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1. 发明授权

US06217990B1 Multilayer circuit board having no local warp on mounting surface thereof 失效
标题翻译：在其安装表面上没有局部翘曲的多层电路板
公开(公告)号：US06217990B1
公开(公告)日：2001-04-17
申请号：US09073139
申请日：1998-05-06
申请人： Yasutomi Asai , Takashi Nagasaka , Shinji Ota , Takashi Yamazaki , Shinya Terao , Syoichi Nakagawa
发明人： Yasutomi Asai , Takashi Nagasaka , Shinji Ota , Takashi Yamazaki , Shinya Terao , Syoichi Nakagawa
IPC分类号： B32B300
CPC分类号： H05K1/0271 , H01L23/49822 , H01L23/49838 , H01L2224/16 , H01L2924/09701 , H01L2924/15192 , H05K1/0306 , H05K3/4611 , H05K3/4629 , H05K2201/09781 , H05K2201/10674 , Y10T428/24926
摘要： A multilayer circuit board for holding a flip chip thereon includes laminated first to fourth substrates. A first pattern integrated portion having a locally high pattern density is provided on the second substrate. Further, on the fourth substrate which is disposed on an opposite side of the second substrate with respect to a center in a laminated direction of the circuit board, a second pattern integrated portion having a locally high pattern density is disposed to correspond to the first pattern integrated portion. Accordingly, a local warp can be prevented from being produced on the mounting surface of the multilayer circuit board when the circuit board is manufactured by baking.
摘要翻译：用于保持倒装芯片的多层电路板包括层叠的第一至第四基板。具有局部高图案密度的第一图案集成部分设置在第二基板上。此外，在相对于电路板的层叠方向的中心设置在第二基板的相对侧的第四基板上，具有局部高图案密度的第二图案一体化部分设置成对应于第一图案集成部分。因此，当通过烘烤制造电路板时，可以防止在多层电路板的安装表面上产生局部翘曲。

2. 发明授权

US06376906B1 Mounting structure of semiconductor element 失效
标题翻译：半导体元件的安装结构
公开(公告)号：US06376906B1
公开(公告)日：2002-04-23
申请号：US09021989
申请日：1998-02-11
申请人： Yasutomi Asai , Shinji Ota , Takashi Nagasaka
发明人： Yasutomi Asai , Shinji Ota , Takashi Nagasaka
IPC分类号： H01L2304
CPC分类号： H01L23/49838 , H01L23/49822 , H01L24/28 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/16225 , H01L2224/16235 , H01L2224/2919 , H01L2224/29339 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/484 , H01L2224/48599 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48699 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/73204 , H01L2224/73265 , H01L2224/85385 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2924/01005 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/15192 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/00014 , H01L2924/0665 , H01L2924/3512 , H01L2924/00 , H01L2924/00012
摘要： In a mounting structure of a flip chip IC, the flip chip IC is mounted on an alumina laminated substrate through conductive lands of the substrate and bumps of the flip chip IC. A space between the flip chip IC and the substrate is filled with resin. Further, inspection lands are provided on the substrate for inspecting the flip chip IC, and are electrically connected to the conductive lands through vias and inside wires provided in the substrate. That is, the inspection lands are connected to the conductive lands to bypath an edge portion of the resin. As a result, separation of the resin from the substrate can be prevented.
摘要翻译：在倒装芯片IC的安装结构中，倒装芯片IC通过衬底的导电焊盘和倒装芯片IC的凸块安装在氧化铝层压衬底上。倒装芯片IC和基板之间的空间填充有树脂。此外，在基板上设置检查台以检查倒装芯片IC，并且通过设置在基板中的通孔和内部电线电连接到导电焊盘。也就是说，检查台面与树脂的边缘部分连接到导电焊盘。结果，可以防止树脂与基板分离。

3. 发明授权

US5754093A Thick-film printed substrate including an electrically connecting member and method for fabricating the same 失效
标题翻译：包括电连接部件的厚膜印刷基板及其制造方法
公开(公告)号：US5754093A
公开(公告)日：1998-05-19
申请号：US638145
申请日：1996-04-26
申请人： Shinji Ota , Takashi Nagasaka
发明人： Shinji Ota , Takashi Nagasaka
IPC分类号： H05K1/16 , H01C7/00 , H01C17/06 , H01C17/065 , H01L27/01 , H01C10/12
CPC分类号： H01C7/003 , H01C17/06566 , H01L27/013
摘要： A thick-film resistor in a thick-film printed substrate, the resistance of which is maintained at an appropriate value, is disclosed. In a thick-film printed substrate formed by printing a thick-film conductor and a resistor of lanthanum boride type on a ceramic substrate and then sintering, an intermediate resistor layer of lanthanum boride type is provided between the thick-film conductor and the resistor of lanthanum boride type. Reaction of glass composition contained in the thick-film conductor is suppressed, and resistance abnormality is prevented during sintering by causing the intermediate resistor layer of lanthanum boride type to be interposed.
摘要翻译：公开了一种厚膜印刷基板中的厚膜电阻器，其电阻保持在适当的值。在通过在陶瓷基板上印刷厚膜导体和硼化镧电阻器然后烧结而形成的厚膜印刷基板中，在厚膜导体和电阻器的电阻器之间设置硼化镧型中间电阻层硼化镧型。抑制包含在厚膜导体中的玻璃组合物的反应，并且通过使硼化镧型中间电阻层插入而在烧结期间阻止电阻异常。

4. 发明授权

US07622219B2 Battery pack 失效
标题翻译：电池组
公开(公告)号：US07622219B2
公开(公告)日：2009-11-24
申请号：US10596716
申请日：2005-08-03
申请人： Shinji Ota , Katsuyuki Shirasawa , Toshio Yamashitafuji , Takeshi Ishimaru , Kenjin Masumoto , Hiroaki Imanishi
发明人： Shinji Ota , Katsuyuki Shirasawa , Toshio Yamashitafuji , Takeshi Ishimaru , Kenjin Masumoto , Hiroaki Imanishi
IPC分类号： H01M2/00 , H01M2/08 , H01M2/02
CPC分类号： H01M2/1061 , H01M10/42 , H01M10/425
摘要： A battery pack (10) includes: a battery (1); a circuit substrate (5) having a charge/discharge safety circuit and arranged on one end face (3) of the battery; and an end case (6) in which an external connection terminal (7) is set. In this battery pack, the circuit substrate (5) is arranged inside the end case (6), and the end case (6) is secured to the battery by screws (12) with a screw head (12a) extending through and engaging with the end case (6) at both ends and tips of the screw (12) being engaged into the end face (3) at both ends of the battery (1). This achieves a compact battery pack with a reduced connection resistance, while achieving both high reliability and productivity.
摘要翻译：电池组（10）包括：电池（1）; 具有充电/放电安全电路并布置在电池的一个端面（3）上的电路基板（5）和设置了外部连接端子（7）的端部壳体（6）。在该电池组中，电路基板（5）布置在端部壳体（6）的内部，并且端部壳体（6）通过螺钉（12）固定到电池，螺钉头（12a）延伸穿过并与螺钉（12）两端的末端壳体（6）和螺钉（12）的末端在电池（1）的两端处接合到端面（3）中。这实现了具有降低的连接电阻的紧凑型电池组，同时实现了高可靠性和高生产率。

5. 发明申请

US20120129017A1 BATTERY PACK AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：电池组及其制造方法
公开(公告)号：US20120129017A1
公开(公告)日：2012-05-24
申请号：US13386802
申请日：2011-01-18
申请人： Shinji Ota
发明人： Shinji Ota
IPC分类号： H01M10/42 , H01M10/04
CPC分类号： H01M10/4257 , H01M2/0215 , H01M2/0404 , H01M2/34 , H01M2200/00 , Y10T29/49108 , Y10T29/4911
摘要： A battery pack and a manufacturing method thereof enabling the streamlining of assembly work are provided. This battery pack comprises a printed circuit board 6 including wiring, lead plates 7, 10 that are fixed to the printed circuit board 6 and that electrically connect the wiring of the printed circuit board 6 and both electrodes 4, 5 of a battery 2, and a screw 12 that presses the lead plates 7, 10 so as to maintain a state of electrically connecting of the lead plates 7, 10 to both electrodes 4, 5 of the battery 2 by being screwed into the battery 2.
摘要翻译：提供一种电池组及其制造方法，能够精简组装工作。该电池组包括印刷电路板6，其包括布线，引线板7,10，其固定到印刷电路板6，并且电连接印刷电路板6的布线和电池2的两个电极4,5，以及压紧引线板7,10的螺钉12，以便通过拧入电池2来保持将引线板7,10与电池2的两个电极4,5电连接的状态。

6. 发明申请

US20090077399A1 CONTROLLING APPARATUS, CONTROLLING METHOD, COMPUTER READABLE MEDIUM, IMAGE FORMING APPARATUS AND INFORMATION PROCESSING APPARATUS 有权
标题翻译：控制装置，控制方法，计算机可读介质，图像形成装置和信息处理装置
公开(公告)号：US20090077399A1
公开(公告)日：2009-03-19
申请号：US12053331
申请日：2008-03-21
申请人： Goro Noda , Kouhei Hashimoto , Shinji Ota , Masahiko Harada , Toru Hada , Kohei Tanaka , Atsushi Takeshita
发明人： Goro Noda , Kouhei Hashimoto , Shinji Ota , Masahiko Harada , Toru Hada , Kohei Tanaka , Atsushi Takeshita
IPC分类号： G06F1/32
CPC分类号： G06F1/3284 , G03G15/5004 , G06F1/3203 , Y02D10/159
摘要： The controlling apparatus is provided with: a memory that stores application software; a setting part that sets an operational manner related to power consumption of an apparatus running the application software, corresponding to the application software stored in the memory; and a controller that controls the power consumption of the apparatus according to the operational manner set by the setting part.
摘要翻译：该控制装置设有：存储应用软件的存储器; 设置部，其对应于存储在所述存储器中的应用软件，设定与运行所述应用软件的装置的功耗有关的操作方式; 以及控制器，其根据由设置部设置的操作方式来控制设备的功耗。

7. 发明申请

US20080165386A1 Information processing device, information collection device, information collection system, and method 有权
标题翻译：信息处理装置，信息采集装置，信息采集系统和方法
公开(公告)号：US20080165386A1
公开(公告)日：2008-07-10
申请号：US11907606
申请日：2007-10-15
申请人： Masahiko Harada , Shinji Ota , Toru Hada , Kohei Tanaka , Goro Noda , Atsushi Takeshita
发明人： Masahiko Harada , Shinji Ota , Toru Hada , Kohei Tanaka , Goro Noda , Atsushi Takeshita
IPC分类号： G06F15/00
CPC分类号： H04N1/00344 , H04N1/0035 , H04N1/00427 , H04N1/00962 , H04N1/00973 , H04N1/32106 , H04N2201/0039 , H04N2201/0049 , H04N2201/0094 , H04N2201/0098 , H04N2201/3204 , H04N2201/3278
摘要： An information processing device includes: a memory that stores function identifiers assigned to functions built into the information processing device, and function identifiers assigned to functions not built into the information processing device; a display controller that causes a display unit to display the function identifiers stored in the memory; a manipulation unit that accepts manipulation for specifying one of the function identifiers displayed by the display controller; and a transmission unit that transmits, if the one of the function identifiers which has been specified by the manipulation is assigned to one of the functions not built into the information processing device, the specified one of the information identifiers or an information item indicating one of the functions to which is assigned one of the information identifiers which has been specified by the manipulation, to a predetermined device.
摘要翻译：一种信息处理设备，包括：存储器，其存储分配给内置于信息处理设备中的功能的功能标识符，以及功能标识符，分配给未内置到信息处理设备中的功能; 使显示单元显示存储在存储器中的功能标识符的显示控制器; 操作单元，其接受用于指定显示控制器显示的功能标识之一的操作; 以及发送单元，如果已经通过操纵指定的功能标识符中的一个被分配给未内置到信息处理设备中的功能之一，则指定的一个信息标识符或指示一个信息标识符被分配了通过操作指定的信息标识符之一的功能被发送到预定的设备。

8. 发明授权

US5321382A Thermal type flow rate sensor 失效
标题翻译：热式流量传感器
公开(公告)号：US5321382A
公开(公告)日：1994-06-14
申请号：US910844
申请日：1992-07-07
申请人： Masahito Mizukoshi , Shinji Ota , Norikazu Hosokawa , Yasushi Kohno
发明人： Masahito Mizukoshi , Shinji Ota , Norikazu Hosokawa , Yasushi Kohno
IPC分类号： G01F1/68 , G01F1/684 , H01C1/08 , H01C3/04 , H01C3/12
CPC分类号： G01F1/684 , G01F1/68
摘要： A thermal type flow rate sensor comprising a sensor chip having a rectangular shape. The sensor chip is supported between supporting pins through ribbon-like leads connected to opposite ends of the sensor chip. The ribbon-like leads serve to correctly locate the surface of the sensor chip with respect to flow of fluid. The surfaces of the sensor chip is formed with a thin film heater. A heater portion of the thin film heater comprises a plurality of straight portions and a plurality of turn portions connecting the straight portions to each other. Each turn portion is formed in a smoothly curved shape to avoid the concentration of electric currents and is disposed at an end portion of the sensor chip which has a comparatively low temperature. This structure is effective in preventing generation of cracks in the turn portions. In addition, the plurality of straight portions are alternatively inclined to effectively utilize the surface of the sensor chip to form a long heating portion.
摘要翻译：一种热式流量传感器，包括具有矩形形状的传感器芯片。传感器芯片通过连接到传感器芯片的相对端的带状引线支撑在支撑引脚之间。带状引线用于相对于流体流正确定位传感器芯片的表面。传感器芯片的表面形成有薄膜加热器。薄膜加热器的加热器部分包括多个直线部分和连接直线部分的多个转弯部分。每个匝部形成为平滑弯曲的形状，以避免电流的集中，并且设置在具有较低温度的传感器芯片的端部。该结构对于防止匝部产生裂纹是有效的。此外，多个直线部分交替地倾斜以有效地利用传感器芯片的表面以形成长的加热部分。

9. 发明授权

US08107117B2 Information processing device, information collection device, information collection system, and method for management of information related functions 有权
标题翻译：信息处理装置，信息采集装置，信息采集系统，信息管理功能方法
公开(公告)号：US08107117B2
公开(公告)日：2012-01-31
申请号：US11907606
申请日：2007-10-15
申请人： Masahiko Harada , Shinji Ota , Toru Hada , Kohei Tanaka , Goro Noda , Atsushi Takeshita
发明人： Masahiko Harada , Shinji Ota , Toru Hada , Kohei Tanaka , Goro Noda , Atsushi Takeshita
IPC分类号： G06K15/00 , G06F3/12
CPC分类号： H04N1/00344 , H04N1/0035 , H04N1/00427 , H04N1/00962 , H04N1/00973 , H04N1/32106 , H04N2201/0039 , H04N2201/0049 , H04N2201/0094 , H04N2201/0098 , H04N2201/3204 , H04N2201/3278
摘要： An information processing device includes: a memory that stores function identifiers assigned to functions built into the information processing device, and function identifiers assigned to functions not built into the information processing device; a display controller that causes a display unit to display the function identifiers stored in the memory; a manipulation unit that accepts manipulation for specifying one of the function identifiers displayed by the display controller; and a transmission unit that transmits, if the one of the function identifiers which has been specified by the manipulation is assigned to one of the functions not built into the information processing device, the specified one of the information identifiers or an information item indicating one of the functions to which is assigned one of the information identifiers which has been specified by the manipulation, to a predetermined device.
摘要翻译：一种信息处理设备，包括：存储器，其存储分配给内置于信息处理设备中的功能的功能标识符，以及功能标识符，分配给未内置到信息处理设备中的功能; 使显示单元显示存储在存储器中的功能标识符的显示控制器; 操作单元，其接受用于指定显示控制器显示的功能标识之一的操作; 以及发送单元，如果已经通过操纵指定的功能标识符中的一个被分配给未内置到信息处理设备中的功能之一，则指定的一个信息标识符或指示一个信息标识符被分配了通过操作指定的信息标识符之一的功能被发送到预定的设备。

10. 发明申请

US20110304031A1 SEMICONDUCTOR DEVICE EQUIPPED WITH BONDING WIRES AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE EQUIPPED WITH BONDING WIRES 有权
标题翻译：配有连接线的半导体器件和配有接线的半导体器件的制造方法
公开(公告)号：US20110304031A1
公开(公告)日：2011-12-15
申请号：US13157491
申请日：2011-06-10
申请人： Teiji SHINDO , Shinji Ota
发明人： Teiji SHINDO , Shinji Ota
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L23/60 , H01L23/3107 , H01L23/3192 , H01L23/49838 , H01L23/5223 , H01L24/04 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L2224/02166 , H01L2224/04042 , H01L2224/05553 , H01L2224/06133 , H01L2224/06135 , H01L2224/45015 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/49173 , H01L2224/49175 , H01L2224/78313 , H01L2224/85181 , H01L2224/85205 , H01L2224/859 , H01L2924/01013 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/1424 , H01L2924/1427 , H01L2924/1431 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H01L2924/00 , H01L2924/00014 , H01L2924/00015 , H01L2924/00012
摘要： Disclosed is a semiconductor device including a printed-circuit board which includes a plurality of first electrodes, a plurality of second electrodes and a semiconductor chip on which a plurality of first connection pads are aligned in a first line being disposed along an outer circumference side of a top surface and a plurality of second connection pads are aligned in a second line being disposed inside of and apart from the first line, when the semiconductor chip is seen from above, and any of the plurality of first connection pads are used for a power voltage terminal and a system reset terminal of the semiconductor device.
摘要翻译：公开了一种半导体器件，其包括印刷电路板，该印刷电路板包括多个第一电极，多个第二电极和半导体芯片，多个第一连接焊盘沿着第一线的外周侧沿第一线排列，当从上方观察半导体芯片时，顶表面和多个第二连接焊盘在第二线中排列，第二线设置在第一线的内部并与第一线分离，并且多个第一连接焊盘中的任一个用于功率电压端子和半导体器件的系统复位端子。

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