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    • 1. 发明授权
    • Inspection apparatus for semiconductor packages
    • 半导体封装检测装置
    • US6005965A
    • 1999-12-21
    • US56234
    • 1998-04-07
    • Yukihiro TsudaTakashi KuriharaTakahiro UedaTomikazu TanukiYasuyoshi Suzuki
    • Yukihiro TsudaTakashi KuriharaTakahiro UedaTomikazu TanukiYasuyoshi Suzuki
    • G01N21/88G06K9/00
    • G01N21/95684G01N21/88G01B2210/56
    • A semiconductor package inspection apparatus which varies the emission spectrum of an oblique imaging illumination and a plan view imaging illumination from each other, and which comprises a first filter which is provided on the optical path from a semiconductor package to an oblique imaging device, and which passes light from the oblique imaging illumination and blocks light from the plan view imaging illumination; a second filter which is provided on the optical path from a semiconductor package to the plan view imaging device, and which passes light from the plan view imaging illumination and blocks light from the oblique imaging illumination; and a control unit which simultaneously turns on the oblique imaging and plan view imaging illumination, and inspects terminals of the semiconductor package based on image data of the oblique imaging device and plan view imaging device.
    • 一种半导体封装检查装置,其将倾斜成像照明的发射光谱和平面图成像照明彼此改变,并且包括设置在从半导体封装到倾斜成像装置的光路上的第一滤光器, 使来自倾斜成像照明的光从平面图成像照明中阻挡光; 第二滤光器,设置在从半导体封装到平面图像成像装置的光路上,并且从平面图像成像照明中通过光,并阻止来自倾斜成像照明的光; 以及控制单元,其同时打开倾斜成像和平面图成像照明,并且基于倾斜成像装置和平面图像成像装置的图像数据检查半导体封装的端子。