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1. 发明申请

US20060231750A1 Image sensor module package 审中-公开
标题翻译：图像传感器模块包装
公开(公告)号：US20060231750A1
公开(公告)日：2006-10-19
申请号：US11364324
申请日：2006-03-01
申请人： Yeong-Ching Chao , An-Hong Liu , Hsiang-Ming Huang , Yi-Chang Lee , Yao-Jung Lee
发明人： Yeong-Ching Chao , An-Hong Liu , Hsiang-Ming Huang , Yi-Chang Lee , Yao-Jung Lee
IPC分类号： H01J5/02
CPC分类号： H01L27/14618 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H01L2224/0401
摘要： An image sensor module package is disclosed. A plurality of connecting pads are formed on a first surface of a glass substrate having and located outside a light entering area. A via-redistribution layer is formed on an opposing second surface of the glass substrate. A plurality of vias penetrate the glass substrate to electrically connect the via-redistribution layer with the connecting pads. A bumped image sensor chip is flip-chip attached to the second surface of the glass substrate so that a sensing area of the image sensor chip is corresponding to a light entering area of the glass substrate without blocking the via-redistribution layer. The connecting pads may connect to a plurality of solder balls or a FPC. In one embodiment, a plurality of passive components can be placed on the via-redistribution layer to enhance the electrical performance and the functions of the image sensor module package.
摘要翻译：公开了一种图像传感器模块封装。在具有并位于光进入区域外的玻璃基板的第一表面上形成多个连接焊盘。通孔再分配层形成在玻璃基板的相对的第二表面上。多个通孔穿透玻璃基板以将通孔再分配层与连接垫电连接。将碰撞的图像传感器芯片倒装安装在玻璃基板的第二表面上，使得图像传感器芯片的感测区域对应于玻璃基板的光进入区域而不阻塞通路再分配层。连接焊盘可以连接到多个焊球或FPC。在一个实施例中，可以将多个无源部件放置在通孔再分配层上，以增强图像传感器模块封装的电性能和功能。

2. 发明申请

US20060125498A1 MODULARIZED PROBE CARD FOR HIGH FREQUENCY PROBING 有权
标题翻译：用于高频探测的模块化探头卡
公开(公告)号：US20060125498A1
公开(公告)日：2006-06-15
申请号：US11011200
申请日：2004-12-15
申请人： An-Hong Liu , Yeong-Her Wang , Yeong-Ching Chao , Yao-Jung Lee
发明人： An-Hong Liu , Yeong-Her Wang , Yeong-Ching Chao , Yao-Jung Lee
IPC分类号： G01R31/02
CPC分类号： G01R31/2889 , G01R1/07378 , G01R31/2822
摘要： A modularized probe head for high frequency probing is provided. The probe head mainly includes a probe head, a mounting board and an interposer between the probe head and the mounting board. The probe head has a plurality of cavities on its back surface. A plurality of decoupling components are installed inside the cavities and are electrically coupled to the ground/power circuitry of the probe head via by-pass circuitry. The interposer has a bottom surface corresponding to the back surface of the probe head, and includes a plurality of contact ends on the bottom surface. Some of the contact ends electrically contact the decoupling components and electrically coupled to the ground plane of the mounting board.
摘要翻译：提供了一种用于高频探测的模块化探头。探头主要包括探头，安装板和探头与安装板之间的插入件。探头在其后表面上具有多个空腔。多个去耦组件安装在空腔内，并通过旁通电路电耦合到探头的接地/电源电路。插入器具有对应于探针头的后表面的底面，并且在底面上包括多个接触端。一些接触端与去耦组件电接触并电耦合到安装板的接地平面。

3. 发明申请

US20060086899A1 Structure of image sensor package 审中-公开
标题翻译：图像传感器封装的结构
公开(公告)号：US20060086899A1
公开(公告)日：2006-04-27
申请号：US11254676
申请日：2005-10-21
申请人： Yeong-Ching Chao , An-Hong Liu , Yao-Jung Lee
发明人： Yeong-Ching Chao , An-Hong Liu , Yao-Jung Lee
IPC分类号： H01J5/02
CPC分类号： H01L27/14618 , H01L31/0203 , H01L2224/32225
摘要： An image sensor package comprises a carrier, an image sensor chip, and a transparent substrate where the carrier has a chip cavity and a plurality of first pads formed around the chip cavity. A plurality of bonding pads are formed on the active surface of the image sensor chip. The image sensor chip is disposed in the chip cavity. A plurality of probe leads are formed on the transparent substrate. The probe leads have a plurality of free tips. When the transparent substrate is adhered to the carrier, the image sensor chip is hermetically sealed, and the free tips are electrically contacted to the bonding pads of the image sensor chip, and the probe leads are electrically connected to the first pads of the carrier. The height variations of the image sensor chip in the chip cavity can be offset by the probe leads.
摘要翻译：图像传感器封装包括载体，图像传感器芯片和透明基板，其中载体具有芯片空腔和形成在芯片空腔周围的多个第一焊盘。在图像传感器芯片的有效表面上形成多个接合焊盘。图像传感器芯片设置在芯片空腔中。在透明基板上形成多个探针引线。探针引线具有多个自由尖端。当透明基板粘附到载体上时，图像传感器芯片被气密地密封，并且自由尖端与图像传感器芯片的接合焊盘电接触，并且探针引线电连接到载体的第一焊盘。芯片腔中的图像传感器芯片的高度变化可以被探针引线抵消。

4. 发明申请

US20060043538A1 Bump structure of an opto-electronic chip 审中-公开
标题翻译：凹凸结构的光电芯片
公开(公告)号：US20060043538A1
公开(公告)日：2006-03-02
申请号：US11208595
申请日：2005-08-23
申请人： Yi-Chang Lee , An-Hong Liu , Yeong-Ching Chao , Yao-Jung Lee
发明人： Yi-Chang Lee , An-Hong Liu , Yeong-Ching Chao , Yao-Jung Lee
IPC分类号： H01L23/58 , H01L23/02
CPC分类号： H01L27/14636 , H01L24/10 , H01L2224/05001 , H01L2224/05022 , H01L2224/05567 , H01L2224/05572 , H01L2224/05573 , H01L2224/05624 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/00014
摘要： An opto-electronic chip includes a plurality of multi-level bumps thereon, each consisting of multiple plated layers. The opto-electronic chip has a plurality of bonding pads and an photoelectric effecting region on its active surface. Each multi-level bump comprises at least an electroless-plated nickel (Ni) layer and an electroless-plated gold (Au) layer wherein the nickel layers cover the bonding pads and the gold layers are formed on the tops of the nickel layers. Furthermore, the thickness of the nickel layers is larger than that of the gold layers. The UBM processes in conventional bumping processes are not needed so that the contaminations or damages to the photoelectric effecting region of the opto-electronic chip due to UBM can be eliminated.
摘要翻译：光电芯片包括多个多层凸起，每个由多个镀层组成。光电芯片在其有源表面上具有多个接合焊盘和光电效应区域。每个多级凸块包括至少一种无电镀镍（Ni）层和无电镀金（Au）层，其中镍层覆盖接合焊盘，并且金层形成在镍层的顶部上。此外，镍层的厚度大于金层的厚度。常规碰撞过程中的UBM工艺不需要，可以消除由UBM引起的光电芯片光电效应区域的污染或损坏。

5. 发明申请

US20060086890A1 Package structure of image sensor device 审中-公开
标题翻译：图像传感器装置的封装结构
公开(公告)号：US20060086890A1
公开(公告)日：2006-04-27
申请号：US11254660
申请日：2005-10-21
申请人： Yeong-Ching Chao , An-Hong Liu , Yao-Jung Lee
发明人： Yeong-Ching Chao , An-Hong Liu , Yao-Jung Lee
IPC分类号： H01L27/00
CPC分类号： H01L27/14618 , H01L2224/48091 , H01L2224/73265 , H01L2924/16195 , H01L2924/00014
摘要： An image sensor package mainly includes a substrate cover having a chip cavity, an image sensor chip, a flexible circuit, and a transparent carrier. The flexible circuit is attached to the transparent carrier. The image sensor chip is flip-chip mounted on the flexible circuit, and then the substrate cover is mounted on the flexible circuit. The flexible circuit has a plurality of first leads electrically connected to bumps of the image sensor chip, and a plurality of second leads to inner terminals of the substrate cover, so that the electrical connection is established between the image sensor chip and the substrate cover through the flexible circuit. A plurality of outer terminals are formed on the opposing surface of the substrate cover corresponding to the inner terminals. Accordingly, the image sensor package provides the excellent electrical transmission and the protection of the image sensor chip. Preferably, a liquid sealant, NCP, or ACP is disposed between the substrate cover and the flexible circuit for hermetically sealing the image sensor chip in the chip cavity. In another embodiment, a glass substrate can replace the assembly of the flexible circuit and the transparent carrier.
摘要翻译：图像传感器封装主要包括具有芯片腔的衬底盖，图像传感器芯片，柔性电路和透明载体。柔性电路连接到透明载体上。图像传感器芯片被倒装安装在柔性电路上，然后将基板盖安装在柔性电路上。柔性电路具有与图像传感器芯片的凸块电连接的多个第一引线和多个第二引线到基板盖的内部端子，从而在图像传感器芯片和基板盖之间建立电连接灵活电路。多个外部端子形成在与内部端子对应的基板盖的相对表面上。因此，图像传感器封装提供优异的电传输和图像传感器芯片的保护。优选地，液体密封剂NCP或ACP设置在衬底盖和柔性电路之间，用于密封芯片腔中的图像传感器芯片。在另一个实施例中，玻璃基板可以代替柔性电路和透明载体的组件。

6. 发明授权

US07129730B2 Probe card assembly 有权
标题翻译：探头卡组合
公开(公告)号：US07129730B2
公开(公告)日：2006-10-31
申请号：US11011104
申请日：2004-12-15
申请人： An-Hong Liu , Yeong-Her Wang , Yeong-Ching Chao , Yao-Jung Lee
发明人： An-Hong Liu , Yeong-Her Wang , Yeong-Ching Chao , Yao-Jung Lee
IPC分类号： G01R31/02
CPC分类号： G01R31/2889 , G01R1/07314 , H05K3/325 , H05K3/4007 , H05K2201/0367 , H05K2201/0373 , H05K2201/09481 , H05K2201/10378
摘要： A modularized probe head assembly mainly includes a probe head, an interposer and a probe head carrier with guide pins. The probe head has a plurality of first through holes. The interposer has a plurality of second through holes corresponding in location to the first through holes. The probe head carrier is configured to secure the PCB of a probe card and jointing the probe head with the interposer. A via is formed under a pad on the interposer. A plurality of stud bumps are formed on the pad. After assembling of the probe card, the guide pins pass through the first and second through holes and the stud bumps electrically contact the interconnect pad of the probe head.
摘要翻译：模块化探头头组件主要包括探针头，插入器和带引导针的探针头托架。探头具有多个第一通孔。插入器具有与位于第一通孔对应的多个第二通孔。探针头托架被配置为固定探针卡的PCB并将探头与插入器连接。通孔形成在插入件上的垫下方。在该垫上形成多个柱状凸块。在组装探针卡之后，引导销通过第一通孔和第二通孔，柱形凸块与探针头的互连焊盘电接触。

7. 发明授权

US06946860B2 Modularized probe head 有权
标题翻译：模块化探头
公开(公告)号：US06946860B2
公开(公告)日：2005-09-20
申请号：US10680230
申请日：2003-10-08
申请人： Shih-Jye Cheng , An-Hong Liu , Yeong-Her Wang , Yeong-Ching Chao , Yao-Jung Lee
发明人： Shih-Jye Cheng , An-Hong Liu , Yeong-Her Wang , Yeong-Ching Chao , Yao-Jung Lee
IPC分类号： G01R31/28 , G01R31/02 , G01R31/26
CPC分类号： G01R31/2887
摘要： A modularized probe head for modularly assembling on a probe card is configured for probing a semiconductor wafer under test. The probe head includes a silicon substrate having an active surface and an opposing back surface. The back surface of the silicon substrate is attached on a holder. The silicon substrate has a plurality of peripheral bond pads and contact pads on its active surface. At least a probing chip is mounted on the active surface of the silicon substrate. The probing chip has probing tips and side electrodes. The side electrodes are connected with the contact pads by means of solder material. The peripheral bonding pads of the silicon substrate are connected with a flexible printed circuit for electrically connecting to a multi-layer printed circuit board of a probe card.
摘要翻译：用于模块化组装在探针卡上的模块化探头被配置用于探测被测半导体晶片。探头包括具有活性表面和相对背面的硅衬底。硅衬底的背面附着在支架上。硅衬底在其有源表面上具有多个外围接合焊盘和接触焊盘。至少探测芯片安装在硅衬底的有源表面上。探测芯片具有探测尖端和侧面电极。侧电极通过焊料与接触焊盘连接。硅衬底的周边接合焊盘与用于电连接到探针卡的多层印刷电路板的柔性印刷电路连接。

8. 发明授权

US07696443B2 Electronic device with a warped spring connector 有权
标题翻译：具有翘曲弹簧连接器的电子设备
公开(公告)号：US07696443B2
公开(公告)日：2010-04-13
申请号：US11188860
申请日：2005-07-26
申请人： Yi-Chang Lee , An-Hong Liu , Yeong-Her Wang , Yeong-Ching Chao , Yao-Jung Lee
发明人： Yi-Chang Lee , An-Hong Liu , Yeong-Her Wang , Yeong-Ching Chao , Yao-Jung Lee
IPC分类号： H01R12/04 , H05K1/11
CPC分类号： H01L24/72 , G01R1/06727 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H01L2924/3025 , H01L2924/351 , H01R13/2407 , H05K1/0216 , H05K3/4092 , H01L2924/00
摘要： An electronic device comprises a substrate and at least a warped spring connector. The substrate has a signal bonding pad and a ground plane. The warped spring connector is disposed on the substrate and is connected to the bonding pad. The warped spring connector includes at least a ground lead electrically connected to the ground plane, a dielectric layer on the ground lead, and a transmitting lead on the dielectric layer. The transmitting lead is bonded to the bonding pad. The ground lead is isolated from and close to the transmitting lead to solve cross-talk and noise problem. Furthermore, the coefficient of thermal expansion of the transmitting lead is different from that of the dielectric layer or the ground lead such that the warped spring connector has a suspending end suspending away from the substrate.
摘要翻译：电子设备包括基板和至少一个翘曲的弹簧连接器。衬底具有信号焊盘和接地层。翘曲弹簧连接器设置在基板上并连接到接合垫。翘曲弹簧连接器至少包括电连接到接地平面的接地引线，接地引线上的电介质层和介电层上的传输引线。传输引线接合到焊盘。接地线与发射线隔离并靠近发射线，以解决串扰和噪声问题。此外，传输引线的热膨胀系数与电介质层或接地引线的热膨胀系数不同，使得翘曲弹簧连接器具有悬挂远离基板的悬挂端。

9. 发明授权

US07088118B2 Modularized probe card for high frequency probing 有权
标题翻译：用于高频探测的模块化探头卡
公开(公告)号：US07088118B2
公开(公告)日：2006-08-08
申请号：US11011200
申请日：2004-12-15
申请人： An-Hong Liu , Yeong-Her Wang , Yeong-Ching Chao , Yao-Jung Lee
发明人： An-Hong Liu , Yeong-Her Wang , Yeong-Ching Chao , Yao-Jung Lee
IPC分类号： G01R31/02
CPC分类号： G01R31/2889 , G01R1/07378 , G01R31/2822
摘要： A modularized probe head for high frequency probing is provided. The probe head mainly includes a probe head, a mounting board and an interposer between the probe head and the mounting board. The probe head has a plurality of cavities on its back surface. A plurality of decoupling components are installed inside the cavities and are electrically coupled to the ground/power circuitry of the probe head via by-pass circuitry. The interposer has a bottom surface corresponding to the back surface of the probe head, and includes a plurality of contact ends on the bottom surface. Some of the contact ends electrically contact the decoupling components and electrically coupled to the ground plane of the mounting board.
摘要翻译：提供了一种用于高频探测的模块化探头。探头主要包括探头，安装板和探头与安装板之间的插入件。探头在其后表面上具有多个空腔。多个去耦组件安装在空腔内，并通过旁通电路电耦合到探头的接地/电源电路。插入器具有对应于探针头的后表面的底面，并且在底面上包括多个接触端。一些接触端与去耦组件电接触并电耦合到安装板的接地平面。

10. 发明申请

US20060125501A1 Modularized probe head 有权
标题翻译：模块化探头
公开(公告)号：US20060125501A1
公开(公告)日：2006-06-15
申请号：US11011104
申请日：2004-12-15
申请人： An-Hong Liu , Yeong-Her Wang , Yeong-Ching Chao , Yao-Jung Lee
发明人： An-Hong Liu , Yeong-Her Wang , Yeong-Ching Chao , Yao-Jung Lee
IPC分类号： G01R31/02
CPC分类号： G01R31/2889 , G01R1/07314 , H05K3/325 , H05K3/4007 , H05K2201/0367 , H05K2201/0373 , H05K2201/09481 , H05K2201/10378
摘要： A modularized probe head assembly mainly includes a probe head, an interposer and a probe head carrier with guide pins. The probe head has a plurality of first through holes. The interposer has a plurality of second through holes corresponding in location to the first through holes. The probe head carrier is configured to secure the PCB of a probe card and jointing the probe head with the interposer. A via is formed under a pad on the interposer. A plurality of stud bumps are formed on the pad. After assembling of the probe card, the guide pins pass through the first and second through holes and the stud bumps electrically contact the interconnect pad of the probe head.
摘要翻译：模块化探头头组件主要包括探针头，插入器和带引导针的探针头托架。探头具有多个第一通孔。插入器具有与位于第一通孔对应的多个第二通孔。探针头托架被配置为固定探针卡的PCB并将探头与插入器连接。通孔形成在插入件上的垫下方。在该垫上形成多个柱状凸块。在组装探针卡之后，引导销通过第一通孔和第二通孔，柱形凸块与探针头的互连焊盘电接触。

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