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1. 发明授权

US07557904B2 Wafer holding mechanism 有权
标题翻译：晶圆保持机构
公开(公告)号：US07557904B2
公开(公告)日：2009-07-07
申请号：US11360814
申请日：2006-02-24
申请人： Naoki Ohmiya , Satoshi Genda , Noboru Takeda , Koichi Takeyama , Yukio Morishige , Hiroshi Morikazu , Hiroshi Nomura
发明人： Naoki Ohmiya , Satoshi Genda , Noboru Takeda , Koichi Takeyama , Yukio Morishige , Hiroshi Morikazu , Hiroshi Nomura
IPC分类号： B24B7/00 , B24B9/00 , H01L21/00 , B25B11/00 , G03B27/58
CPC分类号： G03F7/707 , B23K26/40 , B23K37/0408 , B23K2101/40 , B23K2103/50 , B25B11/005 , B28D5/0094 , H01L21/6838
摘要： A wafer holding mechanism for holding a wafer affixed to a frame with a tape utilizing a suction force. The wafer holding mechanism includes a suction body, a wafer holder with a holding surface for holding the wafer via the tape, and a suction unit with a suction portion disposed at an outer peripheral edge of the wafer holder. The suction portion transmits a suction force across the holding surface though the outer peripheral edge of the wafer holder such that when the suction portion is covered and sealed by the tape, the wafer holder is held at the suction unit and the wafer is held at the holding surface.
摘要翻译：一种晶片保持机构，用于利用吸力将带有胶带的胶片固定在框架上。晶片保持机构包括抽吸体，具有用于通过带保持晶片的保持表面的晶片保持器和具有设置在晶片保持器的外周边缘处的抽吸部分的抽吸单元。抽吸部分穿过保持表面穿过晶片保持器的外周边缘传递吸力，使得当吸引部分被带覆盖和密封时，晶片保持器被保持在抽吸单元处，并且晶片保持在保持表面。

2. 发明申请

US20050035099A1 Method of dividing a plate-like workpiece 有权
标题翻译：分割板状工件的方法
公开(公告)号：US20050035099A1
公开(公告)日：2005-02-17
申请号：US10914152
申请日：2004-08-10
申请人： Masaru Nakamura , Toshiyuki Yoshikawa , Satoshi Genda
发明人： Masaru Nakamura , Toshiyuki Yoshikawa , Satoshi Genda
IPC分类号： B28D5/00 , B23K26/00 , B23K26/40 , B23K101/40 , B28D5/02 , H01L21/301 , B23K26/38
CPC分类号： B28D5/022 , B23K26/364 , B23K26/40 , B23K2101/40 , B23K2103/50
摘要： A method of dividing a plate-like workpiece having a layer that is made of a different material from that of a substrate and is formed on the front surface of the substrate along predetermined dividing lines, comprising a laser beam application step for applying a laser beam to each dividing line formed on the plate-like workpiece except for a non-processed area in at least one end portion thereof to form grooves deeper than the layer; and a cutting step for cutting the plate-like workpiece along each dividing line by positioning a cutting blade on the side of the non-processed area in the dividing line where the grooves have been formed in the laser beam application step and moving the plate-like workpiece relative to the cutting blade while rotating the cutting blade.
摘要翻译：一种分割具有由不同材料制成的层的板状工件的方法，其特征在于，沿着预定分割线形成在所述基板的前表面上，并且沿着预定分割线形成具有不同材料的层的板状工件，所述方法包括：激光束施加步骤，到除了在其至少一个端部中的未处理区域之外的形成在板状工件上的每个分割线以形成比该层更深的凹槽; 以及切割步骤，用于通过在激光束施加步骤中在形成有槽的分割线中的未处理区域的侧面上定位切割刀片来沿着分割线切割板状工件，同时旋转切割刀片时相对于切割刀片的工件。

3. 发明申请

US20060163224A1 Laser beam processing machine 有权
标题翻译：激光束加工机
公开(公告)号：US20060163224A1
公开(公告)日：2006-07-27
申请号：US11338761
申请日：2006-01-25
申请人： Noboru Takeda , Hiroshi Morikazu , Satoshi Genda , Yukio Morishige
发明人： Noboru Takeda , Hiroshi Morikazu , Satoshi Genda , Yukio Morishige
IPC分类号： B23K26/00
CPC分类号： B23K37/0235 , B23K26/0622 , B23K26/0853 , B23K26/0876 , B23K26/40 , B23K37/0408 , B23K37/0435 , B23K2103/172 , B23K2103/50
摘要： A laser beam processing machine comprising a chuck table for holding a workpiece, a laser beam application means for applying a laser beam to the workpiece held on the chuck table, and a processing-feed means for moving the chuck table and the laser beam application means relative to each other, wherein the chuck table comprises a body and a workpiece holding member disposed on the top surface of the body, and the workpiece holding member is made of a material which transmits a laser beam having a predetermined wavelength.
摘要翻译：一种激光束处理机，包括用于保持工件的卡盘台，用于将激光束施加到夹持在卡盘台上的工件的激光束施加装置，以及用于移动卡盘台和激光束施加装置的加工进给装置相对于彼此，其中所述卡盘台包括主体和设置在所述主体的顶表面上的工件保持构件，并且所述工件保持构件由透射具有预定波长的激光束的材料制成。

4. 发明申请

US20050035100A1 Method of dividing a plate-like workpiece 审中-公开
标题翻译：分割板状工件的方法
公开(公告)号：US20050035100A1
公开(公告)日：2005-02-17
申请号：US10914154
申请日：2004-08-10
申请人： Satoshi Genda
发明人： Satoshi Genda
IPC分类号： H01L21/301 , B23K26/40 , B28D5/02 , B23K26/38
CPC分类号： B28D5/022 , B23K26/40 , B23K2101/40 , B23K2103/50
摘要： A method of dividing a plate-like workpiece having a layer that is made of a different material from that of a substrate and is formed on the front surface of the substrate along predetermined dividing lines, comprising a laser beam application step for applying a laser beam along the dividing lines formed on the plate-like workpiece to form a plurality of grooves deeper than the layer and a cutting step for cutting the plate-like workpiece with a cutting blade along the plurality of grooves formed in the laser beam application step, wherein a length between the outer sides of grooves on both sides formed in the laser beam application step is set to be larger than the thickness of the cutting blade and the cutting blade cuts the area between the outer sides of the grooves on both sides in the cutting step.
摘要翻译：一种分割具有由不同材料制成的层的板状工件的方法，其特征在于，沿着预定分割线形成在所述基板的前表面上，并且沿着预定分割线形成具有不同材料的层的板状工件，所述方法包括：激光束施加步骤，沿着形成在所述板状工件上的分割线，以形成比所述层更深的多个槽;以及切割步骤，用于沿着在所述激光束施加步骤中形成的所述多个切割刀沿切割刀切割所述板状工件，其中在激光束施加步骤中形成的两侧的槽的外侧之间的长度被设定为大于切割刀的厚度，并且切割刀片在切割中切割两侧的槽的外侧之间的区域步。

5. 发明授权

US07459378B2 Wafer dividing method 有权
标题翻译：晶圆分割法
公开(公告)号：US07459378B2
公开(公告)日：2008-12-02
申请号：US11269548
申请日：2005-11-09
申请人： Satoshi Genda , Hiroshi Nakamura
发明人： Satoshi Genda , Hiroshi Nakamura
IPC分类号： H01L21/00
CPC分类号： B81C1/00888 , B81C2201/053 , H01L21/67132
摘要： A method of dividing a wafer having a plurality of micro electro mechanical systems and a plurality of streets for partitioning the micro electro mechanical systems formed on the front surface of a wafer substrate, the method comprising a protective tape affixing step for affixing a protective tape to the front surface of the wafer; a cut groove-forming step for forming a cut groove by cutting the wafer having the protective tape affixed thereto along the streets from the back surface of the wafer substrate, leaving a cutting margin having a predetermined thickness on the front surface side of the wafer substrate; and a cutting step for cutting the cutting margins by applying a laser beam to the cutting margins of the cut grooves formed along the streets.
摘要翻译：一种分割具有多个微电子机械系统的晶片的方法和用于分割形成在晶片基板的前表面上的微机电系统的多个街道的方法，所述方法包括用于将保护带固定的保护带固定步骤晶片的前表面; 切割槽形成步骤，用于通过从晶片衬底的背面沿街道切割具有保护带的晶片来形成切割槽，在晶片衬底的前表面侧留下具有预定厚度的切割边缘 ; 以及切割步骤，通过将激光束施加到沿着街道形成的切割槽的切割边缘来切割切割边缘。

6. 发明申请

US20060105546A1 Wafer dividing method 有权
标题翻译：晶圆分割法
公开(公告)号：US20060105546A1
公开(公告)日：2006-05-18
申请号：US11269548
申请日：2005-11-09
申请人： Satoshi Genda , Hiroshi Nakamura
发明人： Satoshi Genda , Hiroshi Nakamura
IPC分类号： H01L21/78 , H01L21/301 , H01L21/46
CPC分类号： B81C1/00888 , B81C2201/053 , H01L21/67132
摘要： A method of dividing a wafer having a plurality of micro electro mechanical systems and a plurality of streets for partitioning the micro electro mechanical systems formed on the front surface of a wafer substrate, the method comprising a protective tape affixing step for affixing a protective tape to the front surface of the wafer; a cut groove-forming step for forming a cut groove by cutting the wafer having the protective tape affixed thereto along the streets from the back surface of the wafer substrate, leaving a cutting margin having a predetermined thickness on the front surface side of the wafer substrate; and a cutting step for cutting the cutting margins by applying a laser beam to the cutting margins of the cut grooves formed along the streets.
摘要翻译：一种分割具有多个微电子机械系统的晶片和用于分割形成在晶片基板的前表面上的微机电系统的多个街道的方法，该方法包括用于将保护带固定的保护带固定步骤晶片的前表面; 切割槽形成步骤，用于通过从晶片衬底的背面沿街道切割具有保护带的晶片来形成切割槽，在晶片衬底的前表面侧留下具有预定厚度的切割边缘 ; 以及切割步骤，通过将激光束施加到沿着街道形成的切割槽的切割边缘来切割切割边缘。

7. 发明授权

US07915140B2 Fabrication method for device having die attach film on the back side thereof 有权
标题翻译：在其后侧具有管芯附着膜的器件的制造方法
公开(公告)号：US07915140B2
公开(公告)日：2011-03-29
申请号：US12430576
申请日：2009-04-27
申请人： Satoshi Genda , Nobuyasu Kitahara
发明人： Satoshi Genda , Nobuyasu Kitahara
IPC分类号： H01L21/46 , H01L21/78 , H01L21/301
CPC分类号： H01L21/78
摘要： A device fabrication method for fabricating individual devices from a wafer, wherein the back side of each device is covered with an adhesive film for die bonding. The device fabrication method includes a wafer dividing step of dividing the wafer into the individual devices along a plurality of kerfs by using a dicing before grinding process, an adhesive film mounting step of mounting an adhesive film on the back side of the wafer after performing the wafer dividing step, and an adhesive film dividing step of applying a laser beam to the adhesive film along the kerfs after performing the adhesive film mounting step, thereby dividing the adhesive film along the kerfs.
摘要翻译：一种用于从晶片制造各个器件的器件制造方法，其中每个器件的背面被用于芯片接合的粘合剂膜覆盖。该器件制造方法包括：晶片分割步骤，通过在研磨处理之前使用切片将晶片分割成多个切口的单个器件;粘合膜安装步骤，在执行所述晶片的背面之后，将粘合剂膜安装在晶片的背面晶片分割工序，以及粘合膜分割工序，在进行粘合膜安装工序之后，沿着切口将粘合膜施加激光束，从而沿着切口划分粘合膜。

8. 发明授权

US07642485B2 Laser beam processing machine 有权
标题翻译：激光束加工机
公开(公告)号：US07642485B2
公开(公告)日：2010-01-05
申请号：US11338761
申请日：2006-01-25
申请人： Noboru Takeda , Hiroshi Morikazu , Satoshi Genda , Yukio Morishige
发明人： Noboru Takeda , Hiroshi Morikazu , Satoshi Genda , Yukio Morishige
IPC分类号： B23K26/02
CPC分类号： B23K37/0235 , B23K26/0622 , B23K26/0853 , B23K26/0876 , B23K26/40 , B23K37/0408 , B23K37/0435 , B23K2103/172 , B23K2103/50
摘要： A laser beam processing machine comprising a chuck table for holding a workpiece, a laser beam application means for applying a laser beam to the workpiece held on the chuck table, and a processing-feed means for moving the chuck table and the laser beam application means relative to each other, wherein the chuck table comprises a body and a workpiece holding member disposed on the top surface of the body, and the workpiece holding member is made of a material which transmits a laser beam having a predetermined wavelength.
摘要翻译：一种激光束处理机，包括用于保持工件的卡盘台，用于将激光束施加到保持在卡盘台上的工件的激光束施加装置，以及用于移动卡盘台和激光束施加装置的加工进给装置相对于彼此，其中所述卡盘台包括主体和设置在所述主体的顶表面上的工件保持构件，并且所述工件保持构件由透射具有预定波长的激光束的材料制成。

9. 发明申请

US20090280622A1 FABRICATION METHOD FOR DEVICE HAVING DIE ATTACH FILM ON THE BACK SIDE THEREOF 有权
标题翻译：具有背面胶片的装置的制造方法
公开(公告)号：US20090280622A1
公开(公告)日：2009-11-12
申请号：US12430576
申请日：2009-04-27
申请人： Satoshi Genda , Nobuyasu Kitahara
发明人： Satoshi Genda , Nobuyasu Kitahara
IPC分类号： H01L21/304
CPC分类号： H01L21/78
摘要： A device fabrication method for fabricating individual devices from a wafer, wherein the back side of each device is covered with an adhesive film for die bonding. The device fabrication method includes a wafer dividing step of dividing the wafer into the individual devices along a plurality of kerfs by using a dicing before grinding process, an adhesive film mounting step of mounting an adhesive film on the back side of the wafer after performing the wafer dividing step, and an adhesive film dividing step of applying a laser beam to the adhesive film along the kerfs after performing the adhesive film mounting step, thereby dividing the adhesive film along the kerfs.
摘要翻译：一种用于从晶片制造各个器件的器件制造方法，其中每个器件的背面被用于芯片接合的粘合剂膜覆盖。该器件制造方法包括：晶片分割步骤，通过在研磨处理之前使用切片将晶片分割成多个切口的单个器件;粘合膜安装步骤，在执行所述晶片的背面之后，将粘合剂膜安装在晶片的背面晶片分割工序，以及粘合膜分割工序，在进行粘合膜安装工序之后，沿着切口将粘合膜施加激光束，从而沿着切口划分粘合膜。

10. 发明授权

US07544588B2 Laser processing method for wafer 有权
标题翻译：晶圆激光加工方法
公开(公告)号：US07544588B2
公开(公告)日：2009-06-09
申请号：US11480515
申请日：2006-07-05
申请人： Satoshi Genda
发明人： Satoshi Genda
IPC分类号： H01L21/46
CPC分类号： B23K37/0408 , B23K26/0622 , B23K26/0736 , B23K26/0853 , B23K26/361 , B23K26/364 , B23K26/40 , B23K26/702 , B23K37/0443 , B23K2103/50
摘要： Disclosed herein is a laser processing method for a wafer having a plurality of regions defined by streets, with the regions having a plurality of devices formed therein. The method irradiates the wafer with a laser beam along the streets, thereby forming laser processed grooves along the streets. It includes a processed groove formation step of irradiating the wafer while positioning the beam's focus spot on an irradiation surface of the wafer, thereby forming the laser processed grooves; and a processed groove finishing step of irradiating the wafer along the laser processed grooves formed by the processed groove formation step, while positioning the focus spot beyond the bottom of the laser processed grooves, thereby finishing both sides of the laser processed grooves.
摘要翻译：本文公开了一种具有由街道限定的多个区域的晶片的激光加工方法，其中形成有多个器件。该方法沿着街道用激光束照射晶片，从而沿街道形成激光加工槽。其包括处理槽形成步骤，其将晶片的聚焦点定位在晶片的照射表面上，照射晶片，从而形成激光加工槽; 以及处理槽精加工步骤，在将聚焦点定位在激光加工槽的底部之外，同时沿着由处理槽形成步骤形成的激光加工槽照射晶片，从而完成激光加工槽的两侧。

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