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    • 1. 发明授权
    • Method of manufacturing solid-state electrolytic capacitor
    • 固态电解电容器的制造方法
    • US06794260B2
    • 2004-09-21
    • US10415946
    • 2003-10-08
    • Tatsuo FujiiMakoto NakanoYuji MidoKatsumasa MikiSuzushi Kimura
    • Tatsuo FujiiMakoto NakanoYuji MidoKatsumasa MikiSuzushi Kimura
    • H01L2120
    • H01G9/012H01G9/15Y10T29/417
    • A method of manufacturing solid electrolytic capacitors that can be directly connected to semiconductor components and have a faster response to a high frequency as well as a larger capacitance includes: a dielectric forming stage where a valve metal sheet (2) is made porous and a dielectric coating (7) is provided on the porous face (3); an element forming stage where a solid electrolytic layer (8) and a collector layer (10) are formed on the dielectric coating (7); and a terminal forming stage where a connecting terminal (16) for connecting to an external electrode is formed. The element forming stage includes the steps of forming the solid electrolytic layer (8); a forming through-hole electrode (9) in a through-hole (5) that is prepared on the valve metal sheet (2); and forming the collector (10) on the solid electrolytic layer (8).
    • 可以直接连接到半导体部件并且对高频率的响应更快的固体电解电容器的制造方法以及更大的电容包括:电介质形成阶段,其中阀金属片(2)制成多孔的,并且电介质 在多孔面(3)上设置涂层(7) 在电介质涂层(7)上形成固体电解质层(8)和集电极层(10)的元件形成阶段; 以及形成用于连接到外部电极的连接端子(16)的端子形成台。 元件形成阶段包括形成固体电解质层(8)的步骤。 在阀金属片(2)上制备的通孔(5)中形成通孔电极(9); 以及在所述固体电解质层(8)上形成所述集电体(10)。
    • 2. 发明授权
    • Method for producing solid electrolytic capacitor
    • 固体电解电容器的制造方法
    • US06855177B2
    • 2005-02-15
    • US10362227
    • 2002-06-24
    • Tatsuo FujiiKatsumasa MikiMakoto NakanoSuzushi KimuraYuji Mido
    • Tatsuo FujiiKatsumasa MikiMakoto NakanoSuzushi KimuraYuji Mido
    • H01G9/028H01G9/00H01G9/012H01G9/04H01G9/08H01G9/15H01G4/228
    • H01G9/15Y10T29/417Y10T29/43Y10T29/49128Y10T29/49165
    • A method for manufacturing large capacitance solid electrolytic capacitors that can be connected direct with semiconductor component, and offer a superior high frequency characteristic. An aluminum foil 3 is made porous in one of the surfaces, a dielectric layer 2 is formed on the porous portion, a through hole 4 is provided in the aluminum foil 3 at a certain specific location. An insulation layer 5 is formed to cover the other surface, viz. non-porous surface, of the aluminum foil 3 and the inner wall surface of through hole 4, a solid electrolytic layer 6 is provided on the dielectric layer 2, and a through hole electrode 7 is formed in the through hole 4, and then a collector layer 8 is formed on the solid electrolytic layer 6. The insulation layer 5 disposed on aluminum foil 3 is provided with an opening 9 at a certain specific location, and a connection terminal 10 is provided at the opening 9 of insulation layer 5 and the exposed surface of the through hole electrode 7, respectively.
    • 一种可直接与半导体元件连接的大容量固体电解电容器的制造方法,具有优异的高频特性。 在其中一个表面上形成铝箔3多孔,在多孔部分上形成电介质层2,在铝箔3中的特定位置设置有通孔4。 形成绝缘层5以覆盖另一表面,即, 铝箔3的无孔表面和通孔4的内壁表面,在电介质层2上设置固体电解质层6,并且在通孔4中形成通孔电极7,然后将 集电体层8形成在固体电解质层6上。设置在铝箔3上的绝缘层5在特定位置设置有开口9,并且在绝缘层5的开口9处设置有连接端子10, 通孔电极7的暴露表面。
    • 3. 发明授权
    • Method for manufacturing solid electrolytic capacitor
    • 固体电解电容器的制造方法
    • US06852137B2
    • 2005-02-08
    • US10363132
    • 2002-07-16
    • Katsumasa MikiYuji MidoTatsuo FujiiMakoto NakanoSuzushi Kimura
    • Katsumasa MikiYuji MidoTatsuo FujiiMakoto NakanoSuzushi Kimura
    • H01G9/00H01G9/012H01G9/15H01G4/228H01G9/10
    • H01G9/15H01G9/012Y10T29/417
    • A method for manufacturing solid electrolytic capacitor that can be mounted direct on a semiconductor component and offers a superior high frequency characteristic. An aluminum foil 20 is provided on one surface with a resist film 23 and then with a through hole 24. Next, an insulation film 25 is formed to cover the other surface of aluminum foil 20 and to fill the first through hole, and then the resist film 23 is removed; and then the surface of aluminum foil 20 is roughened to be provided with a dielectric layer 27 thereon. A second through hole 36 is formed in the insulation film 25, which is filling the first through hole 24. A through hole electrode 28 is formed in the second through hole; and then, on the surface of the dielectric layer 27, a solid electrolytic layer 29 and a collector layer 30 are formed. After an opening 37 is provided, a first connection terminal 31 is formed therein, and a second connection electrode 32 on the exposed surface of the through hole electrode 28.
    • 一种制造固体电解电容器的方法,其可以直接安装在半导体部件上并提供优异的高频特性。 铝箔20在一个表面上设置有抗蚀剂膜23,然后用通孔24提供。接下来,形成绝缘膜25以覆盖铝箔20的另一个表面并填充第一通孔,然后 除去抗蚀剂膜23; 然后将铝箔20的表面粗糙化,在其上设置介电层27。 第二通孔36形成在填充第一通孔24的绝缘膜25中。在第二通孔中形成有通孔电极28, 然后在电介质层27的表面上形成固体电解质层29和集电体层30。 在提供开口37之后,在其中形成第一连接端子31,并且在通孔电极28的暴露表面上形成第二连接电极32。
    • 7. 发明授权
    • Solid electrolytic capacitor and manufacturing method of the same
    • 固体电解电容器及其制造方法相同
    • US06822849B2
    • 2004-11-23
    • US10703462
    • 2003-11-10
    • Katsumasa MikiTatsuo FujiiYuji MidoSuzushi Kimura
    • Katsumasa MikiTatsuo FujiiYuji MidoSuzushi Kimura
    • H01G900
    • H01G9/15H01G9/012H01G9/042Y10T29/417
    • A solid electrolytic capacitor includes a bulb-metal sheet of which first face has a porous section. A dielectric film, a solid electrolyte layer, and a current-collecting layer are formed in this order on the porous section. On top of the current-collecting layer, a reinforcing plate is bonded. A second face opposite to the first face of the sheet has a connecting terminal conductive to the current-collecting layer. This connecting terminal is coupled to a through-hole electrode which extends through the bulb-metal sheet for appearing outside the second face. The second face has another connecting terminal conductive to the bulb-metal sheet. This structure makes the capacitor thin, and allows the capacitor to increase its stress-resistance and be excellent in responsiveness to a high frequency as well as in mounting convenience.
    • 固体电解电容器包括其第一面具有多孔部分的灯泡金属片。 在多孔部上依次形成电介质膜,固体电解质层和集电层。 在电流收集层的顶部,结合有加强板。 与片材的第一面相对的第二面具有与集电层导电的连接端子。 该连接端子连接到贯穿灯泡金属片的通孔电极,以露出第二面。 第二面具有与灯泡金属片导电的另一连接端子。 这种结构使得电容器变薄,并且允许电容器增加其耐应力,并且对高频响应性以及安装方便性优异。
    • 10. 发明授权
    • Capacitor
    • 电容器
    • US07443655B2
    • 2008-10-28
    • US11597812
    • 2005-07-07
    • Katsumasa MikiTatsuo FujiiYuji MidouSuzushi Kimura
    • Katsumasa MikiTatsuo FujiiYuji MidouSuzushi Kimura
    • H01G5/38H01G4/228
    • H01G9/042H01G9/012H01G9/048
    • A capacitor includes a first capacitor element and a second capacitor element laminated on this first capacitor element. The first capacitor element is a solid electrolytic capacitor including a through-hole electrode penetrating a valve metal sheet and having one surface on which cathode and anode terminal portions are taken out. The second capacitor element has first and second electrodes which are provided via a dielectric layer, and second through-hole electrodes penetrating the dielectric layer. The second through-hole electrodes are coupled to the first electrode and insulated from the second electrode. Lead-out portions of the second electrodes are exposed from the dielectric layer. The second through-hole electrodes and the lead-out portions are disposed alternately. The first electrode is electrically coupled to the first through-hole electrode and the second electrode is electrically coupled to the valve metal sheet.
    • 电容器包括层叠在该第一电容器元件上的第一电容器元件和第二电容器元件。 第一电容器元件是固体电解电容器,其包括穿透阀金属片的通孔电极,并且具有其上取出阴极和阳极端子部分的一个表面。 第二电容器元件具有通过电介质层提供的第一和第二电极,以及穿过电介质层的第二通孔电极。 第二通孔电极耦合到第一电极并与第二电极绝缘。 第二电极的引出部分从电介质层露出。 第二通孔电极和引出部分交替设置。 第一电极电耦合到第一通孔电极,第二电极电耦合到阀金属片。