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1. 发明授权

US09515042B2 Anisotropic conductive film, connection structure and method of producing the same 有权
标题翻译：各向异性导电膜，连接结构及其制造方法
公开(公告)号：US09515042B2
公开(公告)日：2016-12-06
申请号：US13512752
申请日：2011-07-19
申请人： Yasushi Akutsu , Kouichi Sato , Shigeyuki Yoshizawa
发明人： Yasushi Akutsu , Kouichi Sato , Shigeyuki Yoshizawa
IPC分类号： H01B1/04 , H01B1/22 , H01B13/00 , C09J7/00 , H01L23/00 , C09J9/02 , C08K3/08 , C08F220/28
CPC分类号： H01L24/29 , C08F2220/283 , C08K3/08 , C09J7/00 , C09J7/10 , C09J9/02 , C09J2201/602 , C09J2205/102 , C09J2433/00 , H01B1/22 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29198 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29357 , H01L2224/29364 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01084 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/07811 , H01L2924/12041 , H01L2924/14 , H01L2924/15747 , H01L2924/15788 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： An anisotropic conductive film is obtained by dispersing conductive particles in an insulating adhesive composition including a (meth)acrylate-based monomer composition, a radical polymerization initiator, and a film-forming resin. The (meth)acrylate-based monomer composition includes a (meth)acrylate-based monomer which has a cyclic ester residue or a cyclic amide residue represented by the formula (1): R1 is a hydrogen atom or a methyl group; R2 is an alkylene group or an alkyloxy group; R3 is an alkyl group, an alkylene group, an aryl group, or a halogen atom; n is an integer of 0 to 3; R4 is absent or an alkylene, dotted lines on both sides of R4 jointly represent a single bond; X1 is absent, or an oxygen atom or a carbon atom; and X2 is an oxygen atom, a nitrogen atom, or a sulfur atom.

2. 发明申请

US20120228026A1 ANISOTROPIC CONDUCTIVE FILM, CONNECTION STRUCTURE AND METHOD OF PRODUCING THE SAME 有权
标题翻译：各向异性导电膜，连接结构及其生产方法
公开(公告)号：US20120228026A1
公开(公告)日：2012-09-13
申请号：US13512752
申请日：2011-07-19
申请人： Yasushi Akutsu , Kouichi Sato , Shigeyuki Yoshizawa
发明人： Yasushi Akutsu , Kouichi Sato , Shigeyuki Yoshizawa
IPC分类号： H01B1/12 , B32B37/14 , H01R4/04 , B05D5/12
CPC分类号： H01L24/29 , C08F2220/283 , C08K3/08 , C09J7/00 , C09J7/10 , C09J9/02 , C09J2201/602 , C09J2205/102 , C09J2433/00 , H01B1/22 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29198 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29357 , H01L2224/29364 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01084 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/07811 , H01L2924/12041 , H01L2924/14 , H01L2924/15747 , H01L2924/15788 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： An anisotropic conductive film is obtained by dispersing conductive particles in an insulating adhesive composition including a (meth)acrylate-based monomer composition, a radical polymerization initiator, and a film-forming resin. The (meth)acrylate-based monomer composition includes a (meth)acrylate-based monomer which has a cyclic ester residue or a cyclic amide residue represented by the formula (1): R1 is a hydrogen atom or a methyl group; R2 is an alkylene group or an alkyloxy group; R3 is an alkyl group, an alkylene group, an aryl group, or a halogen atom; n is an integer of 0 to 3; R4 is absent or an alkylene, dotted lines on both sides of R4 jointly represent a single bond; X1 is absent, or an oxygen atom or a carbon atom; and X2 is an oxygen atom, a nitrogen atom, or a sulfur atom.
摘要翻译：通过将导电粒子分散在包含（甲基）丙烯酸酯类单体组合物，自由基聚合引发剂和成膜树脂的绝缘性粘合剂组合物中而获得各向异性导电膜。（甲基）丙烯酸酯类单体组合物包含具有式（1）表示的环状酯残基或环状酰胺残基的（甲基）丙烯酸酯系单体：R1为氢原子或甲基， R2是亚烷基或烷氧基; R3是烷基，亚烷基，芳基或卤素原子; n为0〜3的整数， R4不存在或亚烷基，R4两面的虚线共同表示单键; X1不存在，或氧原子或碳原子; X 2为氧原子，氮原子或硫原子。

3. 发明授权

US09023464B2 Connecting film, and joined structure and method for producing the same 有权
标题翻译：连接膜及其结合体及其制造方法
公开(公告)号：US09023464B2
公开(公告)日：2015-05-05
申请号：US12838625
申请日：2010-07-19
申请人： Yasushi Akutsu , Tomoyuki Ishimatsu , Koichi Miyauchi
发明人： Yasushi Akutsu , Tomoyuki Ishimatsu , Koichi Miyauchi
IPC分类号： H01R4/04 , C09J7/00 , H01L23/00 , H05K3/32 , C08K3/00 , C08K3/08 , C08K9/02 , H05K1/03
CPC分类号： C09J7/00 , C08K3/017 , C08K3/08 , C08K9/02 , C09J7/10 , C09J2201/134 , C09J2201/36 , C09J2205/102 , C09J2433/00 , C09J2463/00 , H01L24/32 , H01L24/83 , H01L2224/16225 , H01L2224/29082 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/73204 , H01L2224/83192 , H01L2224/838 , H01L2224/83851 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H01L2924/15788 , H01R4/04 , H05K1/0346 , H05K3/323 , H05K2201/0154 , H05K2201/10674 , H05K2203/1189 , Y10T29/49126 , Y10T29/49155 , Y10T428/25 , Y10T428/31511 , H01L2924/00 , H01L2924/3512 , H01L2224/0401
摘要： A connecting film which electrically connects a first circuit member with a second circuit member having a nitrogen atom-containing film on a surface thereof facing the first circuit member, the connecting film including a first layer which is to be located at the first circuit member side, and a second layer which is to be located at the second circuit member side, wherein the first layer contains a cationic curing agent and an epoxy resin, and the second layer contains a radical curing agent, an acrylic resin and an epoxy compound, wherein one of the first layer and the second layer is a conductive particle-containing organic resin layer, and the other layer is an insulating organic resin layer containing no conductive particles, and wherein the minimum melt viscosity of the conductive particle-containing organic resin layer is ten times or more greater than that of the insulating organic resin layer.
摘要翻译：一种连接膜，其将第一电路部件与具有含氮原子的膜的第二电路部件的面对第一电路部件的表面电连接，所述连接膜包括位于第一电路部件侧的第一层以及位于第二电路部件侧的第二层，其中第一层含有阳离子固化剂和环氧树脂，第二层含有自由基固化剂，丙烯酸树脂和环氧化合物，其中，第一层和第二层之一是含导电粒子的有机树脂层，另一层是不含导电性粒子的绝缘性有机树脂层，其中，导电性粒子的有机树脂层的最小熔融粘度为是绝缘性有机树脂层的10倍以上。

4. 发明申请

US20110281119A1 Adhesive composition 有权
标题翻译：粘合剂组合物
公开(公告)号：US20110281119A1
公开(公告)日：2011-11-17
申请号：US13137141
申请日：2011-07-22
申请人： Yasushi Akutsu , Yasunobu Yamada , Kouichi Miyauchi
发明人： Yasushi Akutsu , Yasunobu Yamada , Kouichi Miyauchi
IPC分类号： B32B27/06
CPC分类号： H01B1/22 , C08F290/06 , C08F290/061 , C08F290/065 , C08G18/8116 , C09J133/14 , C09J175/06 , G02F1/13452 , G02F2202/28 , H01L2924/00013 , H01L2924/0002 , H05K3/323 , H05K3/361 , H05K2201/0129 , Y10S428/901 , Y10T428/2852 , Y10T428/2857 , Y10T428/2883 , Y10T428/2887 , Y10T428/2896 , Y10T428/31551 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00
摘要： A connection structure comprising an adhesive composition is provided. The adhesive composition is capable of providing good adhesion strength to the polyimide surface of a flexible circuit board that is exposed on the metal wiring surface and between the traces even when the polyimide surface is relatively smooth. The adhesive composition contains a thermoplastic resin, a polyfunctional acrylate, and a radical polymerization initiator and further contains a monofunctional urethane acrylate having a urethane residue at its terminal end. The monofunctional urethane acrylate is represented by the formula (1): CH2═CR0—COO—R1—NHCOO—R2 (1) wherein R0 is a hydrogen atom or a methyl group, R1 is a divalent hydrocarbon group, and R2 is an optionally substituted lower alkyl group.
摘要翻译：提供包括粘合剂组合物的连接结构。粘合剂组合物即使当聚酰亚胺表面相对光滑时，也能够暴露在金属布线表面和迹线之间的柔性电路板的聚酰亚胺表面上提供良好的粘附强度。粘合剂组合物含有热塑性树脂，多官能丙烯酸酯和自由基聚合引发剂，并且还包含其末端具有氨基甲酸酯残基的单官能聚氨酯丙烯酸酯。单官能氨基甲酸酯丙烯酸酯由式（1）表示：CH2 = CR0-COO-R1-NHCOO-R2（1）其中R0为氢原子或甲基，R1为二价烃基，R2为任选的取代的低级烷基。

5. 发明申请

US20090280332A1 Adhesive composition 有权
标题翻译：粘合剂组合物
公开(公告)号：US20090280332A1
公开(公告)日：2009-11-12
申请号：US12312000
申请日：2008-06-09
申请人： Yasushi Akutsu , Yasunobu Yamada , Kouichi Miyauchi
发明人： Yasushi Akutsu , Yasunobu Yamada , Kouichi Miyauchi
IPC分类号： B32B7/12 , C08L33/08
CPC分类号： H01B1/22 , C08F290/06 , C08F290/061 , C08F290/065 , C08G18/8116 , C09J133/14 , C09J175/06 , G02F1/13452 , G02F2202/28 , H01L2924/00013 , H01L2924/0002 , H05K3/323 , H05K3/361 , H05K2201/0129 , Y10S428/901 , Y10T428/2852 , Y10T428/2857 , Y10T428/2883 , Y10T428/2887 , Y10T428/2896 , Y10T428/31551 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00
摘要： An adhesive composition is provided which is capable of providing good adhesion strength to the polyimide surface of a flexible circuit board that is exposed on the metal wiring surface and between the traces even when the polyimide surface is relatively smooth. The adhesive composition contains a thermoplastic resin, a polyfunctional acrylate, and a radical polymerization initiator and further contains a monofunctional urethane acrylate having a urethane residue at its terminal end. The monofunctional urethane acrylate is represented by the formula (1): CH2═CR0—COO—R1—NHCOO—R2 (1) wherein R0 is a hydrogen atom or a methyl group, R1 is a divalent hydrocarbon group, and R2 is an optionally substituted lower alkyl group.
摘要翻译：提供了一种粘合剂组合物，即使当聚酰亚胺表面相对光滑时，其能够对露出在金属布线表面上和迹线之间的柔性电路板的聚酰亚胺表面提供良好的粘附强度。粘合剂组合物含有热塑性树脂，多官能丙烯酸酯和自由基聚合引发剂，并且还包含其末端具有氨基甲酸酯残基的单官能聚氨酯丙烯酸酯。单官能氨基甲酸酯丙烯酸酯由式（1）表示：CH2-CR0-COO-R1-NHCOO-R2（1）其中R0是氢原子或甲基，R1是二价烃基，R2是任选的取代的低级烷基。

6. 发明授权

US08524032B2 Connecting film, and joined structure and method for producing the same 失效
标题翻译：连接膜及其结合体及其制造方法
公开(公告)号：US08524032B2
公开(公告)日：2013-09-03
申请号：US13613560
申请日：2012-09-13
申请人： Yasushi Akutsu , Tomoyuki Ishimatsu , Koichi Miyauchi
发明人： Yasushi Akutsu , Tomoyuki Ishimatsu , Koichi Miyauchi
IPC分类号： H05K3/36 , H05K3/02 , H05K3/10 , B21F15/02 , H01R3/00 , H01R4/00 , H01R43/00 , H02G1/14 , B32B7/12
CPC分类号： C09J7/00 , C08K3/017 , C08K3/08 , C08K9/02 , C09J7/10 , C09J2201/134 , C09J2201/36 , C09J2205/102 , C09J2433/00 , C09J2463/00 , H01L24/32 , H01L24/83 , H01L2224/16225 , H01L2224/29082 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/73204 , H01L2224/83192 , H01L2224/838 , H01L2224/83851 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H01L2924/15788 , H01R4/04 , H05K1/0346 , H05K3/323 , H05K2201/0154 , H05K2201/10674 , H05K2203/1189 , Y10T29/49126 , Y10T29/49155 , Y10T428/25 , Y10T428/31511 , H01L2924/00 , H01L2924/3512 , H01L2224/0401
摘要： A method for producing a joined structure involving pressure-bonding a first circuit member and a second circuit member together via a connecting film while the circuit members are being heated, to thereby join the circuit members with each other, wherein the connecting film is defined and includes first and second layers wherein one of the first layer and the second layer is a conductive particle-containing organic resin layer, and the other layer is an insulating organic resin layer containing no conductive particles, and wherein the minimum melt viscosity of the conductive particle-containing organic resin layer is ten times or more greater than the minimum melt viscosity of the insulating organic resin layer.
摘要翻译：一种接合结构体的制造方法，其特征在于，在将所述电路部件加热的同时，经由连接膜将第一电路部件和第二电路部件压接在一起，从而将所述电路部件彼此接合，包括第一层和第二层，其中第一层和第二层之一是含导电颗粒的有机树脂层，另一层是不含导电颗粒的绝缘有机树脂层，并且其中导电颗粒的最小熔体粘度的绝缘性有机树脂层的绝缘性有机树脂层的最低熔融粘度的10倍以上。

7. 发明授权

US08361614B2 Anisotropic electrically conductive film and connection structure 有权
标题翻译：各向异性导电膜和连接结构
公开(公告)号：US08361614B2
公开(公告)日：2013-01-29
申请号：US12302640
申请日：2008-04-22
申请人： Yasushi Akutsu , Daisuke Sato , Shinichi Hayashi
发明人： Yasushi Akutsu , Daisuke Sato , Shinichi Hayashi
IPC分类号： B32B5/16 , B32B27/00
CPC分类号： H01R4/04 , C08G2650/56 , C08L33/066 , C08L71/00 , H01B1/20 , H05K3/323 , H05K2201/0133 , H05K2201/0212 , Y10T428/254 , Y10T428/31855 , C08L2666/04
摘要： An anisotropic electrically conductive film formed by a thermosetting acrylic resin composition is disclosed. The composition contains at least a thermosetting agent (A), a thermo-settable ingredient (B), an acrylic rubber containing hydroxyl groups (C), organic fine particles (D) and electrically conductive particles (E). The thermo-settable ingredient (B) may include a phosphorus-containing acrylic ester (b1). The weight averaged molecular weight of the acrylic rubber containing the hydroxyl groups (C) is not less than 1000000. The organic fine particles (D) include polybutadiene-based fine particles (d1).
摘要翻译：公开了由热固性丙烯酸树脂组合物形成的各向异性导电膜。该组合物至少含有热固性剂（A），热固性成分（B），含有羟基的丙烯酸类橡胶（C），有机细颗粒（D）和导电性颗粒（E）。热固性成分（B）可以包括含磷丙烯酸酯（b1）。含有羟基（C）的丙烯酸类橡胶的重均分子量不小于1000000.有机细颗粒（D）包括聚丁二烯基微粒（d1）。

8. 发明授权

US08067514B2 Anisotropic conductive film 有权
标题翻译：各向异性导电膜
公开(公告)号：US08067514B2
公开(公告)日：2011-11-29
申请号：US12227164
申请日：2008-01-17
申请人： Kouichi Miyauchi , Yasushi Akutsu , Yasunobu Yamada
发明人： Kouichi Miyauchi , Yasushi Akutsu , Yasunobu Yamada
IPC分类号： C08F4/38 , C08G63/91 , B32B37/06 , B32B37/12 , C08K3/10
CPC分类号： C09J4/00 , C08J5/18 , C08J2367/00 , C08J2371/12 , C08J2375/04 , H01R4/04 , H05K3/323
摘要： An anisotropic conductive film is provided which can provide high bonding strength and good conduction reliability when anisotropic conductive bonding is made under the compression bonding conditions of a compression bonding temperature of at most 130° C. for a compression bonding time of at most 3 seconds. The anisotropic conductive film contains a polymerizable acrylic compound, a film-forming rein, conductive particles, and a polymerization initiator. The polymerization initiator contains two types of organic peroxides that do not produce oxygen gas resulting from the decomposition thereof and have different one-minute half-life temperatures. Of the two types of organic peroxides, one organic peroxide that has a higher one-minute half-life temperature produces benzoic acid or a derivative thereof when it decomposes.
摘要翻译：提供了各向异性导电膜，其在压缩粘合温度为至多130℃的压接条件下进行各向异性导电接合时，可以提供高的接合强度和良好的传导可靠性，在压接时间为3秒以下。各向异性导电膜含有可聚合的丙烯酸类化合物，成膜树脂，导电颗粒和聚合引发剂。聚合引发剂含有两种不产生由其分解产生的氧气并具有不同的一分钟半衰期温度的有机过氧化物。在两种类型的有机过氧化物中，一分钟半衰期较高的一种有机过氧化物在分解时产生苯甲酸或其衍生物。

9. 发明申请

US20110095235A1 CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE INTERCONNECTION MATERIAL THAT USES THE CONDUCTIVE PARTICLE, AND METHOD FOR PRODUCING THE CONDUCTIVE PARTICLE 有权
标题翻译：导电颗粒，使用导电颗粒的导电性互连材料和用于生产导电颗粒的方法
公开(公告)号：US20110095235A1
公开(公告)日：2011-04-28
申请号：US12982184
申请日：2010-12-30
申请人： Yasushi Akutsu , Hidetsugu Namiki
发明人： Yasushi Akutsu , Hidetsugu Namiki
IPC分类号： H01B1/12
CPC分类号： H01R4/04 , C09J9/02 , H01B1/22 , H05K3/323 , H05K2201/0224 , Y10T428/2982 , Y10T428/2991 , Y10T428/2998
摘要： There is disclosed a conductive particle used for an anisotropic conductive connection material for establishing conductive interconnection between e.g. a substrate and an electrical component. The conductive particle includes a base particle (2) exhibiting electrical conductivity at least on its surface and a continuous insulating resin film (3) formed by welding of fine particles (3a) of an insulating resin that composes the resin film. The surface of the base particle is coated with the continuous insulating resin film. There are formed voids at least between neighboring fine particles.
摘要翻译：公开了用于在各向异性导电连接材料之间建立导电互连的导电颗粒。基板和电气部件。导电性粒子包括至少在其表面具有导电性的基体颗粒（2）和由构成树脂膜的绝缘树脂的细颗粒（3a）形成的连续绝缘树脂膜（3）。基体颗粒的表面涂覆有连续的绝缘树脂膜。至少在相邻的细颗粒之间形成空隙。

10. 发明授权

US08319222B2 Adhesive composition 有权
标题翻译：粘合剂组合物
公开(公告)号：US08319222B2
公开(公告)日：2012-11-27
申请号：US13137141
申请日：2011-07-22
申请人： Yasushi Akutsu , Yasunobu Yamada , Kouichi Miyauchi
发明人： Yasushi Akutsu , Yasunobu Yamada , Kouichi Miyauchi
IPC分类号： H01L29/00
CPC分类号： H01B1/22 , C08F290/06 , C08F290/061 , C08F290/065 , C08G18/8116 , C09J133/14 , C09J175/06 , G02F1/13452 , G02F2202/28 , H01L2924/00013 , H01L2924/0002 , H05K3/323 , H05K3/361 , H05K2201/0129 , Y10S428/901 , Y10T428/2852 , Y10T428/2857 , Y10T428/2883 , Y10T428/2887 , Y10T428/2896 , Y10T428/31551 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00
摘要： A connection structure comprising an adhesive composition is provided. The adhesive composition is capable of providing good adhesion strength to the polyimide surface of a flexible circuit board that is exposed on the metal wiring surface and between the traces even when the polyimide surface is relatively smooth. The adhesive composition contains a thermoplastic resin, a polyfunctional acrylate, and a radical polymerization initiator and further contains a monofunctional urethane acrylate having a urethane residue at its terminal end. The monofunctional urethane acrylate is represented by the formula (1): CH2═CR0—COO—R1—NHCOO—R2 (1) wherein R0 is a hydrogen atom or a methyl group, R1 is a divalent hydrocarbon group, and R2 is an optionally substituted lower alkyl group.
摘要翻译：提供包括粘合剂组合物的连接结构。粘合剂组合物即使当聚酰亚胺表面相对光滑时，也能够暴露在金属布线表面和迹线之间的柔性电路板的聚酰亚胺表面上提供良好的粘附强度。粘合剂组合物含有热塑性树脂，多官能丙烯酸酯和自由基聚合引发剂，并且还包含其末端具有氨基甲酸酯残基的单官能聚氨酯丙烯酸酯。单官能氨基甲酸酯丙烯酸酯由式（1）表示：CH2 = CR0-COO-R1-NHCOO-R2（1）其中R0为氢原子或甲基，R1为二价烃基，R2为任选的取代的低级烷基。

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