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    • 4. 发明申请
    • SCHOTTKY ELECTRODE FOR DIAMOND SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    • 肖特基电极用于金刚石半导体器件及其制造方法
    • US20100117098A1
    • 2010-05-13
    • US12597578
    • 2008-04-14
    • Kazuhiro IkedaHitoshi UmezawaShinichi Shikata
    • Kazuhiro IkedaHitoshi UmezawaShinichi Shikata
    • H01L29/47H01L29/12H01L21/04
    • H01L29/47C22C5/04H01L21/0435H01L29/1602H01L29/6603H01L29/872
    • To provide a Schottky electrode in a diamond semiconductor, which has a good adhesion properties to diamonds, has a contacting surface which does not become peeled due to an irregularity in an external mechanical pressure, does not cause a reduction in yield in a diode forming process and does not cause deterioration in current-voltage characteristics, and a method of manufacturing the Schottky electrode.A Schottky electrode which includes: scattered island-form pattern Pt-group alloy thin films which are formed on a diamond surface formed on a substrate, in which the Pt-group alloy includes 50 to 99.9 mass % of Pt and 0.1 to 50 mass % of Ru and/or Ir, or which includes electrodes in a scattered island pattern, including: scattered island-form pattern metal thin films which are formed on a diamond surface formed on a substrate and include one selected from Pt and Pd; and metal thin films which include one selected from Ru, Ir and Rh and are provided on all of the metal thin films which include one selected from Pt and Pd, and a method of manufacturing the Schottky electrode.
    • 为了在金刚石半导体中提供肖特基电极,该金刚石半导体具有良好的金刚石粘合性,具有由于外部机械压力不均匀而不会剥离的接触表面,在二极管形成过程中不会导致产率降低 并且不会导致电流 - 电压特性的劣化,以及制造肖特基电极的方法。 一种肖特基电极,其包括:形成在形成于基板上的金刚石表面上的散射岛状图案Pt族合金薄膜,其中Pt族合金包含Pt为50〜99.9质量%,0.1〜50质量% 包括:散射岛状图案金属薄膜,其形成在形成于基板上的金刚石表面上,并且包括选自Pt和Pd中的一种; 以及包括选自Ru,Ir和Rh中的一种并且设置在包括选自Pt和Pd中的一种的所有金属薄膜上的金属薄膜和制造肖特基电极的方法。
    • 9. 发明授权
    • Surface acoustic wave device
    • 表面声波装置
    • US06469416B1
    • 2002-10-22
    • US09959954
    • 2001-11-13
    • Katsuhiro ItakuraAkihiro HachigoHideaki NakahataSatoshi FujiiShinichi Shikata
    • Katsuhiro ItakuraAkihiro HachigoHideaki NakahataSatoshi FujiiShinichi Shikata
    • H03H925
    • H03H9/02984H03H9/02574H03H9/02582
    • A surface acoustic wave (SAW) device is provided that is suitable for mass production and that has excellent operational performance at the superhigh-frequency range. The SAW device comprises (a) a diamond layer 3; (b) a ZnO layer 4, with a thickness of tz, formed on the diamond layer 3; (c) interdigital transducers (IDTs) 5, which excite and receive a SAW, formed on the ZnO layer 4; and (d) an SiO2 layer 6, with a thickness of ts, formed on the ZnO layer 4 so that the SiO2 layer can cover the IDTs 5. The structure of the SAW device is determined by specific numeric ranges of the parameters kh1 and kh2, which are given in equations kh1=5·2&pgr;·(tz/&lgr;) and kh2=5·2&pgr;(ts/&lgr;), where &lgr; signifies the wavelength of the fundamental wave of the second mode of the SAW. The SAW device uses the fifth harmonic of the second mode of the SAW.
    • 提供了适用于批量生产并且在超高频范围内具有优异的操作性能的表面声波(SAW)装置。 SAW器件包括(a)金刚石层3; (b)在金刚石层3上形成厚度为tz的ZnO层4; (c)在ZnO层4上形成的用于激发和接收SAW的叉指换能器(IDT)5; 和(d)在ZnO层4上形成厚度为ts的SiO 2层6,使得SiO 2层可以覆盖IDT 5. SAW器件的结构由参数kh1和kh2的特定数值范围确定 ,其方程式为kh1 = 5.2pi(tz / lambd)和kh2 = 5.2pi(ts / lambd),其中lambd表示SAW的第二模式的基波的波长。 SAW器件使用SAW的第二模式的第五谐波。