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1. 发明申请

US20060009008A1 Method for the laser processing of a wafer 审中-公开
标题翻译：晶圆激光加工方法
公开(公告)号：US20060009008A1
公开(公告)日：2006-01-12
申请号：US11175155
申请日：2005-07-07
申请人： Yasuomi Kaneuchi , Yukio Morishige , Satoshi Genda , Satoshi Kobayashi , Toshio Tsuchiya , Ryugo Oba
发明人： Yasuomi Kaneuchi , Yukio Morishige , Satoshi Genda , Satoshi Kobayashi , Toshio Tsuchiya , Ryugo Oba
IPC分类号： H01L21/301 , B23K26/38
CPC分类号： H01L21/6836 , B23K26/03 , B23K26/032 , B23K26/0622 , B23K26/0853 , B23K26/364 , B23K26/40 , B23K2101/40 , B23K2103/50 , H01L21/67092 , H01L21/78 , H01L2221/68327
摘要： A method for the laser processing of a wafer having a plurality of devices which are composed of a laminate consisting of an insulating film and a functional film on the front surface of a substrate, the method comprising applying a pulse laser beam along streets for sectioning the plurality of devices to form grooves along the streets, wherein a pulse width of the pulse laser beam is set to 100 to 1,000 ns.
摘要翻译：一种用于激光加工晶片的方法，所述晶片具有由基板前表面上的绝缘膜和功能膜构成的层叠体构成的多个器件，所述方法包括：沿着街道施加脉冲激光束，多个装置沿着街道形成凹槽，其中脉冲激光束的脉冲宽度设定为100至1,000ns。

2. 发明授权

US07601616B2 Wafer laser processing method 有权
标题翻译：晶圆激光加工方法
公开(公告)号：US07601616B2
公开(公告)日：2009-10-13
申请号：US11826911
申请日：2007-07-19
申请人： Hiroshi Morikazu , Ryugo Oba , Yukio Morishige , Toshio Tsuchiya , Koji Yamaguchi
发明人： Hiroshi Morikazu , Ryugo Oba , Yukio Morishige , Toshio Tsuchiya , Koji Yamaguchi
IPC分类号： H01L21/00
CPC分类号： H01L21/78 , B23K26/0622 , B23K26/40 , B23K2103/50
摘要： A wafer laser processing method for forming grooves along streets by applying a pulse laser beam along the streets for sectioning a plurality of devices of a wafer having the plurality of devices which are composed of a laminate consisting of an insulating film and a functional film, on the front surface of a substrate, wherein the pulse laser beam is set to have a repetition frequency of 150 kHz to 100 MHz and an energy per unit length of 5 to 25 J/m.
摘要翻译：一种晶片激光加工方法，用于沿着街道施加脉冲激光束，沿着街道形成沟槽，用于将由具有由绝缘膜和功能膜构成的层叠体构成的多个器件的晶片的多个器件分隔开，衬底的前表面，其中脉冲激光束被设置为具有150kHz至100MHz的重复频率和5至25J / m的每单位长度的能量。

3. 发明申请

US20080020548A1 Wafer laser processing method 有权
标题翻译：晶圆激光加工方法
公开(公告)号：US20080020548A1
公开(公告)日：2008-01-24
申请号：US11826911
申请日：2007-07-19
申请人： Hiroshi Morikazu , Ryugo Oba , Yukio Morishige , Toshio Tsuchiya , Koji Yamaguchi
发明人： Hiroshi Morikazu , Ryugo Oba , Yukio Morishige , Toshio Tsuchiya , Koji Yamaguchi
IPC分类号： H01L21/78
CPC分类号： H01L21/78 , B23K26/0622 , B23K26/40 , B23K2103/50
摘要： A wafer laser processing method for forming grooves along streets by applying a pulse laser beam along the streets for sectioning a plurality of devices of a wafer having the plurality of devices which are composed of a laminate consisting of an insulating film and a functional film, on the front surface of a substrate, wherein the pulse laser beam is set to have a repetition frequency of 150 kHz to 100 MHz and an energy per unit length of 5 to 25 J/m.
摘要翻译：一种晶片激光加工方法，用于沿着街道施加脉冲激光束，沿着街道形成沟槽，用于将由具有由绝缘膜和功能膜构成的层叠体构成的多个器件的晶片的多个器件分隔开，衬底的前表面，其中脉冲激光束被设置为具有150kHz至100MHz的重复频率和5至25J / m的每单位长度的能量。

4. 发明授权

US07473866B2 Laser processing apparatus 有权
标题翻译：激光加工设备
公开(公告)号：US07473866B2
公开(公告)日：2009-01-06
申请号：US11483614
申请日：2006-07-11
申请人： Yukio Morishige , Hiroshi Morikazu , Toshio Tsuchiya , Koichi Takeyama
发明人： Yukio Morishige , Hiroshi Morikazu , Toshio Tsuchiya , Koichi Takeyama
IPC分类号： B23K26/08 , B23K26/40 , B23K15/08 , H01L21/00
CPC分类号： B23K26/364 , B23K26/0613 , B23K26/083 , B23K26/40 , B23K2101/40 , B23K2103/172
摘要： A laser processing apparatus comprising a chuck table, laser beam irradiation means for irradiating a workpiece held on the chuck table with a laser beam, and processing feed means for processing-feeding the chuck table and the laser beam irradiation means relative to each other. The laser beam irradiation means includes first laser beam irradiation means for throwing a first pulsed laser beam having a wavelength in the intermediate-infrared radiation region, and second laser beam irradiation means for throwing a second pulsed laser beam having a wavelength in the ultraviolet radiation region. The first laser beam irradiation means and the second laser beam irradiation means are set such that at least a part, in the processing feed direction, of the focus spot of the second pulsed laser beam overlaps the focus spot of the first pulsed laser beam.
摘要翻译：一种激光加工装置，包括：卡盘台，激光束照射夹持台上夹持的工件的激光束照射装置，以及用于相对于彼此加工卡盘台和激光束照射装置的加工进给装置。激光束照射装置包括用于投射在中红外辐射区域具有波长的第一脉冲激光束的第一激光束照射装置和用于投射在紫外线辐射区域中具有波长的第二脉冲激光束的第二激光束照射装置。第一激光束照射装置和第二激光束照射装置被设置为使得第二脉冲激光束的聚焦点的处理进给方向中的至少一部分与第一脉冲激光束的聚焦点重叠。

5. 发明申请

US20070023691A1 Laser processing apparatus 有权
标题翻译：激光加工设备
公开(公告)号：US20070023691A1
公开(公告)日：2007-02-01
申请号：US11483614
申请日：2006-07-11
申请人： Yukio Morishige , Hiroshi Morikazu , Toshio Tsuchiya , Koichi Takeyama
发明人： Yukio Morishige , Hiroshi Morikazu , Toshio Tsuchiya , Koichi Takeyama
IPC分类号： H01S3/00
CPC分类号： B23K26/364 , B23K26/0613 , B23K26/083 , B23K26/40 , B23K2101/40 , B23K2103/172
摘要： A laser processing apparatus comprising a chuck table, laser beam irradiation means for irradiating a workpiece held on the chuck table with a laser beam, and processing feed means for processing-feeding the chuck table and the laser beam irradiation means relative to each other. The laser beam irradiation means includes first laser beam irradiation means for throwing a first pulsed laser beam having a wavelength in the intermediate-infrared radiation region, and second laser beam irradiation means for throwing a second pulsed laser beam having a wavelength in the ultraviolet radiation region. The first laser beam irradiation means and the second laser beam irradiation means are set such that at least a part, in the processing feed direction, of the focus spot of the second pulsed laser beam overlaps the focus spot of the first pulsed laser beam.
摘要翻译：一种激光加工装置，包括：卡盘台，用激光束照射夹持台上的工件的激光束照射装置，以及用于相对于彼此加工卡盘台和激光束照射装置的加工进给装置。激光束照射装置包括用于投射在中红外辐射区域具有波长的第一脉冲激光束的第一激光束照射装置和用于投射在紫外线辐射区域中具有波长的第二脉冲激光束的第二激光束照射装置。第一激光束照射装置和第二激光束照射装置被设置为使得第二脉冲激光束的聚焦点的处理进给方向中的至少一部分与第一脉冲激光束的聚焦点重叠。

6. 发明申请

US20080115891A1 Laser beam machining system 审中-公开
标题翻译：激光束加工系统
公开(公告)号：US20080115891A1
公开(公告)日：2008-05-22
申请号：US11986318
申请日：2007-11-20
申请人： Masanori Yoshida , Satoshi Genda , Toshio Tsuchiya
发明人： Masanori Yoshida , Satoshi Genda , Toshio Tsuchiya
IPC分类号： C23F1/08 , B05C13/00 , B05C9/10 , B05C9/12 , B23K26/36
CPC分类号： B23K26/0823 , B23K26/146 , H01L21/02076 , H01L21/30617 , H01L21/6708 , H01L21/78
摘要： A laser beam machining system includes: a chuck table for holding a wafer; a laser beam irradiation unit for irradiating the wafer held by a chuck table with a laser beam; a machining feeding unit for machining feed of the chuck table; and an indexing feeding unit for indexing feed of the chuck table, wherein the system further includes etching unit for etching the wafer having undergone laser beam machining, and a feeding unit for feeding the laser beam machined wafer held on the chuck table to the etching unit.
摘要翻译：激光束加工系统包括：用于保持晶片的卡盘台; 激光束照射单元，用于用激光束照射由卡盘台保持的晶片; 用于加工卡盘的进给的加工进给单元; 以及用于对所述卡盘台进给进行分度的分度供给单元，其中，所述系统还包括用于蚀刻经过激光束加工的晶片的蚀刻单元，以及将保持在所述卡盘台上的所述激光加工晶片馈送到所述蚀刻单元的进给单元。

7. 发明申请

US20060148211A1 Wafer dividing method 审中-公开
标题翻译：晶圆分割法
公开(公告)号：US20060148211A1
公开(公告)日：2006-07-06
申请号：US11324323
申请日：2006-01-04
申请人： Kenichi Iwasaki , Satoshi Genda , Toshio Tsuchiya
发明人： Kenichi Iwasaki , Satoshi Genda , Toshio Tsuchiya
IPC分类号： H01L21/78
CPC分类号： H01L21/67092 , B23K26/40 , B23K2103/50 , H01L21/78
摘要： A wafer dividing method for cutting a wafer having devices which are composed of a laminate laminated on the front surface of a substrate with a cutting blade along a plurality of streets for sectioning the devices, comprising the steps of a groove forming step for forming two grooves deeper than the thickness of the laminate at an interval larger than the thickness of the cutting blade by applying a laser beam along the streets formed on the wafer; an alignment step for picking up an image of the two grooves formed in the streets of the wafer by the above groove forming step and positioning the cutting blade at the center position between the two grooves based on the image; and a cutting step for moving the cutting blade and the wafer relative to each other while the cutting blade is rotated to cut the wafer along the streets having the two grooves formed therein, after the above alignment step.
摘要翻译：一种晶片分割方法，其特征在于，具有如下步骤：切割晶片，所述晶片具有由层叠在基板的前表面上的层叠的多个装置构成的切片，比通过沿着形成在晶片上的街道施加激光束以大于切割刀片的厚度的间隔比层压体的厚度更深; 对准步骤，用于通过上述槽形成步骤拾取形成在晶片的街道中的两个凹槽的图像，并且基于图像将切割刀片定位在两个凹槽之间的中心位置; 以及在上述对准步骤之后，在切割刀片旋转以沿着形成有两个凹槽的街道切割晶片的同时相对于彼此移动切割刀片和晶片的切割步骤。

8. 发明申请

US20080011725A1 Laser beam processing machine 审中-公开
标题翻译：激光束加工机
公开(公告)号：US20080011725A1
公开(公告)日：2008-01-17
申请号：US11822974
申请日：2007-07-11
申请人： Toshio Tsuchiya , Hiroshi Morikazu
发明人： Toshio Tsuchiya , Hiroshi Morikazu
IPC分类号： B23K26/02 , B23K26/00
CPC分类号： B23K26/0861 , B23K26/0613 , B23K26/0622 , B23K2101/40 , H01L21/78
摘要： A laser beam processing machine comprising a chuck table, a laser beam application means for applying a laser beam to a workpiece held on the chuck table, and a processing-feed means for moving the chuck table and the laser beam application means relative to each other in a processing-feed direction, wherein the laser beam application means comprises a first laser beam oscillation means for oscillating a first pulse laser beam having a wavelength ranging from a visible range to a near infrared range, a second laser beam oscillation means for oscillating a second pulse laser beam having a wavelength of an ultraviolet range, a delay means for delaying the timing of oscillating the second pulse laser beam a predetermined time after the timing of oscillating the first pulse laser beam and a common condenser for converging the first pulse laser beam and the second pulse laser beam.
摘要翻译：一种激光束处理机，包括：卡盘台，用于将激光束施加到夹持在卡盘台上的工件的激光束施加装置;以及用于相对于彼此移动卡盘台和激光束施加装置的加工进给装置在处理供给方向上，其中所述激光束施加装置包括用于振荡具有从可见范围到近红外范围的波长的第一脉冲激光束的第一激光束振荡装置，用于振荡具有紫外线范围波长的第二脉冲激光束，延迟装置，用于在振荡第一脉冲激光束的定时和用于会聚第一脉冲激光束的公共电容器之后的预定时间内延迟振荡第二脉冲激光束的定时和第二脉冲激光束。

9. 发明授权

US4407383A Motor vehicle 失效
标题翻译：摩托车
公开(公告)号：US4407383A
公开(公告)日：1983-10-04
申请号：US313361
申请日：1981-10-20
申请人： Akito Enokimoto , Toshio Tsuchiya , Tatsuo Masuda , Suwaji Takano
发明人： Akito Enokimoto , Toshio Tsuchiya , Tatsuo Masuda , Suwaji Takano
IPC分类号： B60G3/16 , B60G11/08 , B60G11/113 , B60G11/38 , B62D21/18 , B62D31/00 , B62K5/00 , B62K5/08 , B62K11/00 , B62K25/04 , B60R5/04
CPC分类号： B62K5/01 , B60G11/08 , B60G11/113 , B60G3/16 , B62D21/183 , B62D31/003 , B60G2200/10 , B60G2202/11 , B60G2202/114 , B62B2202/404 , B62K2005/001 , Y10S180/908
摘要： A motor vehicle which includes two front wheels and at least one rear wheel. A steering handle is arranged at a widthwise center of the frame of the vehicle, and a driver's seat is arranged substantially at a longitudinal center of the vehicle frame. The floor of the frame upon which the feet of the driver are positioned has substantially the same width as the width of the driver's seat, such that the handling and driving operations of the vehicle can be simplified and improved.
摘要翻译：一种包括两个前轮和至少一个后轮的机动车辆。转向手柄设置在车辆框架的宽度方向中心处，驾驶员座椅基本上布置在车架的纵向中心。驾驶员的脚的位置的框架的底部具有与驾驶员座椅的宽度大致相同的宽度，从而可以简化和改进车辆的操纵和驾驶操作。

10. 发明授权

US07408129B2 Laser beam machine with cylindrical lens system 有权
标题翻译：激光束机带圆柱透镜系统
公开(公告)号：US07408129B2
公开(公告)日：2008-08-05
申请号：US11593045
申请日：2006-11-06
申请人： Hiroshi Morikazu , Toshio Tsuchiya , Tomoaki Endo , Koichi Takeyama
发明人： Hiroshi Morikazu , Toshio Tsuchiya , Tomoaki Endo , Koichi Takeyama
IPC分类号： B23K26/06 , G02B7/02
CPC分类号： B23K26/0736 , B23K26/0853 , B23K26/364 , B23K26/382 , B23K26/40 , B23K2101/40 , B23K2103/50 , H01L21/67092
摘要： A laser beam processing machine comprising a chuck table for holding a workpiece and a laser beam application means for applying a laser beam to the workpiece held on the chuck table, the laser beam application means comprising a laser beam oscillation means for oscillating a laser beam and a condenser for converging the laser beam oscillated by the laser beam oscillation means, wherein the condenser comprises a first cylindrical lens unit having a first cylindrical lens, a second cylindrical lens unit having a second cylindrical lens which is positioned such that its converging direction becomes perpendicular to the converging direction of the first cylindrical lens, and an interval adjustment mechanism for adjusting the interval between the first cylindrical lens unit and the second cylindrical lens unit.
摘要翻译：一种激光束处理机，包括用于保持工件的卡盘台和用于将激光束施加到保持在卡盘台上的工件的激光束施加装置，所述激光束施加装置包括用于振荡激光束的激光束振荡装置，用于会聚由激光束振荡装置振荡的激光束的聚光器，其中所述聚光器包括具有第一柱面透镜的第一柱面透镜单元，具有第二柱面透镜的第二柱面透镜单元，所述第二柱面透镜单元被定位使得其会聚方向变为垂直朝向第一柱面透镜的会聚方向，以及间隔调整机构，用于调整第一柱面透镜单元与第二柱面透镜单元之间的间隔。

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