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1. 发明申请

US20110095316A1 LED PACKAGE STRUCTURE 有权
标题翻译： LED封装结构
公开(公告)号：US20110095316A1
公开(公告)日：2011-04-28
申请号：US12888399
申请日：2010-09-22
申请人： CHIEN-MIN CHEN , KO-WEI CHIEN , HUNG-CHIN LIN
发明人： CHIEN-MIN CHEN , KO-WEI CHIEN , HUNG-CHIN LIN
IPC分类号： H01L33/60 , H01L33/48
CPC分类号： H01L33/60 , H01L33/486 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： An LED package structure includes an LED die, a lead frame and a housing connecting to the lead frame. The LED die is located on a surface of the lead frame. The housing includes an inner face surrounding the LED die. The inner face has a bottom edge connected to the surface of the lead frame, a top edge and a waist line between the bottom edge and top edge. The bottom edge surrounds an area less than an area surrounded by the waist line. The area surrounded by the waist line is less than an area surrounded by the top edge. The inner face has a curved surface between the waist line and the bottom edge.
摘要翻译： LED封装结构包括LED管芯，引线框架和连接到引线框架的壳体。 LED管芯位于引线框架的表面上。壳体包括围绕LED管芯的内表面。内表面具有连接到引线框架的表面的底边缘，底边缘和顶边之间的上边缘和腰线。底部边缘围绕小于由腰围包围的区域的区域。由腰围包围的区域小于由顶部边缘包围的区域。内表面在腰线和底边之间具有弯曲表面。

2. 发明申请

US20110156085A1 SEMICONDUCTOR PACKAGE 有权
标题翻译：半导体封装
公开(公告)号：US20110156085A1
公开(公告)日：2011-06-30
申请号：US12903116
申请日：2010-10-12
申请人： HUNG-CHIN LIN , KUO-FU PENG , CHIEN-MIN CHEN , KO-WEI CHIEN
发明人： HUNG-CHIN LIN , KUO-FU PENG , CHIEN-MIN CHEN , KO-WEI CHIEN
IPC分类号： H01L33/52 , H01L23/495
CPC分类号： H01L33/64 , H01L33/486 , H01L33/641 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/3011 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor package includes at least four lead frames each having an extending portion and a connecting portion, a heat dissipation plate having a top surface and a bottom surface, at least one semiconductor chip positioned on the top surface of the heat dissipation plate. At least one conductive wire electrically connects the chip to the lead frames. An encapsulation covers the lead frames, the heat dissipation plate, the semiconductor chip, and the conductive wires, while the bottom surface of the heat dissipation plate and the extending portions of the lead frames are exposed.
摘要翻译：半导体封装包括至少四个引线框架，每个引线框架具有延伸部分和连接部分，散热板具有顶表面和底表面，至少一个半导体芯片位于散热板的顶表面上。至少一根导线将芯片电连接到引线框架。封装覆盖引线框架，散热板，半导体芯片和导线，同时散热板的底表面和引线框架的延伸部分露出。

3. 发明申请

US20090239438A1 METHOD FOR MAKING BACKLIGHT MODULE FRAME 失效
标题翻译：制造背光模组框架的方法
公开(公告)号：US20090239438A1
公开(公告)日：2009-09-24
申请号：US12241023
申请日：2008-09-29
申请人： TUNG-MING HSU , CHIEN-MIN CHEN , MING-FU HSU , HSIANG-FENG TENG
发明人： TUNG-MING HSU , CHIEN-MIN CHEN , MING-FU HSU , HSIANG-FENG TENG
IPC分类号： H01J9/24
CPC分类号： B23K26/26
摘要： An exemplary method for making backlight module frames includes: method includes: providing a first metallic sheet and a second metallic sheet, each of the first and second metallic sheets having at least two L-shaped portions connected side by side and oriented in the same direction; welding the two metallic sheets to form a plurality of connected semi-manufactured frames corresponding to s subsequent backlight module frame; and pressing the connected semi-manufactured frames to form a plurality of backlight module frames. The method costs less welding time and it is convenient for the backlight module frames to be mass-produced.
摘要翻译：用于制造背光模块框架的示例性方法包括：方法包括：提供第一金属片和第二金属片，所述第一和第二金属片中的每一个具有至少两个L形部分，所述L形部分并排连接并且沿相同方向 ; 焊接两个金属板以形成对应于随后的背光模块框架的多个连接的半成品框架; 并按压连接的半制成的框架以形成多个背光模块框架。该方法花费较少的焊接时间，并且便于批量生产背光模块框架。

4. 发明申请

US20120025215A1 SEMICONDUCTOR PACKAGE WITH HEAT DISSIPATING STRUCTURE 审中-公开
标题翻译：具有热消散结构的半导体封装
公开(公告)号：US20120025215A1
公开(公告)日：2012-02-02
申请号：US13029124
申请日：2011-02-17
申请人： CHIEN-MIN CHEN , YA-WEN LIN
发明人： CHIEN-MIN CHEN , YA-WEN LIN
IPC分类号： H01L33/64 , H01L23/48 , H01L23/34
CPC分类号： H01L33/642 , H01L25/0753 , H01L33/486 , H01L33/60 , H01L33/641 , H01L2224/48091 , H01L2924/00014
摘要： A semiconductor package includes a substrate, a number of electrodes formed in the substrate, a heat dissipating member fixed on the substrate, and at least one semiconductor chip mounted on the heat dissipating member and electrically connected to the electrodes. The heat dissipating member defines a receiving through hole and includes a conducting portion formed at the bottom of the receiving through hole. The at least one semiconductor chip is mounted on the conducting portion. The conducting portion efficiently conducts the heat generated by the semiconductor chip to the heat dissipating member and improves the heat dissipating efficiency of the semiconductor package.
摘要翻译：半导体封装包括衬底，形成在衬底中的多个电极，固定在衬底上的散热构件以及安装在散热构件上并电连接到电极的至少一个半导体芯片。散热构件限定了接收通孔，并且包括形成在接收通孔的底部的导电部分。至少一个半导体芯片安装在导电部分上。导电部分有效地将半导体芯片产生的热量传导到散热构件，并提高半导体封装的散热效率。

5. 发明申请

US20060018173A1 METHOD FOR USING NON-VOLATILE MEMORY AND ELECTRONICS DEVICE THEREOF 有权
标题翻译：使用非易失性存储器及其电子设备的方法
公开(公告)号：US20060018173A1
公开(公告)日：2006-01-26
申请号：US10904184
申请日：2004-10-28
申请人： YING-CHIH YANG , YU-CHI CHEN , YUAN-NING CHEN , CHIEN-MIN CHEN
发明人： YING-CHIH YANG , YU-CHI CHEN , YUAN-NING CHEN , CHIEN-MIN CHEN
IPC分类号： G11C7/00
CPC分类号： G06F12/0246 , G11C16/102
摘要： A method for using non-volatile memory and an electronics device thereof is provided. The method includes the following steps. First, a non-volatile memory pre-loaded with a plurality of original data is provided. When updating the original data with new data, if free space is available in the non-volatile memory, then the new data is written into the free space. If free space is not available, all the updated original data is written into the erased non-volatile memory.
摘要翻译：提供了一种使用非易失性存储器及其电子设备的方法。该方法包括以下步骤。首先，提供预加载有多个原始数据的非易失性存储器。当使用新数据更新原始数据时，如果非易失性存储器中有可用空间，则将新数据写入可用空间。如果可用空间不可用，则所有更新的原始数据都将写入已擦除的非易失性存储器。

6. 发明申请

US20090236405A1 METHOD FOR MAKING BACKLIGHT MODULE FRAME 失效
标题翻译：制造背光模组框架的方法
公开(公告)号：US20090236405A1
公开(公告)日：2009-09-24
申请号：US12251391
申请日：2008-10-14
申请人： TUNG-MING HSU , CHIEN-MIN CHEN , MING-FU HSU
发明人： TUNG-MING HSU , CHIEN-MIN CHEN , MING-FU HSU
IPC分类号： B23K31/02
CPC分类号： B23K26/24
摘要： An exemplary method for making backlight module frame includes: providing a plurality of metallic sheets cooperatively defining a frame shape, and a positioning device comprising a worktable and a plurality of positioning portions defined at corners of the worktable, wherein each metallic sheet comprises a first positioning protrusion corresponding to the positioning portions, positioning the metallic sheets on the worktable of the positioning device with the first positioning protrusions of the metallic sheets engaging with the positioning portions of the positioning device, welding the metallic sheets together to form a semi-manufactured frame, and pressing the semi-manufactured frame to form a backlight module frame.
摘要翻译：用于制造背光模块框架的示例性方法包括：提供协作地限定框架形状的多个金属片，以及定位装置，其包括工作台和限定在所述工作台的角部处的多个定位部，其中每个金属片包括第一定位与定位部对应的突起，将金属片定位在定位装置的工作台上，金属片的第一定位突起与定位装置的定位部分接合，将金属片焊接在一起形成半制成的框架，并且按压半制成的框架以形成背光模块框架。

7. 发明申请

US20080089050A1 KEYPAD LIGHT GUIDE WITH LINED APERTURES AND PROCESS FOR MAKING KEYPAD LIGHT GUIDE 失效
标题翻译：带键盘的键盘指南和制作键盘指南的过程
公开(公告)号：US20080089050A1
公开(公告)日：2008-04-17
申请号：US11617620
申请日：2006-12-28
申请人： TUNG-MING HSU , CHIEN-MIN CHEN , MING-FU HSU
发明人： TUNG-MING HSU , CHIEN-MIN CHEN , MING-FU HSU
IPC分类号： G01D11/28
CPC分类号： B29D11/00663
摘要： An exemplary process for making a light guide includes the steps of: providing a transparent base sheet; punching the base sheet to form an array of first apertures therein; coating a melted resin material in the first apertures and making the melted resin material fill up the first apertures; solidifying the melted resin material to form a plurality of resin blocks; punching the base sheet to form an array of second apertures in the resin blocks, the second apertures configured for illuminating the keys via at least one light source; and trimming the base sheet with the second apertures to form a light guide. A light guide made by the process is also provided.
摘要翻译：制造光导的示例性方法包括以下步骤：提供透明基片; 冲压基片以形成其中的第一孔阵列; 在第一孔中涂覆熔融的树脂材料，并使熔融的树脂材料填满第一孔; 使熔融的树脂材料固化，形成多个树脂块; 冲压所述基片以在所述树脂块中形成第二孔阵列，所述第二孔经配置以经由至少一个光源照射所述键; 并用第二孔修剪基片以形成光导。还提供了由该方法制成的光导。

8. 发明申请

US20070216825A1 FRAME DESIGN AND DISPLAY DEVICE USING THE SAME 失效
标题翻译：使用该框架设计和显示设备
公开(公告)号：US20070216825A1
公开(公告)日：2007-09-20
申请号：US11309620
申请日：2006-09-01
申请人： TUNG-MING HSU , CHIEN-MIN CHEN , MING-FU HSU , Shi-Ping Xu
发明人： TUNG-MING HSU , CHIEN-MIN CHEN , MING-FU HSU , Shi-Ping Xu
IPC分类号： G02F1/1333
CPC分类号： G02F1/133308 , G02F2201/46
摘要： A frame includes a frame body and a plurality of fixing units. The frame body includes a base and a plurality of sidewalls extending from the peripheral of the base, the base and the sidewalls cooperatively forming a receiving cavity to receive the liquid crystal module. The fixing units are configured for enclosing the sidewalls and confining the liquid crystal module into the receiving cavity of the frame body. Each fixing unit is securely bounded with the liquid crystal module and the sidewall of the frame body respectively. A display device using the frame is also provided, which can be assembled efficiently and decreases the cost of materials.
摘要翻译：框架包括框体和多个固定单元。框架主体包括基部和从基部的周边延伸的多个侧壁，基部和侧壁协作地形成接收腔以接收液晶模块。固定单元被配置为封闭侧壁并将液晶模块限制在框体的接收腔中。每个固定单元分别牢固地与液晶模块和框体的侧壁相连。还提供了使用该框架的显示装置，其可以有效地组装并降低材料的成本。

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