitinAron PentekSue Siyang ZhangYi Zheng
    • Wen-Chien David HsiaoVladimir NikitinAron PentekSue Siyang ZhangYi Zheng
    • G11B5/127
    • G11B5/3116G11B5/3163
    • A system according to one embodiment includes a magnetic pole; a bump structure above the pole, the bump structure having a first surface oriented at a first angle between 1° and 89° from a plane of deposition of the pole, and a second surface oriented at a second angle between 1° and 89° from the plane of deposition of the pole, wherein the second angle is greater than the first angle; and a shield above the bump structure. A method according to one embodiment includes forming a bump layer above a magnetic pole; removing a portion of the bump layer for forming a step therein; and milling the bump layer for defining thereon a first surface oriented at a first angle between 1° and 89° from a plane of deposition of the bump layer, and a second surface oriented at a second angle between 1° and 89° from the plane of deposition of the bump layer, wherein the second angle is greater than the first angle.
    • 根据一个实施例的系统包括磁极; 所述凸起结构具有从所述极的沉积平面以1°至89°之间的第一角度定向的第一表面,并且所述第一表面以与所述极的沉积的平面成1°至89°之间的第二角度定向 所述极的沉积平面,其中所述第二角度大于所述第一角度; 和凸块结构之上的屏蔽。 根据一个实施例的方法包括在磁极上形成凸起层; 去除所述凸起层的一部分以在其中形成台阶; 并且研磨所述凸起层,以在其上限定从凸起层的沉积平面以1°至89°之间的第一角度定向的第一表面,以及从该平面以1°至89°之间的第二角度定向的第二表面 所述凸起层的沉积,其中所述第二角度大于所述第一角度。
    • 9. 发明申请
    • METHOD OF MULTI-ANGLED BUMP PROCESSING FOR MAGNETIC POLE FABRICATION AND SYSTEMS THEREOF
    • 用于磁极制造及其系统的多重保护加工方法
    • US20100157474A1
    • 2010-06-24
    • US12341834
    • 2008-12-22
    • Wen-Chien David HsiaoVladimir NikitinAron PentekSue Siyang ZhangYi Zheng
    • Wen-Chien David HsiaoVladimir NikitinAron PentekSue Siyang ZhangYi Zheng
    • G11B5/127
    • G11B5/3116G11B5/3163
    • A system according to one embodiment includes a magnetic pole; a bump structure above the pole, the bump structure having a first surface oriented at a first angle between 1° and 89° from a plane of deposition of the pole, and a second surface oriented at a second angle between 1° and 89° from the plane of deposition of the pole, wherein the second angle is greater than the first angle; and a shield above the bump structure. A method according to one embodiment includes forming a bump layer above a magnetic pole; removing a portion of the bump layer for forming a step therein; and milling the bump layer for defining thereon a first surface oriented at a first angle between 1° and 89° from a plane of deposition of the bump layer, and a second surface oriented at a second angle between 1° and 89° from the plane of deposition of the bump layer, wherein the second angle is greater than the first angle.
    • 根据一个实施例的系统包括磁极; 所述凸起结构具有从所述极的沉积平面以1°至89°之间的第一角度定向的第一表面,并且所述第一表面以与所述极的沉积的平面成1°至89°之间的第二角度定向 所述极的沉积平面,其中所述第二角度大于所述第一角度; 和凸块结构之上的屏蔽。 根据一个实施例的方法包括在磁极上形成凸起层; 去除所述凸起层的一部分以在其中形成台阶; 并且研磨所述凸起层,以在其上限定从凸起层的沉积平面以1°至89°之间的第一角度定向的第一表面,以及从该平面以1°至89°之间的第二角度定向的第二表面 所述凸起层的沉积,其中所述第二角度大于所述第一角度。