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    • 9. 发明申请
    • COMMUNICATION METHOD AND COMMUNICATION SYSTEM
    • 通信方法与通信系统
    • US20100260274A1
    • 2010-10-14
    • US12756888
    • 2010-04-08
    • Hideaki Yamada
    • Hideaki Yamada
    • H04L27/00
    • H03M5/14
    • A communication method includes: (a) dividing one bit data group into a plurality of bit groups, the one bit data group being taken out from a plurality of bit data groups defined by a communication protocol for transmitting predetermined information, and exerting no substantial influence on the predetermined information even when arbitrarily inverting a value of the bit; (b) determining whether or not the values of the bits constituting the bit group are all the same by each of the plurality of bit groups divided into in step (a); (c) inverting at least one of the values of the bits of the bit group determined in step (b) that the values of the bits are all the same; and (d) arranging the plurality of bit groups, each of which has at least one of the values of the bits inverted in step (c), in the plurality of bit data groups except the one bit data group at regular intervals.
    • 一种通信方法包括:(a)将一个比特数据组划分成多个比特组,从由用于发送预定信息的通信协议定义的多个比特数据组中取出一比特数据组,并且不施加实质影响 即使当任意地反转位的值时,也可以对预定信息进行处理; (b)通过步骤(a)中划分的多个比特组中的每一个来确定构成比特组的比特的值是否全部相同; (c)将在步骤(b)中确定的比特组的比特的值中的至少一个值反转为比特的值全部相同; 以及(d)在所述多个比特数据组中排列多个比特组,每个比特组具有在步骤(c)中反转的比特值中的至少一个的值,该比特数据组除了一个比特数据组以规则的间隔。
    • 10. 发明申请
    • Surface acoustic wave pressure sensor
    • 表面声波压力传感器
    • US20100186514A1
    • 2010-07-29
    • US12656209
    • 2010-01-21
    • Akihiko TeshigaharaHideaki Yamada
    • Akihiko TeshigaharaHideaki Yamada
    • G01L11/04
    • G01L9/0025G01L9/008
    • A sensor chip has a substrate and a comb-teeth electrode arranged on the substrate. The sensor chip is fixed to a diaphragm structure to be distorted by receiving pressure, and is fixed to the diaphragm structure only through a predetermined fix area so as to detect the pressure. The fix area is defined on only a part of the sensor chip opposing to the diaphragm structure. The sensor chip is restrained by the diaphragm structure in a direction of transmitting surface acoustic wave. Flexibility of the sensor chip in a perpendicular direction approximately perpendicular to the wave transmitting direction is larger than that in the transmitting direction.
    • 传感器芯片具有布置在基板上的基板和梳齿电极。 传感器芯片固定在膜片结构上,通过接受压力而变形,并且仅通过预定的固定区域固定到膜片结构,以便检测压力。 固定区仅限于与隔膜结构相对的传感器芯片的一部分。 传感器芯片在传播表面声波的方向上被隔膜结构约束。 传感器芯片在大致垂直于波浪传播方向的垂直方向上的灵活性大于传送方向的灵敏度。