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    • 2. 发明申请
    • Non-volatile semiconductor memory device
    • 非易失性半导体存储器件
    • US20050047210A1
    • 2005-03-03
    • US10965775
    • 2004-10-18
    • Yasuhiko MatsunagaToshitake YaegashiFumitaka AraiRiichiro Shirota
    • Yasuhiko MatsunagaToshitake YaegashiFumitaka AraiRiichiro Shirota
    • G11C16/02G11C16/04G11C16/06G11C16/10H01L21/8247H01L27/115H01L29/788H01L29/792G11C11/34
    • G11C16/0483G11C16/10
    • A non-volatile semiconductor memory device having a write mode in which wrong writing is prevented surely. The storage device comprises a NAND cell comprising a plurality of memory transistors connected in series and also connected at one end via a select gate transistor CG1 to a bit line BL and at the other end via a select gate transistor SG2 to a common source line SL. A write voltage Vpgm is applied to a control gate of a selected memory transistor in the NAND cell and Vss is applied to the controls gates of non-select memory transistors each adjacent to the selected memory transistor to thereby write data into the select memory transistor. When a second memory transistor from the bitline BL side is selected in the writing operation, a medium voltage Vpass is applied to the control gate of a first non-selected memory transistor from the bit line BL side, and a medium voltage Vpass is applied to the control gates of third and subsequent non-selected memory transistors from the bit line BL side.
    • 具有写入模式的非易失性半导体存储器件,其中可以可靠地防止写入错误。 存储装置包括NAND单元,其包括串联连接的多个存储晶体管,并且一端经选择栅极晶体管CG1连接到位线BL,另一端经由选择栅极晶体管SG2连接到公共源极线SL 。 写入电压Vpgm被施加到NAND单元中所选择的存储晶体管的控制栅极,并且Vss被施加到与选择的存储晶体管相邻的非选择存储晶体管的控制栅极,从而将数据写入选择存储晶体管。 当在写入操作中选择来自位线BL侧的第二存储晶体管时,从位线BL侧向第一非选择存储晶体管的控制栅极施加中等电压Vpass,并将中压Vpass施加到 来自位线BL侧的第三和随后的未选择的存储器晶体管的控制栅极。
    • 3. 发明授权
    • Non-volatile semiconductor memory device
    • 非易失性半导体存储器件
    • US07184309B2
    • 2007-02-27
    • US10965775
    • 2004-10-18
    • Yasuhiko MatsunagaToshitake YaegashiFumitaka AraiRiichiro Shirota
    • Yasuhiko MatsunagaToshitake YaegashiFumitaka AraiRiichiro Shirota
    • G11C16/04
    • G11C16/0483G11C16/10
    • A non-volatile semiconductor memory device having a write mode in which wrong writing is prevented surely. The storage device comprises a NAND cell comprising a plurality of memory transistors connected in series and also connected at one end via a select gate transistor CG1 to a bit line BL and at the other end via a select gate transistor SG2 to a common source line SL. A write voltage Vpgm is applied to a control gate of a selected memory transistor in the NAND cell and Vss is applied to the controls gates of non-select memory transistors each adjacent to the selected memory transistor to thereby write data into the select memory transistor. When a second memory transistor from the bitline BL side is selected in the writing operation, a medium voltage Vpass is applied to the control gate of a first non-selected memory transistor from the bit line BL side, and a medium voltage Vpass is applied to the control gates of third and subsequent non-selected memory transistors from the bit line BL side.
    • 具有写入模式的非易失性半导体存储器件,其中可以可靠地防止写入错误。 存储装置包括NAND单元,其包括串联连接的多个存储晶体管,并且其一端经由选择栅极晶体管CG 1连接到位线BL,另一端经由选择栅极晶体管SG2连接到公共源极 线SL。 写入电压Vpgm被施加到NAND单元中所选择的存储晶体管的控制栅极,并且Vss被施加到与选择的存储晶体管相邻的非选择存储晶体管的控制栅极,从而将数据写入选择存储晶体管。 当在写入操作中选择来自位线BL侧的第二存储晶体管时,从位线BL侧向第一非选择存储晶体管的控制栅极施加中等电压Vpass,并将中压Vpass施加到 来自位线BL侧的第三和随后的未选择的存储器晶体管的控制栅极。
    • 5. 发明授权
    • NAND type non-volatile semiconductor memory device
    • NAND型非易失性半导体存储器件
    • US06859394B2
    • 2005-02-22
    • US10090995
    • 2002-03-06
    • Yasuhiko MatsunagaToshitake YaegashiFumitaka AraiRiichiro Shirota
    • Yasuhiko MatsunagaToshitake YaegashiFumitaka AraiRiichiro Shirota
    • G11C16/02G11C16/04G11C16/06G11C16/10H01L21/8247H01L27/115H01L29/788H01L29/792
    • G11C16/0483G11C16/10
    • A non-volatile semiconductor memory device having a write mode in which wrong writing is prevented surely. The storage device comprises a NAND cell comprising a plurality of memory transistors connected in series and also connected at one end via a select gate transistor CG1 to a bit line BL and at the other end via a select gate transistor SG2 to a common source line SL. A write voltage Vpgm is applied to a control gate of a selected memory transistor in the NAND cell and Vss is applied to the controls gates of non-select memory transistors each adjacent to the selected memory transistor to thereby write data into the select memory transistor. When a second memory transistor from the bit line BL side is selected in the writing operation, a medium voltage Vpass is applied to the control gate of a first non-selected memory transistor from the bit line BL side, and a medium voltage Vpass is applied to the control gates of third and subsequent non-selected memory transistors from the bit line BL side.
    • 具有写入模式的非易失性半导体存储器件,其中可以可靠地防止写入错误。 存储装置包括NAND单元,其包括串联连接的多个存储晶体管,并且一端经选择栅极晶体管CG1连接到位线BL,另一端经由选择栅极晶体管SG2连接到公共源极线SL 。 写入电压Vpgm被施加到NAND单元中所选择的存储晶体管的控制栅极,并且Vss被施加到与所选存储晶体管相邻的非选择存储晶体管的控制栅极,从而将数据写入选择存储晶体管。 当在写入操作中选择来自位线BL侧的第二存储晶体管时,中间电压Vpass从位线BL侧施加到第一未选择的存储晶体管的控制栅极,施加中等电压Vpass 从位线BL侧到第三和随后的未选择的存储器晶体管的控制栅极。
    • 9. 发明申请
    • SEMICONDUCTOR DEVICE WITH DOUBLE BARRIER FILM
    • 具有双屏障膜的半导体器件
    • US20080251881A1
    • 2008-10-16
    • US12143597
    • 2008-06-20
    • Makoto SakumaYasuhiko MatsunagaFumitaka AraiKikuko Sugimae
    • Makoto SakumaYasuhiko MatsunagaFumitaka AraiKikuko Sugimae
    • H01L29/00
    • H01L27/115H01L27/105H01L27/11526H01L27/11529
    • A semiconductor device comprising a first insulation layer, a second insulation layer, a first barrier film, a second barrier film, a diffusion layer. The device further comprises an upper contact hole, a lower contact hole, and a contact plug. The upper contact hole penetrates the second insulation layer and has a bottom in the second barrier film. The bottom has a width greater than a trench made in the first insulation layer, as measured in a direction crossing the widthwise direction of the trench. The lower contact hole penetrates the first insulation layer and first barrier film, communicates with the first contact hole via the trench and is provided on the diffusion layer. The upper portion of the lower contact hole has the same width as the trench. The contact plug is provided in the upper contact hole and lower contact hole.
    • 一种半导体器件,包括第一绝缘层,第二绝缘层,第一阻挡膜,第二阻挡膜,扩散层。 该装置还包括上接触孔,下接触孔和接触塞。 上接触孔穿透第二绝缘层,并且在第二阻挡膜中具有底部。 底部的宽度大于在与沟槽宽度方向交叉的方向上测量的在第一绝缘层中形成的沟槽。 下接触孔穿过第一绝缘层和第一阻挡膜,经由沟槽与第一接触孔连通并设置在扩散层上。 下接触孔的上部具有与沟槽相同的宽度。 接触塞设置在上接触孔和下接触孔中。