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    • 10. 发明申请
    • Method of coating substrate
    • 涂层方法
    • US20080299292A1
    • 2008-12-04
    • US12153995
    • 2008-05-28
    • Seiji HeikeTomihiro HashizumeMasayoshi Ishibashi
    • Seiji HeikeTomihiro HashizumeMasayoshi Ishibashi
    • C23C16/52
    • B05C5/00B05B13/0221B05B13/04B05C5/0225B05C5/0291B05C11/1018H01L51/0005H01L51/0036H01L51/0541
    • A method of coating by supplying a liquid material from a nozzle tip to form a film on a substrate surface facing to the nozzle, having the steps of: preparing a translation mechanism, which is capable of moving the nozzle in an in-plane direction and in a thickness direction of the substrate; making the nozzle to come gradually closer to the substrate, after positioning of the nozzle on the in-plane of the substrate, by using the translation mechanism; detecting electric current flowing through the nozzle from the substrate surface, when a semiconductor droplet supplied from the nozzle tip contacts with an electrode installed at the substrate surface; stopping accession of the nozzle to the substrate, when the electric current exceeds threshold value set in advance; and making the nozzle tip apart from the substrate farther than in the stopping, so as to coat the substrate with the liquid material.
    • 一种通过从喷嘴头提供液体材料以在面向喷嘴的基板表面上形成膜的涂覆方法,其具有以下步骤:准备能够在平面内方向上移动喷嘴的平移机构,以及 在基板的厚度方向上; 通过使用平移机构将喷嘴定位在基板的平面上,使喷嘴逐渐靠近基板; 当从喷嘴头供给的半导体液滴与安装在基板表面的电极接触时,检测从基板表面流过喷嘴的电流; 当电流超过预先设定的阈值时,将喷嘴停留在基板上; 并且使喷嘴头远离基板远离停止,以便用液体材料涂覆基板。