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1. 发明授权

US07821795B2 Multilayer wiring board 有权
标题翻译：多层接线板
公开(公告)号：US07821795B2
公开(公告)日：2010-10-26
申请号：US11578039
申请日：2006-02-01
申请人： Yasuhiro Sugaya , Yoshiyuki Yamamoto , Toshiyuki Asahi , Katsumasa Miki , Masaaki Katsumata , Yoshiyuki Saitou , Takeshi Nakayama
发明人： Yasuhiro Sugaya , Yoshiyuki Yamamoto , Toshiyuki Asahi , Katsumasa Miki , Masaaki Katsumata , Yoshiyuki Saitou , Takeshi Nakayama
IPC分类号： H05K1/18
CPC分类号： H05K1/186 , H01L23/3128 , H01L23/49822 , H01L24/48 , H01L2224/16 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H05K3/429 , H05K3/4623 , H05K2201/09536 , H05K2201/10015 , Y10T29/4913 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A multilayered substrate includes a plurality of circuit boards including a plurality of wiring layers including a grounding layer and a power layer, a solid electrolytic capacitor having an insulative oxide film layer, an electrolytic layer, and a conductor layer sequentially formed on one surface or both surfaces of a foil-like metal substrate, and a conductive substance passing through the circuit board across a thickness thereof. The solid electrolytic capacitor is disposed to be held between the plurality of circuit boards. The conductor layer is connected to a grounding electrode formed on the grounding layer, the foil-like metal substrate being connected to a power electrode formed on the power layer.
摘要翻译：多层基板包括多个电路板，包括具有接地层和功率层的多个布线层，具有绝缘氧化物膜层的固体电解电容器，电解质层和依次形成在一个表面上的导体层箔状金属基板的表面和穿过电路板的导电物质穿过其厚度。固体电解电容器设置成保持在多个电路板之间。导体层与形成在接地层上的接地电极连接，箔状金属基板与形成在电源层上的电力电极连接。

2. 发明申请

US20070242440A1 Multilayer Wiring Board, Method for Manufacturing Such Multilayer Wiring Board, and Semiconductor Device and Electronic Device Using Multilayer Wiring Board 有权
标题翻译：多层接线板，制造这种多层接线板的方法以及使用多层接线板的半导体器件和电子设备
公开(公告)号：US20070242440A1
公开(公告)日：2007-10-18
申请号：US11578039
申请日：2006-02-01
申请人： Yasuhiro Sugaya , Yoshiyuki Yamamoto , Toshiyuki Asahi , Katsumasa Miki , Yoshiyuki Saitou , Takeshi Nakayama
发明人： Yasuhiro Sugaya , Yoshiyuki Yamamoto , Toshiyuki Asahi , Katsumasa Miki , Yoshiyuki Saitou , Takeshi Nakayama
IPC分类号： H05K1/18 , H05K3/30
CPC分类号： H05K1/186 , H01L23/3128 , H01L23/49822 , H01L24/48 , H01L2224/16 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H05K3/429 , H05K3/4623 , H05K2201/09536 , H05K2201/10015 , Y10T29/4913 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A multilayered substrate includes a plurality of circuit boards including a plurality of wiring layers including a grounding layer and a power layer, a solid electrolytic capacitor having an insulative oxide film layer, an electrolytic layer, and a conductor layer sequentially formed on one surface or both surfaces of a foil-like metal substrate, and a conductive substance passing through the circuit board across a thickness thereof. The solid electrolytic capacitor is disposed to be held between the plurality of circuit boards. The conductor layer is connected to a grounding electrode formed on the grounding layer, the foil-like metal substrate being connected to a power electrode formed on the power layer.
摘要翻译：多层基板包括多个电路板，包括具有接地层和功率层的多个布线层，具有绝缘氧化物膜层的固体电解电容器，电解质层和依次形成在一个表面上的导体层箔状金属基板的表面和穿过电路板的导电物质穿过其厚度。固体电解电容器设置成保持在多个电路板之间。导体层与形成在接地层上的接地电极连接，箔状金属基板与形成在电源层上的电力电极连接。

3. 发明申请

US20080290497A1 Mounting Board, Mounted Body, and Electronic Equipment Using the Same 失效
标题翻译：安装板，安装体和使用其的电子设备
公开(公告)号：US20080290497A1
公开(公告)日：2008-11-27
申请号：US11630025
申请日：2006-07-13
申请人： Yasuhiro Sugaya , Toshiyuki Asahi , Katsumasa Miki , Yoshiyuki Yamamoto , Hiroyuki Ishitomi , Tsuyoshi Himori
发明人： Yasuhiro Sugaya , Toshiyuki Asahi , Katsumasa Miki , Yoshiyuki Yamamoto , Hiroyuki Ishitomi , Tsuyoshi Himori
IPC分类号： H01L23/12 , H05K7/02
CPC分类号： H05K1/162 , H01L23/49822 , H01L23/49838 , H01L23/50 , H01L23/66 , H01L24/48 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/12042 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H05K3/385 , H05K3/4641 , H05K2201/0329 , H05K2201/0355 , H05K2203/0307 , H05K2203/0315 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/0401 , H01L2924/00012
摘要： The mounting board has a capacitor-forming sheet made from a valve metal, first and second board-forming structures, first and second electrodes, an extractor electrode, and a conductive polymer. The capacitor-forming sheet has an inner layer and a rough oxide film on at least one face of the inner layer. The first board-forming structure is provided on a face of the capacitor-forming sheet, and the second board-forming structure is provided on another face thereof on a side opposite to the first one. The first and second electrodes are isolated to each other and provided on a surface of at least one of the first and second board-forming structures. The extractor electrode and conductive polymer are provided inside at least one of the first and second board-forming structures. The extractor electrode electrically-connects the first electrode with the inner layer. The conductive polymer electrically-connects the second electrode with the rough oxide film.
摘要翻译：安装板具有由阀金属制成的电容器形成片，第一和第二板形成结构，第一和第二电极，提取器电极和导电聚合物。电容器形成片材在内层的至少一个面上具有内层和粗糙的氧化膜。第一板形成结构设置在电容器形成片的表面上，并且第二板形成结构在与第一板形成结构相对的一侧的另一个表面上设置。第一和第二电极彼此隔离并设置在第一和第二板形成结构中的至少一个的表面上。提取器电极和导电聚合物设置在第一和第二板形成结构中的至少一个中。提取器电极将第一电极与内层电连接。导电聚合物将第二电极与粗氧化物膜电连接。

4. 发明授权

US07667977B2 Mounting board, mounted body, and electronic equipment using the same 失效
标题翻译：安装板，安装体和使用其的电子设备
公开(公告)号：US07667977B2
公开(公告)日：2010-02-23
申请号：US11630025
申请日：2006-07-13
申请人： Yasuhiro Sugaya , Toshiyuki Asahi , Katsumasa Miki , Yoshiyuki Yamamoto , Hiroyuki Ishitomi , Tsuyoshi Himori
发明人： Yasuhiro Sugaya , Toshiyuki Asahi , Katsumasa Miki , Yoshiyuki Yamamoto , Hiroyuki Ishitomi , Tsuyoshi Himori
IPC分类号： H05K1/16
CPC分类号： H05K1/162 , H01L23/49822 , H01L23/49838 , H01L23/50 , H01L23/66 , H01L24/48 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/12042 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H05K3/385 , H05K3/4641 , H05K2201/0329 , H05K2201/0355 , H05K2203/0307 , H05K2203/0315 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/0401 , H01L2924/00012
摘要： The mounting board has a capacitor-forming sheet made from a valve metal, first and second board-forming structures, first and second electrodes, an extractor electrode, and a conductive polymer. The capacitor-forming sheet has an inner layer and a rough oxide film on at least one face of the inner layer. The first board-forming structure is provided on a face of the capacitor-forming sheet, and the second board-forming structure is provided on another face thereof on a side opposite to the first one. The first and second electrodes are isolated to each other and provided on a surface of at least one of the first and second board-forming structures. The extractor electrode and conductive polymer are provided inside at least one of the first and second board-forming structures. The extractor electrode electrically-connects the first electrode with the inner layer. The conductive polymer electrically-connects the second electrode with the rough oxide film.
摘要翻译：安装板具有由阀金属制成的电容器形成片，第一和第二板形成结构，第一和第二电极，提取器电极和导电聚合物。电容器形成片材在内层的至少一个面上具有内层和粗糙的氧化膜。第一板形成结构设置在电容器形成片的表面上，第二板形成结构在与第一板形成结构的相反侧的另一个表面上设置。第一和第二电极彼此隔离并设置在第一和第二板形成结构中的至少一个的表面上。提取器电极和导电聚合物设置在第一和第二板形成结构中的至少一个中。提取器电极将第一电极与内层电连接。导电聚合物将第二电极与粗氧化物膜电连接。

5. 发明申请

US20080024955A1 Capacitor 失效
公开(公告)号：US20080024955A1
公开(公告)日：2008-01-31
申请号：US11597812
申请日：2005-07-07
申请人： Katsumasa Miki , Tatsuo Fujii , Yuji Midou , Suzushi Kimura
发明人： Katsumasa Miki , Tatsuo Fujii , Yuji Midou , Suzushi Kimura
IPC分类号： H01G9/15 , H01G9/025 , H01G9/042 , H01G9/07
CPC分类号： H01G9/042 , H01G9/012 , H01G9/048
摘要： A capacitor includes a first capacitor element and a second capacitor element laminated on this first capacitor element. The first capacitor element is a solid electrolytic capacitor including a through-hole electrode penetrating a valve metal sheet and having one surface on which cathode and anode terminal portions are taken out. The second capacitor element has first and second electrodes which are provided via a dielectric layer, and second through-hole electrodes penetrating the dielectric layer. The second through-hole electrodes are coupled to the first electrode and insulated from the second electrode. Lead-out portions of the second electrodes are exposed from the dielectric layer. The second through-hole electrodes and the lead-out portions are disposed alternately. The first electrode is electrically coupled to the first through-hole electrode and the second electrode is electrically coupled to the valve metal sheet.

6. 发明授权

US06917514B2 Electrolytic capacitor and method for manufacturing the same 失效
标题翻译：电解电容器及其制造方法
公开(公告)号：US06917514B2
公开(公告)日：2005-07-12
申请号：US10618595
申请日：2003-07-15
申请人： Yuji Mido , Tatsuo Fujii , Katsumasa Miki , Suzushi Kimura
发明人： Yuji Mido , Tatsuo Fujii , Katsumasa Miki , Suzushi Kimura
IPC分类号： H01G9/26 , H01G9/00 , H01G9/004 , H01G9/012 , H01G9/04 , H01G9/14 , H01G9/28 , H01G4/228
CPC分类号： H01G9/012 , H01G4/33 , H01G9/04 , Y10T29/417
摘要： A solid electrolytic capacitor includes a valve metal sheet having a porous portion on one side of the sheet, a dielectric layer formed on the porous portion, a solid electrolyte layer formed on the dielectric layer, a collector layer formed on the solid electrolyte layer, a through-hole electrode connected to the collector layer and penetrating the valve metal sheet to be exposed to the other side of the sheet, and an electrode terminal insulated from the through-hole electrode and connected to the valve metal sheet. The capacitor further includes an insulating portion penetrating the valve metal sheet and a penetration electrode penetrating the insulating portion. The solid electrolytic capacitor has a large capacitance and an excellent radio frequency response, and can be easily mounted on a semiconductor device.
摘要翻译：固体电解电容器包括在片材的一侧具有多孔部分的阀金属片，形成在多孔部分上的电介质层，形成在电介质层上的固体电解质层，形成在固体电解质层上的集电层，连接到集电体层并穿透阀金属片以暴露于片材的另一侧的通孔电极以及与通孔电极绝缘并连接到阀金属片的电极端子。电容器还包括穿透阀金属片的绝缘部分和穿透绝缘部分的穿透电极。固体电解电容器具有大的电容和优异的射频响应，并且可以容易地安装在半导体器件上。

7. 发明授权

US06855177B2 Method for producing solid electrolytic capacitor 失效
标题翻译：固体电解电容器的制造方法
公开(公告)号：US06855177B2
公开(公告)日：2005-02-15
申请号：US10362227
申请日：2002-06-24
申请人： Tatsuo Fujii , Katsumasa Miki , Makoto Nakano , Suzushi Kimura , Yuji Mido
发明人： Tatsuo Fujii , Katsumasa Miki , Makoto Nakano , Suzushi Kimura , Yuji Mido
IPC分类号： H01G9/028 , H01G9/00 , H01G9/012 , H01G9/04 , H01G9/08 , H01G9/15 , H01G4/228
CPC分类号： H01G9/15 , Y10T29/417 , Y10T29/43 , Y10T29/49128 , Y10T29/49165
摘要： A method for manufacturing large capacitance solid electrolytic capacitors that can be connected direct with semiconductor component, and offer a superior high frequency characteristic. An aluminum foil 3 is made porous in one of the surfaces, a dielectric layer 2 is formed on the porous portion, a through hole 4 is provided in the aluminum foil 3 at a certain specific location. An insulation layer 5 is formed to cover the other surface, viz. non-porous surface, of the aluminum foil 3 and the inner wall surface of through hole 4, a solid electrolytic layer 6 is provided on the dielectric layer 2, and a through hole electrode 7 is formed in the through hole 4, and then a collector layer 8 is formed on the solid electrolytic layer 6. The insulation layer 5 disposed on aluminum foil 3 is provided with an opening 9 at a certain specific location, and a connection terminal 10 is provided at the opening 9 of insulation layer 5 and the exposed surface of the through hole electrode 7, respectively.
摘要翻译：一种可直接与半导体元件连接的大容量固体电解电容器的制造方法，具有优异的高频特性。在其中一个表面上形成铝箔3多孔，在多孔部分上形成电介质层2，在铝箔3中的特定位置设置有通孔4。形成绝缘层5以覆盖另一表面，即，铝箔3的无孔表面和通孔4的内壁表面，在电介质层2上设置固体电解质层6，并且在通孔4中形成通孔电极7，然后将集电体层8形成在固体电解质层6上。设置在铝箔3上的绝缘层5在特定位置设置有开口9，并且在绝缘层5的开口9处设置有连接端子10，通孔电极7的暴露表面。

8. 发明授权

US06852137B2 Method for manufacturing solid electrolytic capacitor 失效
标题翻译：固体电解电容器的制造方法
公开(公告)号：US06852137B2
公开(公告)日：2005-02-08
申请号：US10363132
申请日：2002-07-16
申请人： Katsumasa Miki , Yuji Mido , Tatsuo Fujii , Makoto Nakano , Suzushi Kimura
发明人： Katsumasa Miki , Yuji Mido , Tatsuo Fujii , Makoto Nakano , Suzushi Kimura
IPC分类号： H01G9/00 , H01G9/012 , H01G9/15 , H01G4/228 , H01G9/10
CPC分类号： H01G9/15 , H01G9/012 , Y10T29/417
摘要： A method for manufacturing solid electrolytic capacitor that can be mounted direct on a semiconductor component and offers a superior high frequency characteristic. An aluminum foil 20 is provided on one surface with a resist film 23 and then with a through hole 24. Next, an insulation film 25 is formed to cover the other surface of aluminum foil 20 and to fill the first through hole, and then the resist film 23 is removed; and then the surface of aluminum foil 20 is roughened to be provided with a dielectric layer 27 thereon. A second through hole 36 is formed in the insulation film 25, which is filling the first through hole 24. A through hole electrode 28 is formed in the second through hole; and then, on the surface of the dielectric layer 27, a solid electrolytic layer 29 and a collector layer 30 are formed. After an opening 37 is provided, a first connection terminal 31 is formed therein, and a second connection electrode 32 on the exposed surface of the through hole electrode 28.
摘要翻译：一种制造固体电解电容器的方法，其可以直接安装在半导体部件上并提供优异的高频特性。铝箔20在一个表面上设置有抗蚀剂膜23，然后用通孔24提供。接下来，形成绝缘膜25以覆盖铝箔20的另一个表面并填充第一通孔，然后除去抗蚀剂膜23; 然后将铝箔20的表面粗糙化，在其上设置介电层27。第二通孔36形成在填充第一通孔24的绝缘膜25中。在第二通孔中形成有通孔电极28，然后在电介质层27的表面上形成固体电解质层29和集电体层30。在提供开口37之后，在其中形成第一连接端子31，并且在通孔电极28的暴露表面上形成第二连接电极32。

9. 发明授权

US06785147B2 Circuit module 有权
标题翻译：电路模块
公开(公告)号：US06785147B2
公开(公告)日：2004-08-31
申请号：US10381891
申请日：2003-06-23
申请人： Katsumasa Miki , Yuji Mido , Tetsuhiro Korechika , Suzushi Kimura
发明人： Katsumasa Miki , Yuji Mido , Tetsuhiro Korechika , Suzushi Kimura
IPC分类号： H05K702
CPC分类号： H05K1/185 , H01G4/40 , H01G9/15 , H01L23/50 , H01L2924/0002 , H01L2924/3011 , H05K1/162 , H05K2201/0187 , H05K2203/0315 , H01L2924/00
摘要： The present invention aims to provide a circuit module that includes a sheet-like solid electrolytic capacitor and reduces an area and volume required for mounting electronic components. In the sheet-like solid electrolytic capacitor, valve metal sheet 11 has dielectric layer 13 and current collector layer 12 formed on the surface thereof, and is packaged by insulators 14 and 15. The circuit module is structured to embed the sheet-like solid electrolytic capacitor in a circuit board.
摘要翻译：本发明旨在提供一种电路模块，其包括片状固体电解电容器，并减少了安装电子部件所需的面积和体积。在片状固体电解电容器中，阀金属片11具有形成在其表面上的电介质层13和集电体层12，并且由绝缘体14和15封装。电路模块被构造成将片状固体电解质电容器在电路板上。

10. 发明授权

US07443655B2 Capacitor 失效
标题翻译：电容器
公开(公告)号：US07443655B2
公开(公告)日：2008-10-28
申请号：US11597812
申请日：2005-07-07
申请人： Katsumasa Miki , Tatsuo Fujii , Yuji Midou , Suzushi Kimura
发明人： Katsumasa Miki , Tatsuo Fujii , Yuji Midou , Suzushi Kimura
IPC分类号： H01G5/38 , H01G4/228
CPC分类号： H01G9/042 , H01G9/012 , H01G9/048
摘要： A capacitor includes a first capacitor element and a second capacitor element laminated on this first capacitor element. The first capacitor element is a solid electrolytic capacitor including a through-hole electrode penetrating a valve metal sheet and having one surface on which cathode and anode terminal portions are taken out. The second capacitor element has first and second electrodes which are provided via a dielectric layer, and second through-hole electrodes penetrating the dielectric layer. The second through-hole electrodes are coupled to the first electrode and insulated from the second electrode. Lead-out portions of the second electrodes are exposed from the dielectric layer. The second through-hole electrodes and the lead-out portions are disposed alternately. The first electrode is electrically coupled to the first through-hole electrode and the second electrode is electrically coupled to the valve metal sheet.
摘要翻译：电容器包括层叠在该第一电容器元件上的第一电容器元件和第二电容器元件。第一电容器元件是固体电解电容器，其包括穿透阀金属片的通孔电极，并且具有其上取出阴极和阳极端子部分的一个表面。第二电容器元件具有通过电介质层提供的第一和第二电极，以及穿过电介质层的第二通孔电极。第二通孔电极耦合到第一电极并与第二电极绝缘。第二电极的引出部分从电介质层露出。第二通孔电极和引出部分交替设置。第一电极电耦合到第一通孔电极，第二电极电耦合到阀金属片。

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