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1. 发明申请

US20110122653A1 OPTICAL PLATE WITH MICRO-STRUCTURES AND BACKLIGHT MODULE USING SAME 有权
标题翻译：具有微结构的光学板和使用相同的背光模块
公开(公告)号：US20110122653A1
公开(公告)日：2011-05-26
申请号：US12953232
申请日：2010-11-23
申请人： YU-JU HSU , HSIEN-WEN CHANG , KO-WEI CHIEN , YI-LIN CHANG
发明人： YU-JU HSU , HSIEN-WEN CHANG , KO-WEI CHIEN , YI-LIN CHANG
IPC分类号： F21V7/04
CPC分类号： G02B5/045 , G02B5/0231
摘要： An exemplary optical plate includes a base and an array of micro-structures. The base includes a first surface and a second surface opposite to the first surface. The micro-structures are provided at the first surface. Each micro-structure includes a base surface substantially coplanar with the first surface of the base and two side surfaces. The base surface has an approximately olive-shaped profile enclosed by two arc-outlines. The two side surfaces extend obliquely from the two arc-outlines and intersect at a ridge of the micro-structure.
摘要翻译：示例性的光学板包括基底和微结构的阵列。底座包括与第一表面相对的第一表面和第二表面。微结构设置在第一表面。每个微结构包括与基部的第一表面和两个侧表面基本上共面的基面。基面具有由两个弧形轮廓包围的大致橄榄形轮廓。两个侧表面从两个弧形轮廓倾斜延伸，并在微结构的脊处相交。

2. 发明申请

US20120094405A1 METHOD FOR MANUFACTURING LED PACKAGE 审中-公开
标题翻译：制造LED封装的方法
公开(公告)号：US20120094405A1
公开(公告)日：2012-04-19
申请号：US13220708
申请日：2011-08-30
申请人： HSIN-TUNG CHIANG , KO-WEI CHIEN
发明人： HSIN-TUNG CHIANG , KO-WEI CHIEN
IPC分类号： H01L33/50
CPC分类号： H01L33/44 , H01L24/97 , H01L33/486 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/01322 , H01L2924/12041 , H01L2924/14 , H01L2933/0033 , H01L2924/00014 , H01L2924/00 , H01L2224/85
摘要： A method for manufacturing an LED package includes following steps: providing a substrate, wherein the substrate includes a plurality of package carriers and each package carrier includes two lead frames. Each package carrier includes a first surface and a recession surrounded by a bottom wall and a sidewall is defined on the first surface. Mount an LED chip on the bottom wall and electrical connecting the LED chip and the two lead frames, form an encapsulation in the recession; form a hydrophobic layer on the package carrier and the encapsulation; cut the substrate into a plurality of LED package structure.
摘要翻译：一种用于制造LED封装的方法包括以下步骤：提供衬底，其中衬底包括多个封装载体，并且每个封装载体包括两个引线框架。每个包装载体包括第一表面，并且由底壁包围的凹陷和限定在第一表面上的侧壁。将LED芯片安装在底壁上，并将LED芯片和两个引线框架电连接，在衰退时形成封装; 在包装载体上形成疏水层和封装; 将基板切割成多个LED封装结构。

3. 发明申请

US20110186888A1 SEMICONDUCTOR LIGHTING MODULE PACKAGE 有权
标题翻译：半导体照明模块封装
公开(公告)号：US20110186888A1
公开(公告)日：2011-08-04
申请号：US12891815
申请日：2010-09-28
申请人： KO-WEI CHIEN
发明人： KO-WEI CHIEN
IPC分类号： H01L33/46
CPC分类号： H01L33/60 , H01L33/46 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2924/0002 , H01L2924/12044 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor lighting module package comprises a substrate, a lead frame, at least one semiconductor lighting element, and a plurality of nanoscale reflectors formed on the substrate and the lead frame for increasing reflection efficiency of the lighting module package. A pitch between every two of the plurality of nanoscale reflectors has a distance P which is shorter than a half wavelength of the visible light. Moreover, a gap between every two of the plurality of the nanoscale reflectors has a depth H, and a ratio of the depth H over the distance P is not less than 2. The distance P is between 90 nm and 130 nm. Furthermore, the light generated by the semiconductor lighting element has at least a part which is reflected by the nanoscale reflectors.
摘要翻译：半导体照明模块封装包括衬底，引线框架，至少一个半导体照明元件以及形成在衬底和引线框架上的多个纳米级反射器，用于提高照明模块封装的反射效率。多个纳米级反射器中的每两个之间的间距具有比可见光的半波长短的距离P. 此外，多个纳米级反射器中的每两个之间的间隙具有深度H，并且深度H在距离P上的比率不小于2.距离P在90nm和130nm之间。此外，由半导体照明元件产生的光至少具有被纳米级反射器反射的部分。

4. 发明申请

US20110156085A1 SEMICONDUCTOR PACKAGE 有权
标题翻译：半导体封装
公开(公告)号：US20110156085A1
公开(公告)日：2011-06-30
申请号：US12903116
申请日：2010-10-12
申请人： HUNG-CHIN LIN , KUO-FU PENG , CHIEN-MIN CHEN , KO-WEI CHIEN
发明人： HUNG-CHIN LIN , KUO-FU PENG , CHIEN-MIN CHEN , KO-WEI CHIEN
IPC分类号： H01L33/52 , H01L23/495
CPC分类号： H01L33/64 , H01L33/486 , H01L33/641 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/3011 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor package includes at least four lead frames each having an extending portion and a connecting portion, a heat dissipation plate having a top surface and a bottom surface, at least one semiconductor chip positioned on the top surface of the heat dissipation plate. At least one conductive wire electrically connects the chip to the lead frames. An encapsulation covers the lead frames, the heat dissipation plate, the semiconductor chip, and the conductive wires, while the bottom surface of the heat dissipation plate and the extending portions of the lead frames are exposed.
摘要翻译：半导体封装包括至少四个引线框架，每个引线框架具有延伸部分和连接部分，散热板具有顶表面和底表面，至少一个半导体芯片位于散热板的顶表面上。至少一根导线将芯片电连接到引线框架。封装覆盖引线框架，散热板，半导体芯片和导线，同时散热板的底表面和引线框架的延伸部分露出。

5. 发明申请

US20110095316A1 LED PACKAGE STRUCTURE 有权
标题翻译： LED封装结构
公开(公告)号：US20110095316A1
公开(公告)日：2011-04-28
申请号：US12888399
申请日：2010-09-22
申请人： CHIEN-MIN CHEN , KO-WEI CHIEN , HUNG-CHIN LIN
发明人： CHIEN-MIN CHEN , KO-WEI CHIEN , HUNG-CHIN LIN
IPC分类号： H01L33/60 , H01L33/48
CPC分类号： H01L33/60 , H01L33/486 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： An LED package structure includes an LED die, a lead frame and a housing connecting to the lead frame. The LED die is located on a surface of the lead frame. The housing includes an inner face surrounding the LED die. The inner face has a bottom edge connected to the surface of the lead frame, a top edge and a waist line between the bottom edge and top edge. The bottom edge surrounds an area less than an area surrounded by the waist line. The area surrounded by the waist line is less than an area surrounded by the top edge. The inner face has a curved surface between the waist line and the bottom edge.
摘要翻译： LED封装结构包括LED管芯，引线框架和连接到引线框架的壳体。 LED管芯位于引线框架的表面上。壳体包括围绕LED管芯的内表面。内表面具有连接到引线框架的表面的底边缘，底边缘和顶边之间的上边缘和腰线。底部边缘围绕小于由腰围包围的区域的区域。由腰围包围的区域小于由顶部边缘包围的区域。内表面在腰线和底边之间具有弯曲表面。

6. 发明申请

US20120119244A1 LED PACKAGE AND METHOD FOR MANUFACTURING THE SAME 失效
标题翻译： LED封装及其制造方法
公开(公告)号：US20120119244A1
公开(公告)日：2012-05-17
申请号：US13172848
申请日：2011-06-30
申请人： MENG-HSIEN HONG , KO-WEI CHIEN
发明人： MENG-HSIEN HONG , KO-WEI CHIEN
IPC分类号： H01L33/60
CPC分类号： H01L33/56 , H01L33/58 , H01L33/60 , H01L2224/48091 , H01L2924/00014
摘要： An LED package includes a substrate, an LED chip, and an encapsulation. The substrate includes a first surface. The LED chip is mounted on the first surface of the substrate. The encapsulation covers the LED chip. The encapsulation includes a transparent main body and a number of carbon nanotubes distributed in the transparent main body; the carbon nanotubes are arranged substantially extending along a same direction whereby light generated by the LED chip is polarized prior to radiation out of the encapsulation.
摘要翻译： LED封装包括基板，LED芯片和封装。基板包括第一表面。 LED芯片安装在基板的第一表面上。封装覆盖了LED芯片。封装包括透明主体和分布在透明主体中的多个碳纳米管; 碳纳米管沿着相同方向布置成基本上延伸，由此由LED芯片产生的光在辐射出封装之前被极化。

7. 发明申请

US20120104442A1 LED AND MANUFACTURING METHOD 审中-公开
标题翻译： LED和制造方法
公开(公告)号：US20120104442A1
公开(公告)日：2012-05-03
申请号：US13206536
申请日：2011-08-10
申请人： TE-WEN KUO , KO-WEI CHIEN
发明人： TE-WEN KUO , KO-WEI CHIEN
IPC分类号： H01L33/44
CPC分类号： H01L33/507 , H01L33/486 , H01L2224/48091 , H01L2224/48227 , H01L2933/0041 , H01L2924/00014
摘要： An LED includes a substrate, an LED chip setting on the substrate and a reflection cup surrounding the LED chip on the substrate. The LED chip electrically connects with two electrodes setting on the substrate. The reflection cup is filled with an encapsulating material. A fluorescent layer is formed by heating the encapsulating material and deposits on an end of the encapsulation away from the LED chip. The fluorescent layer is used for converting light from the LED chip into a specific wavelength.
摘要翻译： LED包括基板，设置在基板上的LED芯片和围绕基板上的LED芯片的反射杯。 LED芯片与设置在基板上的两个电极电连接。反射杯上装满了一种封装材料。通过加热封装材料并在封装的一端沉积远离LED芯片形成荧光层。荧光层用于将来自LED芯片的光转换成特定波长。

8. 发明申请

US20120097969A1 LIGHT EMITTING DIODE CHIP AND MANUFACTURING METHOD THEREOF 有权
标题翻译：发光二极管芯片及其制造方法
公开(公告)号：US20120097969A1
公开(公告)日：2012-04-26
申请号：US13177557
申请日：2011-07-07
申请人： YEN-KEI LEI , KO-WEI CHIEN
发明人： YEN-KEI LEI , KO-WEI CHIEN
IPC分类号： H01L33/02 , H01L33/62
CPC分类号： H01L33/62 , H01L24/06 , H01L24/45 , H01L33/36 , H01L2224/04042 , H01L2224/05554 , H01L2224/05624 , H01L2224/05644 , H01L2224/45144 , H01L2224/48463 , H01L2224/48624 , H01L2224/48644 , H01L2224/49107 , H01L2924/01012 , H01L2924/01013 , H01L2924/01023 , H01L2924/0103 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2924/14 , H01L2933/0066 , H01L2924/00014 , H01L2924/00
摘要： An exemplary LED chip includes a substrate, a buffer layer formed on the substrate and a light emitting layer formed on the buffer layer. The light emitting layer includes an n-type semiconductor layer and a p-type semiconductor layer. A first electrode is electrically connected with one of the n-type semiconductor layer and the p-type semiconductor layer. A second electrode is electrically connected with the other one of the n-type semiconductor layer and the p-type semiconductor layer. A bonding pad is formed on a top surface of the first electrode. A bonding wire is secured to the bonding pad. A ratio between a contacting area between the bonding pad and the top surface of the first electrode and an area of the top surface of the first electrode is no less than 6:10.
摘要翻译：示例性LED芯片包括衬底，形成在衬底上的缓冲层和形成在缓冲层上的发光层。发光层包括n型半导体层和p型半导体层。第一电极与n型半导体层和p型半导体层之一电连接。第二电极与n型半导体层和p型半导体层中的另一个电连接。在第一电极的顶表面上形成接合焊盘。接合线固定到接合焊盘。接合焊盘与第一电极的顶面的接触面积与第一电极的顶面的面积之比为6:10以上。

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