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    • 1. 发明申请
    • Multistage Adjusting Device
    • 多级调节装置
    • US20090008196A1
    • 2009-01-08
    • US12119318
    • 2008-05-12
    • Yasuyoshi SuzukiShingo Shibayama
    • Yasuyoshi SuzukiShingo Shibayama
    • F16F9/44
    • F16F9/462B62K25/04B62K25/08B62K2025/048F16F2230/0041
    • A cylindrical body, a plurality of grooves formed on an inner wall surface of the cylindrical body, and a device main body provided with an adjusting body disposed in the cylindrical body and rotatable in an inner circumferential direction of the cylindrical body can be provided. Further, the grooves can be formed continuously or intermittently along a longitudinal direction of the cylindrical body. A plurality of control members can be disposed along a longitudinal direction of the adjusting body. The control member can be provided with a ball projected from a side surface of the adjusting body and urged to engage with the grooves. At least one ball provided for one control member can be located between adjacent grooves and a ball provided for another control member can be engaged with one of the groove.
    • 可以提供一种圆柱体,形成在圆柱体的内壁表面上的多个凹槽,以及设置有设置在圆筒体中并可在圆柱体的内圆周方向上旋转的调节体的装置主体。 此外,可以沿圆柱体的纵向方向连续地或间断地形成凹槽。 多个控制构件可以沿着调节体的纵向方向设置。 控制构件可以设置有从调节体的侧表面突出的球,并被推压以与凹槽接合。 设置用于一个控制构件的至少一个球可以位于相邻的凹槽之间,并且用于另一个控制构件的球可以与凹槽中的一个接合。
    • 5. 发明授权
    • Inspection apparatus for semiconductor packages
    • 半导体封装检测装置
    • US6005965A
    • 1999-12-21
    • US56234
    • 1998-04-07
    • Yukihiro TsudaTakashi KuriharaTakahiro UedaTomikazu TanukiYasuyoshi Suzuki
    • Yukihiro TsudaTakashi KuriharaTakahiro UedaTomikazu TanukiYasuyoshi Suzuki
    • G01N21/88G06K9/00
    • G01N21/95684G01N21/88G01B2210/56
    • A semiconductor package inspection apparatus which varies the emission spectrum of an oblique imaging illumination and a plan view imaging illumination from each other, and which comprises a first filter which is provided on the optical path from a semiconductor package to an oblique imaging device, and which passes light from the oblique imaging illumination and blocks light from the plan view imaging illumination; a second filter which is provided on the optical path from a semiconductor package to the plan view imaging device, and which passes light from the plan view imaging illumination and blocks light from the oblique imaging illumination; and a control unit which simultaneously turns on the oblique imaging and plan view imaging illumination, and inspects terminals of the semiconductor package based on image data of the oblique imaging device and plan view imaging device.
    • 一种半导体封装检查装置,其将倾斜成像照明的发射光谱和平面图成像照明彼此改变,并且包括设置在从半导体封装到倾斜成像装置的光路上的第一滤光器, 使来自倾斜成像照明的光从平面图成像照明中阻挡光; 第二滤光器,设置在从半导体封装到平面图像成像装置的光路上,并且从平面图像成像照明中通过光,并阻止来自倾斜成像照明的光; 以及控制单元,其同时打开倾斜成像和平面图成像照明,并且基于倾斜成像装置和平面图像成像装置的图像数据检查半导体封装的端子。
    • 6. 发明授权
    • Method for producing a soft magnetic material
    • 软磁性材料的制造方法
    • US07179337B2
    • 2007-02-20
    • US10687894
    • 2003-10-17
    • Yasuyoshi SuzukiYurio NomuraYoshiaki NishijimaShoji MiyakeYukio MakinoTeppei Satoh
    • Yasuyoshi SuzukiYurio NomuraYoshiaki NishijimaShoji MiyakeYukio MakinoTeppei Satoh
    • H01F1/03
    • B22F3/105B22F1/0088B22F2999/00H01F41/0246B22F2202/11B22F2202/13
    • The invention provides a method for preparing a soft magnetic material which meets demands for low iron loss, high density, high strength and high productivity. The method comprises a surface oxidation step of forming oxide films on the surfaces of a soft magnetic powder, a step of preparing a molding compound of the soft magnetic powder by mixing a soft magnetic powder and a binder with a predetermined blending ratio, a press molding step of press-molding the molding compound of the soft magnetic powder into a predetermined shape, and a sintering step of sintering the press-molded soft magnetic powder to produce a soft magnetic material, wherein a millimeter wave sintering apparatus or a discharge plasma sintering apparatus is used as a heating means in the surface oxidation step or in the sintering step. Thereby, energy of millimeter waves or discharge plasma acts locally on oxidized surface portions having a large electric resistance of the soft magnetic powder, the surfaces of the soft magnetic powder are locally heated at a temperature near the melting point, and oxidation of the surfaces of the soft magnetic powder (formation of an oxide film) and sintering (diffusional joining between oxide films) are promoted.
    • 本发明提供一种制备软磁性材料的方法,该方法满足低铁损,高密度,高强度和高生产率的要求。 该方法包括在软磁性粉末的表面上形成氧化膜的表面氧化步骤,通过以预定的混合比例混合软磁性粉末和粘合剂来制备软磁性粉末的模塑料的步骤,压制成型 将软磁性粉末的模塑料压制成预定形状的步骤,以及将压制成型的软磁性粉末烧结以制造软磁性材料的烧结步骤,其中,使用毫米波烧结装置或放电等离子体烧结装置 在表面氧化步骤或烧结步骤中用作加热装置。 因此,毫米波或放电等离子体的能量局部地在软磁性粉末的电阻较大的氧化表面部分上作用,软磁性粉末的表面在接近熔点的温度下被局部加热, 促进软磁性粉末(氧化膜的形成)和烧结(氧化膜之间的扩散接合)。
    • 9. 发明授权
    • Optical connector assembly
    • 光连接器总成
    • US5163109A
    • 1992-11-10
    • US499549
    • 1990-06-27
    • Minoru OkugawaMasakazu MoritokiYasuyoshi Suzuki
    • Minoru OkugawaMasakazu MoritokiYasuyoshi Suzuki
    • B24B19/22B24B37/04G02B6/38G02B6/42
    • G02B6/3863B24B19/226G02B6/4202G02B6/4292G02B6/3893G02B6/3897
    • An optical connector assembly (1) for connecting an optical fiber (9), an optical element (4) (light-emitting element or light-receiving element), and an electric circuit together. A bolt (32) of an optical fiber-mounting fitting in which the optical fiber (9) is inserted in the hole of an elastic seal and a bolt (31), is screwed into a threaded hole formed in a housing (2) of the plug (1) that accommodates the optical element (4) in order to couple the optical fiber (9) to the plug (1). The connection between the optical element (4) and the electric circuit is accomplished by a jack (20) and the plug (1) is provided with a lock mechanism based on a push-type lever (20), featuring improved sealing performance against water, oil, dust and dirt.
    • PCT No.PCT / JP89 / 01105 Sec。 371日期:1990年6月27日 102(e)日期1990年6月27日PCT提交1989年10月26日PCT公布。 出版物WO90 / 04801 日期:1990年5月3日。一种用于将光纤(9),光学元件(4)(发光元件或光接收元件)和电路连接在一起的光学连接器组件(1)。 将光纤(9)插入弹性密封件的孔中的光纤安装配件的螺栓(32)和螺栓(31)旋入到形成在壳体(2)的螺纹孔中 所述插头(1)容纳所述光学元件(4)以将所述光纤(9)耦合到所述插头(1)。 光学元件(4)和电路之间的连接由插座(20)实现,并且插头(1)设置有基于推式杆(20)的锁定机构,其具有改进的对水的密封性能 ,油,灰尘和污垢。