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1. 发明授权

US5914536A Semiconductor device and soldering portion inspecting method therefor 失效
标题翻译：半导体器件及其焊接部分检查方法
公开(公告)号：US5914536A
公开(公告)日：1999-06-22
申请号：US678536
申请日：1996-07-05
申请人： Yasushi Shizuki , Yuji Iseki , Naoko Ono , Kunio Yoshihara , Masayuki Saito , Hiroshi Yamada , Kazuki Tateyama
发明人： Yasushi Shizuki , Yuji Iseki , Naoko Ono , Kunio Yoshihara , Masayuki Saito , Hiroshi Yamada , Kazuki Tateyama
IPC分类号： G01R31/04 , H01L21/60 , H01L21/66 , H01L23/485 , H01L23/498 , H05K1/02 , H05K1/11 , H05K1/18 , H05K3/34 , H05K3/36 , H01L23/48
CPC分类号： H01L24/13 , G01R31/048 , H01L23/49816 , H01L24/16 , H01L24/81 , H05K3/3436 , H05K3/3442 , H05K3/3452 , H01L2224/05568 , H01L2224/13099 , H01L2224/131 , H01L2224/16058 , H01L2224/16225 , H01L2224/171 , H01L2224/48091 , H01L2224/48227 , H01L2224/81801 , H01L24/48 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/0101 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01054 , H01L2924/01074 , H01L2924/01079 , H01L2924/014 , H01L2924/10336 , H01L2924/12041 , H01L2924/12042 , H01L2924/15311 , H01L2924/16152 , H01L2924/19105 , H05K1/0203 , H05K1/0269 , H05K2201/0367 , H05K2201/09381 , H05K2201/09427 , H05K2201/0989 , H05K2201/10674 , H05K2201/10727 , H05K2201/10969 , H05K2203/0465 , H05K3/3431 , H05K3/368 , Y02P70/613
摘要： A semiconductor device includes a wiring board having a main surface and a plurality of pad electrodes formed on the main surface, a rectangular semiconductor element having a main surface facing the main surface of the wiring board and mounted on the main surface of the wiring board, a solder resist formed to surround the semiconductor element with a preset distance therefrom on the main surface of the wiring board, a plurality of terminal electrodes formed on the end portion of the main surface of the semiconductor element, and a plurality of solder bumps for electrically connecting the plurality of pad electrodes to the plurality of terminal electrodes with a gap provided between the main surface of the wiring board and the main surface of the semiconductor element, wherein each of the plurality of pad electrodes includes at least a portion which extends from substantially under a corresponding one of the plurality of terminal electrodes of the semiconductor element to the solder resist lying outside the semiconductor element and each of the plurality of solder bumps includes a portion extending over part of a corresponding one of the plurality of pads which lies outside the semiconductor element.
摘要翻译：半导体器件包括具有主表面和形成在主表面上的多个焊盘电极的布线板，具有面向布线板的主表面的主表面并且安装在布线板的主表面上的矩形半导体元件，在该布线基板的主面上形成有围绕半导体元件与预定距离的阻焊剂，形成于该半导体元件的主面的端部的多个端子电极和多个用于电连接的焊料凸块将所述多个焊盘电极连接到所述多个端子电极，所述间隙设置在所述布线板的主表面和所述半导体元件的主表面之间，其中所述多个焊盘电极中的每一个包括至少一部分，在半导体元件的多个端子电极中的对应的一个到焊料re 位于半导体元件外侧的多个焊料块中的每一个包括在位于半导体元件外部的多个焊盘中相应的一个焊盘的一部分上延伸的部分。

2. 发明授权

US5818113A Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US5818113A
公开(公告)日：1998-10-06
申请号：US713846
申请日：1996-09-12
申请人： Yuji Iseki , Yasushi Shizuki , Hiroshi Yamada , Takashi Togasaki , Kunio Yoshihara
发明人： Yuji Iseki , Yasushi Shizuki , Hiroshi Yamada , Takashi Togasaki , Kunio Yoshihara
IPC分类号： H01L21/56 , H01L21/60 , H01L23/13 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/81 , H01L21/563 , H01L23/13 , H01L24/28 , H01L2224/16225 , H01L2224/16227 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/81801 , H01L2224/83102 , H01L2224/92125 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01033 , H01L2924/01039 , H01L2924/01087 , H01L2924/0132 , H01L2924/014 , H01L2924/10329 , H01L2924/1423 , H01L2924/15151 , H01L2924/3011
摘要： A semiconductor device wherein a sealing resin is filled in a space between an interconnecting wiring board and a semiconductor chip after the semiconductor chip is flip chip-mounted on the wiring board in which at least a non-planar region consisting of a through hole, a concave portion or a convex portion, or a region exhibiting poor wettability to the sealing resin is formed on the surface of the wiring board or the semiconductor chip so as to provide a void in the sealed resin filled between the wiring board and the semiconductor chip for the purpose of minimizing any bad influence from the sealing resin on the interconnecting wirings or elements formed on the semiconductor chip.
摘要翻译：一种半导体器件，其中在半导体芯片倒装芯片安装在布线板上之后，在互连线路板和半导体芯片之间的空间中填充密封树脂，其中至少由通孔，在该布线板或半导体芯片的表面上形成凹部或凸部，或者对密封树脂具有差的润湿性的区域，以便在填充在布线板和半导体芯片之间的密封树脂中提供空隙最小化密封树脂对形成在半导体芯片上的互连布线或元件的不良影响的目的。

3. 发明授权

US5959363A Semiconductor device with improved encapsulating resin 失效
公开(公告)号：US5959363A
公开(公告)日：1999-09-28
申请号：US93728
申请日：1998-06-09
申请人： Hiroshi Yamada , Takasi Togasaki , Masayuki Saito , Soichi Honma , Miki Mori , Kazuki Tateyama
发明人： Hiroshi Yamada , Takasi Togasaki , Masayuki Saito , Soichi Honma , Miki Mori , Kazuki Tateyama
IPC分类号： H01L21/56 , H01L23/31 , H01L21/60 , H01L23/28
CPC分类号： H01L23/3135 , H01L21/563 , H01L23/3121 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/13099 , H01L2224/16225 , H01L2224/16227 , H01L2224/26175 , H01L2224/27013 , H01L2224/29034 , H01L2224/29111 , H01L2224/2919 , H01L2224/32057 , H01L2224/32225 , H01L2224/48091 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/83051 , H01L2224/83102 , H01L2224/83104 , H01L2224/83191 , H01L2224/83192 , H01L2224/83385 , H01L2224/92125 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01045 , H01L2924/01046 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/04953 , H01L2924/15151 , H01L2924/15787 , H01L2924/1579 , H01L2924/181 , H01L2924/3025 , H01L2924/3511
摘要： A semiconductor device comprising a wiring circuit board and a semiconductor chip mounted through a bump electrode on the circuit board, a space between the circuit board and the semiconductor chip as well as a periphery of the semiconductor chip being encapsulated with a resin containing a filler. The resin is constituted by a first resin disposed in a region surrounded by bump electrodes positioned on the outermost periphery of the semiconductor chip, and by a second resin disposed in a region not surrounded by bump electrodes positioned on the outermost periphery of the semiconductor chip, the first and second resins being distinct from each other in at least one feature selected from a content, a maximum particle diameter and an average particle diameter of the filler.

4. 发明授权

US5864178A Semiconductor device with improved encapsulating resin 失效
标题翻译：具有改进的封装树脂的半导体器件
公开(公告)号：US5864178A
公开(公告)日：1999-01-26
申请号：US580978
申请日：1996-01-03
申请人： Hiroshi Yamada , Takasi Togasaki , Masayuki Saito , Soichi Honma , Miki Mori , Kazuki Tateyama
发明人： Hiroshi Yamada , Takasi Togasaki , Masayuki Saito , Soichi Honma , Miki Mori , Kazuki Tateyama
IPC分类号： H01L21/56 , H01L23/31 , H01L21/60 , H01L23/28
CPC分类号： H01L23/3135 , H01L21/563 , H01L23/3121 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/13099 , H01L2224/16225 , H01L2224/16227 , H01L2224/26175 , H01L2224/27013 , H01L2224/29034 , H01L2224/29111 , H01L2224/2919 , H01L2224/32057 , H01L2224/32225 , H01L2224/48091 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/83051 , H01L2224/83102 , H01L2224/83104 , H01L2224/83191 , H01L2224/83192 , H01L2224/83385 , H01L2224/92125 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01045 , H01L2924/01046 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/04953 , H01L2924/15151 , H01L2924/15787 , H01L2924/1579 , H01L2924/181 , H01L2924/3025 , H01L2924/3511
摘要： A semiconductor device comprising a wiring circuit board and a semiconductor chip mounted through a bump electrode on the circuit board, a space between the circuit board and the semiconductor chip as well as a periphery of the semiconductor chip being encapsulated with a resin containing a filler. The resin is constituted by a first resin disposed in a region surrounded by bump electrodes positioned on the outermost periphery of the semiconductor chip, and by a second resin disposed in a region not surrounded by bump electrodes positioned on the outermost periphery of the semiconductor chip, the first and second resins being distinct from each other in at least one feature selected from a content, a maximum particle diameter and an average particle diameter of the filler.
摘要翻译：一种半导体器件，包括布线电路板和通过电路板上的凸块电极安装的半导体芯片，电路板和半导体芯片之间的空间以及半导体芯片的外围被包含填料的树脂封装。该树脂由设置在位于半导体芯片的最外周上的凸起电极包围的区域中的第一树脂，以及设置在不包围位于半导体芯片的最外周边的凸块电极的区域中的第二树脂构成，第一和第二树脂在选自填料的含量，最大粒径和平均粒径的至少一个特征中彼此不同。

5. 发明授权

US5018051A IC card having circuit modules for mounting electronic components 失效
标题翻译：具有用于安装电子部件的电路模块的IC卡
公开(公告)号：US5018051A
公开(公告)日：1991-05-21
申请号：US291252
申请日：1988-12-28
申请人： Hiroshi Yamada , Masayuki Ohuchi , Masayuki Saito , Akinori Hongu
发明人： Hiroshi Yamada , Masayuki Ohuchi , Masayuki Saito , Akinori Hongu
IPC分类号： H05K1/02 , B42D15/10 , G06K19/077 , H01L23/538 , H05K1/18
CPC分类号： H01L23/5388 , G06K19/07743 , G06K19/07745 , H05K1/185 , H01L2224/24227 , H01L2924/15153 , H01L2924/15165
摘要： An IC card is disclosed which comprises a card-shaped main substrate having a surface on which recess portions are formed and an edge portion having a connector layer with an external connector terminal pattern formed thereon, circuit modules embedded in the recess portions in main substrate, each module having electronic components including IC chips, a chip capacitor and a thin D.C. battery unit, and a double-layered wiring structure for providing electric connection between the electronic components and the connector terminal pattern. The double-layered wiring structure comprises a first wiring layer formed on the main substrate to cover the circuit modules and a second wiring layer formed insulatively above the former wiring layer. The first wiring layer has a first wiring pattern that extends in a first direction of the main substrate to be coupled to the electronic components. The second wiring layer has a second wiring pattern that extends in a second direction of the main substrate to be coupled to the first wiring pattern and the connector terminal pattern.
摘要翻译：公开了一种IC卡，其包括具有形成有凹部的表面的卡形主基板和具有形成在其上的外部连接器端子图案的连接器层的边缘部分，嵌入主基板的凹部中的电路模块，每个模块具有包括IC芯片，片状电容器和薄DC电池单元的电子部件，以及用于在电子部件和连接器端子图案之间提供电连接的双层布线结构。双层布线结构包括形成在主基板上以覆盖电路模块的第一布线层和绝缘地形成在前布线层上方的第二布线层。第一布线层具有在主基板的第一方向上延伸以耦合到电子部件的第一布线图案。第二布线层具有在主基板的第二方向上延伸以与第一布线图案和连接器端子图案耦合的第二布线图案。

6. 发明授权

US10859932B2 Toner, toner accommodating unit, and image forming apparatus 有权
公开(公告)号：US10859932B2
公开(公告)日：2020-12-08
申请号：US15522567
申请日：2015-10-08
申请人： Tsuyoshi Sugimoto , Shinya Nakayama , Hiroshi Yamada , Hideyuki Santo , Ryuta Chiba , Suzuka Amemori , Kohsuke Nagata
发明人： Tsuyoshi Sugimoto , Shinya Nakayama , Hiroshi Yamada , Hideyuki Santo , Ryuta Chiba , Suzuka Amemori , Kohsuke Nagata
IPC分类号： G03G9/087
摘要： A toner, including: a polyester resin, wherein the polyester resin has a structure represented by any one of formulas 1) to 3) below: 1) R1-(NHCONH-R2)n-, 2) R1-(NHCOO-R2)n-, and 3) R1-(OCONH-R2)n-, where n is 3 or more, R1 represents an aromatic organic group or an aliphatic organic group, and R2 represents a group derived from a resin that is polyester formed of polycarboxylic acid, polyol, or both thereof; or that is a modified polyester obtained by modifying polyester with isocyanate.

7. 发明授权

US10303072B2 Toner, developer, and image forming device 有权
公开(公告)号：US10303072B2
公开(公告)日：2019-05-28
申请号：US15889461
申请日：2018-02-06
申请人： Akira Tanaka , Hiroyuki Takeda , Junichi Awamura , Hiroshi Yamada , Daichi Hisakuni , Yasuo Kamada
发明人： Akira Tanaka , Hiroyuki Takeda , Junichi Awamura , Hiroshi Yamada , Daichi Hisakuni , Yasuo Kamada
IPC分类号： G03G9/087 , C08G63/42 , C08G63/20 , G03G15/00 , C08G63/195 , C08G63/16 , C08G63/66 , C08G18/75 , C08G18/42
摘要： A toner is provided. The toner contains a polyester resin. The toner has a glass transition temperature (Tg1st) at first temperature rising of differential scanning calorimetry (DSC) of from 45° C. to 65° C. The toner includes a component insoluble in tetrahydrofuran (THF) having two glass transition temperatures (Tga1st and Tgb1st) at the first temperature rising of DSC, where Tga1st is in a range of −45° C. to 5° C. and Tgb1st is in a range of 45° C. to 70° C. The toner includes a component soluble in THF having a glass transition temperature (Tg2nd) at second temperature rising of DSC of from 40° C. to 65° C.

8. 发明授权

US09785074B2 Polyester resin for toner, toner, developer, and image formation device 有权
公开(公告)号：US09785074B2
公开(公告)日：2017-10-10
申请号：US15116478
申请日：2015-01-06
申请人： Kohsuke Nagata , Shinya Nakayama , Tsuyoshi Sugimoto , Hiroshi Yamada , Susumu Chiba , Shinsuke Nagai , Suzuka Amemori
发明人： Kohsuke Nagata , Shinya Nakayama , Tsuyoshi Sugimoto , Hiroshi Yamada , Susumu Chiba , Shinsuke Nagai , Suzuka Amemori
IPC分类号： G03G9/08 , G03G9/087 , C08G63/12 , C08G63/133 , G03G15/08
CPC分类号： G03G9/08755 , C08G63/12 , C08G63/133 , G03G9/08793 , G03G9/08795 , G03G9/08797 , G03G15/08
摘要： A polyester resin for a toner, the polyester resin including: a segment derived from an alcohol component; and a segment derived from a carboxylic acid component, wherein the alcohol component includes a trivalent or higher aliphatic alcohol, and wherein the polyester resin satisfies Expressions (1) to (3) below: 500 ≤ Weight ⁢ ⁢ average ⁢ ⁢ molecular ⁢ ⁢ weight ⁢ ⁢ ( Mw ) ( Valence ⁢ ⁢ of ⁢ ⁢ the ⁢ ⁢ trivalent ⁢ ⁢ or higher ⁢ ⁢ aliphatic ⁢ ⁢ alcohol ) × ( Amount ⁢ ⁢ of ⁢ ⁢ the ⁢ ⁢ trivalent ⁢ ⁢ or higher ⁢ ⁢ aliphatic ⁢ ⁢ alcohol ) ≤ 4 , 000 ; Expression ⁢ ⁢ ( 1 ) 4,000≦Weight average molecular weight (Mw)≦25,000 Expression (2); and 0.5≦(Amount of the trivalent or higher aliphatic alcohol)≦6.5 Expression (3), where, in the Expressions (1) and (3), the Amount of the trivalent or higher aliphatic alcohol denotes a percent by mole of the trivalent or higher aliphatic alcohol relative to the alcohol component.

9. 发明授权

US09492309B2 Nasal cavity insertion device 有权
标题翻译：鼻腔插入装置
公开(公告)号：US09492309B2
公开(公告)日：2016-11-15
申请号：US13582213
申请日：2011-03-01
申请人： Hiroshi Yamada , Yosuke Taniguchi , Yoshiki Hattori , Kenji Hioki , Kae Fujiwara
发明人： Hiroshi Yamada , Yosuke Taniguchi , Yoshiki Hattori , Kenji Hioki , Kae Fujiwara
IPC分类号： A61F5/56 , A61M16/04 , A61F2/94
CPC分类号： A61F5/56 , A61F2/94 , A61M16/0406 , A61M16/0461
摘要： A nasal cavity insertion device is provided that includes a tubular main body part, at least one elastically deforming part disposed on the outer peripheral surface of the tubular main body part, and a water soluble holding part. The water soluble holding part holds the elastically deforming part in a diameter-reduced state.
摘要翻译：提供了一种鼻腔插入装置，其包括管状主体部，设置在管状主体部的外周面上的至少一个弹性变形部和水溶性保持部。水溶性保持部将弹性变形部保持在直径缩小状态。

10. 发明授权

US09475430B2 Vehicle image processing apparatus and vehicle image processing method 有权
标题翻译：车辆图像处理装置和车辆图像处理方法
公开(公告)号：US09475430B2
公开(公告)日：2016-10-25
申请号：US12907314
申请日：2010-10-19
申请人： Asako Kitaura , Seiya Shimizu , Hiroshi Yamada
发明人： Asako Kitaura , Seiya Shimizu , Hiroshi Yamada
IPC分类号： H04N7/18 , B60R1/00 , G06T5/00 , G06T3/40
CPC分类号： B60R1/00 , B60K35/00 , B60K2350/106 , B60R2300/105 , B60R2300/602 , G06T3/005 , G06T3/0056 , G06T3/4038 , G06T5/006 , G06T2207/30252 , H04N7/18 , H04N7/181
摘要： A vehicle image processing apparatus includes: a group of cameras; a drawing unit that converts a captured image into an image viewed along a line of sight running from a predetermined position in a predetermined direction; a viewing-line-of-sight changing unit that detects whether a first line of sight is switched to a second line of sight; and a viewing-line-of-sight generation/updating unit that acquires parameters concerning the first and second lines of sight after detecting the switching and generates a parameter which is gradually changed from the parameter of the first line of sight to the parameter of the second line of sight. Moreover, the drawing unit generates, on the basis of the gradually changed parameter, an image which is gradually changed from an image viewed along the first line of sight to an image viewed along the second line of sight.
摘要翻译：车辆图像处理装置包括：一组相机; 绘制单元，其将捕获的图像转换成沿着从预定方向的预定位置运行的视线观察的图像; 观察视线改变单元，其检测第一视线是否切换到第二视线; 以及观察视线生成/更新单元，其在检测到切换之后获取与第一和第二视线有关的参数，并生成从第一视线的参数逐渐变化为参数的参数第二线视线此外，绘图单元基于逐渐改变的参数生成从沿着第一视线观看的图像逐渐变为沿着第二视线观看的图像的图像。

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