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    • 4. 发明授权
    • Package apparatus of power semiconductor device
    • 功率半导体器件封装设备
    • US08872313B2
    • 2014-10-28
    • US13322336
    • 2009-05-26
    • Takayuki UshioYoshihisa OguriAkira GotoJyunya Kanazawa
    • Takayuki UshioYoshihisa OguriAkira GotoJyunya Kanazawa
    • B65D81/113B65D5/50B65D85/38
    • B65D5/5061B65D85/38
    • A package apparatus is for packaging a power semiconductor device that includes a substrate formed, a mold part molded on the substrate, and electrode terminals extended from the mold part to a side opposite from the substrate by a predetermined length; includes: a holding unit that has insertion slots and is to holding the power semiconductor device, the insertion slots each being an opening into which the power semiconductor device is insertable in a direction perpendicular to extending direction of the electrode, edges of the opening being formed to make contact with the mold part and the substrate; and a container box that contains the holding unit. The insertion slots are provided to the holding unit so that an interval between the insertion slots in an extending direction of the electrode terminals of the power semiconductor device inserted is greater than the extending length of the electrode terminals.
    • 封装装置用于封装包括形成的基板,模制在基板上的模具部件和从模具部件延伸到与基板相对的一侧预定长度的电极端子的功率半导体器件; 包括:保持单元,其具有插入槽并且用于保持功率半导体器件,插入槽各自为开口,功率半导体器件可以沿着与电极的延伸方向垂直的方向插入到其中,开口的边缘形成 与模具部件和基板接触; 以及容纳盒,其包含保持单元。 插入槽被提供到保持单元,使得插入的功率半导体器件的电极端子的延伸方向上的插入槽之间的间隔大于电极端子的延伸长度。
    • 7. 发明申请
    • LIQUID DISCHARGE HEAD
    • 液体放电头
    • US20120229554A1
    • 2012-09-13
    • US13414064
    • 2012-03-07
    • Akira Goto
    • Akira Goto
    • B41J2/17
    • B41J2/162B41J2/14024B41J2/1433B41J2/1623
    • A liquid discharge head includes a recording element substrate having a discharge-port surface having a discharge port discharging a liquid, side surfaces on sides of the discharge-port surface, and a back surface of the discharge-port surface having an opening of an ink supplying port supplying ink to the discharge port; a supporting member having a depression accommodating the recording element substrate, the depression including a supporting part disposed at a bottom surface of the depression and supporting the recording element substrate with an adhesive and an opening of an ink channel communicating with the ink supplying port; and an electric wiring substrate disposed on a surface of the supporting member having the depression and having an electric connecting part connecting with a side of the discharge-port surface of the recording element substrate.
    • 液体排出头包括具有排出口的排出口表面的记录元件基底,排出口排出液体,排出口表面侧面的侧表面和具有墨水开口的排出口表面的后表面 向排出口供给墨水供给口; 具有容纳所述记录元件基板的凹部的支撑部件,所述凹部包括设置在所述凹部的底面的支撑部,并且用粘合剂支撑所述记录元件基板,并且与所述供墨口连通的墨水通道的开口; 以及布置在具有所述凹部的所述支撑构件的表面上并具有与所述记录元件基板的所述排出口表面的一侧连接的电连接部的电布线基板。
    • 8. 发明授权
    • Resistance welding method and resistance welding apparatus
    • 电阻焊接方法和电阻焊接装置
    • US08253056B2
    • 2012-08-28
    • US12749771
    • 2010-03-30
    • Akira Goto
    • Akira Goto
    • B23K11/00
    • B23K11/115B23K11/0026B23K11/30
    • A resistance welding apparatus includes a welding gun having a first electrode tip serving as a first welding electrode, a second electrode tip serving as a second welding electrode, and a current branching electrode. The current branching electrode has an annular shape and is disposed in surrounding relation to the first electrode tip. The first electrode tip and the current branching electrode abut against a thinnest workpiece disposed on an outermost side of a stacked assembly that is resistance-welded by the resistance welding apparatus, and have opposite polarities to each other. When an electric current is passed from the first electrode tip to the second electrode tip and through the stacked assembly, a branched electric current flows from the first electrode tip to the current branching electrode.
    • 电阻焊接装置包括具有作为第一焊接电极的第一电极端头,作为第二焊接电极的第二电极端子和电流分支电极的焊枪。 当前的分支电极具有环形形状并且围绕第一电极尖端设置。 第一电极端和电流分支电极抵靠设置在由电阻焊接装置进行电阻焊接的层叠组件的最外侧的最薄的工件,并且彼此具有相反的极性。 当电流从第一电极尖端通过第二电极尖端并通过堆叠组件时,分支电流从第一电极尖端流到电流分支电极。
    • 10. 发明申请
    • PACKAGE APPARATUS OF POWER SEMICONDUCTOR DEVICE
    • 功率半导体器件封装装置
    • US20120074543A1
    • 2012-03-29
    • US13322336
    • 2009-05-26
    • Takayuki UshioYoshihisa OguriAkira GotoJyunya Kanazawa
    • Takayuki UshioYoshihisa OguriAkira GotoJyunya Kanazawa
    • H01L23/552
    • B65D5/5061B65D85/38
    • A package apparatus is for packaging a power semiconductor device that includes a substrate formed, a mold part molded on the substrate, and electrode terminals extended from the mold part to a side opposite from the substrate by a predetermined length; includes: a holding unit that has insertion slots and is to holding the power semiconductor device, the insertion slots each being an opening into which the power semiconductor device is insertable in a direction perpendicular to extending direction of the electrode, edges of the opening being formed to make contact with the mold part and the substrate; and a container box that contains the holding unit. The insertion slots are provided to the holding unit so that an interval between the insertion slots in an extending direction of the electrode terminals of the power semiconductor device inserted is greater than the extending length of the electrode terminals.
    • 封装装置用于封装包括形成的基板,模制在基板上的模具部件和从模具部件延伸到与基板相对的一侧预定长度的电极端子的功率半导体器件; 包括:保持单元,其具有插入槽并且用于保持功率半导体器件,插入槽各自为开口,功率半导体器件可以沿着与电极的延伸方向垂直的方向插入到其中,开口的边缘形成 与模具部件和基板接触; 以及容纳盒,其包含保持单元。 插入槽被提供到保持单元,使得插入的功率半导体器件的电极端子的延伸方向上的插入槽之间的间隔大于电极端子的延伸长度。