专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20110284279A1 PRINTED CIRCUIT BOARD 失效
标题翻译：印刷电路板
公开(公告)号：US20110284279A1
公开(公告)日：2011-11-24
申请号：US12790883
申请日：2010-05-31
申请人： YING-TSO LAI , YUNG-CHIEH CHEN , CHUN-JEN CHEN , WEI-CHIEH CHOU
发明人： YING-TSO LAI , YUNG-CHIEH CHEN , CHUN-JEN CHEN , WEI-CHIEH CHOU
IPC分类号： H05K1/11
CPC分类号： H05K1/0225 , H05K1/0245 , H05K1/0253
摘要： A printed circuit board includes a signal layer, a dielectric layer, and a reference layer. The signal layer includes a pair of differential signal lines. The dielectric layer is sandwiched between the signal layer and the reference layer. A first void is defined in the reference layer between projections of the pair of differential signal lines. Two second voids are defined in the reference layer at opposite sides of the projections of the pair of differential signal lines.
摘要翻译：印刷电路板包括信号层，电介质层和参考层。信号层包括一对差分信号线。电介质层夹在信号层和参考层之间。在该对差分信号线的投影之间的参考层中限定第一空隙。在该对差分信号线的突起的相对侧的参考层中限定两个第二空隙。

2. 发明申请

US20120229993A1 ANTISTATIC CIRCUIT BOARD AND ELECTRICAL DEVICE USING SAME 审中-公开
标题翻译：防静电电路板和使用相同的电气设备
公开(公告)号：US20120229993A1
公开(公告)日：2012-09-13
申请号：US13108997
申请日：2011-05-17
申请人： WEI-CHIEH CHOU , YING-TSO LAI , YUNG-CHIEH CHEN
发明人： WEI-CHIEH CHOU , YING-TSO LAI , YUNG-CHIEH CHEN
IPC分类号： H05K7/14 , H05K1/02 , H05F3/00
CPC分类号： H05K9/0067 , H05K1/0215 , H05K1/0259 , H05K2201/09309 , H05K2201/09663 , H05K2201/10189
摘要： An exemplary antistatic circuit board includes a first outer layer, a second outer layer, a first ground layer, and a second ground layer. The first ground layer and the second ground layer are positioned between the first outer layer and the second outer layer. The first ground layer is adjacent to the first outer layer and the second ground layer is adjacent to the second outer layer. The antistatic circuit board defines two position holes each penetrating through the first ground layer and the second ground layer. Two circuit grounds are wired on the first ground layer and the second ground layer, respectively. The second ground layer further includes a chassis ground. Each of the position holes also penetrates through the chassis ground.
摘要翻译：示例性的抗静电电路板包括第一外层，第二外层，第一接地层和第二接地层。第一接地层和第二接地层位于第一外层和第二外层之间。第一接地层与第一外层相邻，第二接地层与第二外层相邻。抗静电电路板限定了穿过第一接地层和第二接地层的两个位置孔。两个电路接地分别布置在第一接地层和第二接地层上。第二接地层还包括底盘接地。每个位置孔也穿过底盘地面。

3. 发明申请

US20120090884A1 PRINTED CIRCUIT BOARD 审中-公开
标题翻译：印刷电路板
公开(公告)号：US20120090884A1
公开(公告)日：2012-04-19
申请号：US12981460
申请日：2010-12-29
申请人： TSUNG-SHENG HUANG , YING-TSO LAI , CHUN-JEN CHEN , WEI-CHIEH CHOU
发明人： TSUNG-SHENG HUANG , YING-TSO LAI , CHUN-JEN CHEN , WEI-CHIEH CHOU
IPC分类号： H05K1/11
CPC分类号： H05K1/0265 , H05K1/0201 , H05K1/116 , H05K2201/09309
摘要： A printed circuit board includes a plurality of power layers. Each power layer defining a number of vias arranged in a number of rows. The number of the power layers is N (N>3). The power layers are defined as a 1st, 2nd, . . . , Nth power layer. The vias of the 1st power layer are connected to other power layers by a step-shaped connection means.
摘要翻译：印刷电路板包括多个功率层。每个功率层定义了以多行布置的多个通孔。功率层的数量为N（N> 3）。功率层定义为1，2，...。。。，第N功率层。第一功率层的通孔通过阶梯形连接装置连接到其它功率层。

4. 发明申请

US20120138344A1 PRINTED CIRCUIT BOARD 审中-公开
标题翻译：印刷电路板
公开(公告)号：US20120138344A1
公开(公告)日：2012-06-07
申请号：US12965832
申请日：2010-12-11
申请人： YING-TSO LAI , YUNG-CHIEH CHEN , JIA-CHI CHEN
发明人： YING-TSO LAI , YUNG-CHIEH CHEN , JIA-CHI CHEN
IPC分类号： H05K1/03
CPC分类号： H05K1/0245 , H05K1/0366 , H05K2201/029
摘要： A printed circuit board is constructed from various woven fiberglass fabrics, strengthened and bound together with epoxy resin, and includes a signal layer. The signal layer includes a positive differential signal line and a negative differential signal line laid out in parallel following a zig-zag pattern. A first distance and a second distance is designed at a ratio of 1:7. The first distance is a perpendicular distance between a highest point of the negative differential signal line and a reference line formed by connecting all lowest points of the negative differential signal line. The second distance is a perpendicular distance between a lowest point and an adjacent highest point of the negative differential signal line along the direction of the reference line.
摘要翻译：印刷电路板由各种编织玻璃纤维织物构成，与环氧树脂一起加强并结合在一起，并包括信号层。该信号层包括一个正的差分信号线和一个负的差分信号线并行地排列成Z字形图案。以1：7的比例设计第一距离和第二距离。第一距离是负差分信号线的最高点与通过连接负差分信号线的所有最低点形成的参考线之间的垂直距离。第二距离是沿着参考线的方向的负差分信号线的最低点和相邻最高点之间的垂直距离。

5. 发明申请

US20120154075A1 PRINTED CIRCUIT BOARD 失效
标题翻译：印刷电路板
公开(公告)号：US20120154075A1
公开(公告)日：2012-06-21
申请号：US13015889
申请日：2011-01-28
申请人： YING-TSO LAI , YUNG-CHIEH CHEN
发明人： YING-TSO LAI , YUNG-CHIEH CHEN
IPC分类号： H01P3/08
CPC分类号： H01P3/026 , H05K1/0245 , H05K1/0366 , H05K2201/029 , H05K2201/09263
摘要： A printed circuit board includes a base, a signal layer lying on the base, and a number of pairs of differential signal traces positioned on the signal layer. The base is made of a grid of glass fiber bundles filled with epoxy resin. Each pair of differential signal traces includes a first signal trace and a second signal trace. Each of the first and second signal traces extends in a zigzag pattern. The first signal trace includes a number of wave crests and wave troughs. The wave crests define a reference straight line that connects all the wave crest of the first signal trace. The ratio of the distance from each wave crest to the reference straight line to the orthogonal distance between each wave crest and an adjacent wave trough along the reference straight line is 1:5.
摘要翻译：印刷电路板包括基座，位于基座上的信号层和位于信号层上的多对差分信号迹线。基座由填充有环氧树脂的玻璃纤维束格栅制成。每对差分信号迹线包括第一信号迹线和第二信号迹线。第一和第二信号迹线中的每一个以锯齿形图案延伸。第一个信号迹线包括多个波峰和波谷。波峰定义连接第一个信号迹线的所有波峰的参考直线。每个波峰与参考直线的距离与沿着参考直线的每个波峰与相邻波谷之间的正交距离的比率为1:5。

6. 发明申请

US20130006561A1 COMPUTING DEVICE, STORAGE MEDIUM, AND METHOD FOR ANALYZING SIGNAL GROUP DELAY OF PRINTED CIRCUIT BOARD 审中-公开
标题翻译：计算机设备，存储介质和分析印刷电路板信号组延迟的方法
公开(公告)号：US20130006561A1
公开(公告)日：2013-01-03
申请号：US13451433
申请日：2012-04-19
申请人： PO-CHUAN HSIEH , CHUN-JEN CHEN , YING-TSO LAI , EN-SHUO CHANG
发明人： PO-CHUAN HSIEH , CHUN-JEN CHEN , YING-TSO LAI , EN-SHUO CHANG
IPC分类号： G06F19/00
CPC分类号： G06F17/5036 , G06F17/5068 , G06F2217/62 , G06F2217/82
摘要： In a method for analyzing a signal group delay of a printed circuit board (PCB) using a computing device, the computing device connects to a signal measuring device that measures S-parameters from a pair of data signal line and clock signal line of the PCB. The method analyzes a differential loss coefficient of the data signal line and the clock signal line based on the S-parameters, and calculates a first signal delay of the data signal line and a second signal delay of the clock signal line according to the differential loss coefficient. The method further analyzes a signal group delay of the PCB according to the first signal delay and the second signal delay, and displays the signal group delay on a display device if the signal group delay does not satisfy a PCB design specification.
摘要翻译：在使用计算设备分析印刷电路板（PCB）的信号组延迟的方法中，计算设备连接到从PCB的一对数据信号线和时钟信号线测量S参数的信号测量装置。该方法基于S参数分析数据信号线和时钟信号线的差分损耗系数，并根据差分损耗计算数据信号线的第一信号延迟和时钟信号线的第二信号延迟系数。该方法还根据第一信号延迟和第二信号延迟分析PCB的信号组延迟，并且如果信号组延迟不满足PCB设计规范，则在显示装置上显示信号组延迟。

7. 发明申请

US20110094787A1 PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20110094787A1
公开(公告)日：2011-04-28
申请号：US12647431
申请日：2009-12-25
申请人： YING-TSO LAI , CHUN-JEN CHEN , YU-CHANG PAI , PEI-CHUN LIN , CHIN-HUI CHEN , HSIAO-PING HUANG
发明人： YING-TSO LAI , CHUN-JEN CHEN , YU-CHANG PAI , PEI-CHUN LIN , CHIN-HUI CHEN , HSIAO-PING HUANG
IPC分类号： H05K1/11 , H05K3/10
CPC分类号： H05K1/116 , H05K1/0201 , H05K3/3447 , H05K2201/062 , H05K2201/09036 , H05K2201/093 , H05K2201/0969 , H05K2203/0242 , Y10T29/49155
摘要： A printed circuit board includes a layer. A layer of copper is covered on a surface of the layer. A through hole passes through the printed circuit board. A number of thermal engravings are defined in the layer around the through hole. Each thermal engraving is a groove defined in the surface of the layer, without covered with the layer of copper. The number of thermal engravings are not in contact with each other.
摘要翻译：印刷电路板包括一层。铜层被覆盖在该层的表面上。通孔穿过印刷电路板。在通孔周围的层中限定了许多热雕刻。每个热雕刻是在层的表面中限定的凹槽，而不被铜层覆盖。热雕刻的数量彼此不接触。

8. 发明申请

US20120097436A1 PRINTED CIRCUIT BOARD 有权
标题翻译：印刷电路板
公开(公告)号：US20120097436A1
公开(公告)日：2012-04-26
申请号：US12973604
申请日：2010-12-20
申请人： YING-TSO LAI , YU-CHANG PAI
发明人： YING-TSO LAI , YU-CHANG PAI
IPC分类号： H05K1/09
CPC分类号： H05K1/116 , H05K3/3447
摘要： A printed circuit board includes a layer. A layer of copper is covered on a surface of the layer. A through hole extends through the printed circuit board. A thermal engraving is defined in the surface of the layer, surrounding the through hole and without being covered by the layer of copper. The thermal engraving includes a first opening and a second opening. The first opening of the thermal engraving faces an output terminal of the power supply, and is non-contiguous with the second opening.
摘要翻译：印刷电路板包括一层。铜层被覆盖在该层的表面上。通孔延伸穿过印刷电路板。在该表面中限定了热雕刻，围绕通孔并且不被铜层覆盖。热雕刻包括第一开口和第二开口。热雕刻的第一开口面向电源的输出端，并且与第二开口不连续。

9. 发明申请

US20120018199A1 PRINTED CIRCUIT BOARD 有权
标题翻译：印刷电路板
公开(公告)号：US20120018199A1
公开(公告)日：2012-01-26
申请号：US12870999
申请日：2010-08-30
申请人： YING-TSO LAI , YU-CHANG PAI
发明人： YING-TSO LAI , YU-CHANG PAI
IPC分类号： H05K1/09
CPC分类号： H05K3/3447 , H05K1/0271 , H05K2201/093 , H05K2201/0969
摘要： A printed circuit board includes a layer. A layer of copper is covered on a surface of the layer. A through hole passes through the printed circuit board. An approximately C-shaped thermal engraving is defined in the surface of the layers, surrounding the through hole and without being covered by the layer of copper. An opening of the thermal engraving faces an output terminal of the power supply.
摘要翻译：印刷电路板包括一层。铜层被覆盖在该层的表面上。通孔穿过印刷电路板。在层的表面中限定大致C形的热雕刻，围绕通孔并且不被铜层覆盖。热雕刻的开口面向电源的输出端子。

10. 发明申请

US20110253424A1 FLEXIBLE PRINTED CIRCUIT BOARD 失效
标题翻译：柔性印刷电路板
公开(公告)号：US20110253424A1
公开(公告)日：2011-10-20
申请号：US12780960
申请日：2010-05-17
申请人： YING-TSO LAI , HSIAO-YUN SU
发明人： YING-TSO LAI , HSIAO-YUN SU
IPC分类号： H05K1/00
CPC分类号： H05K1/0253 , H05K1/0219 , H05K1/0227 , H05K1/028 , H05K2201/09236 , H05K2201/0969
摘要： A FPCB includes a signal layer, a ground layer, and a dielectric layer lying between the signal layer and the ground layer. At least one high speed signal transmission line is formed on the signal layer. The ground layer has a copper-removed area corresponding to the transmission line. Two ground lines are symmetrically disposed at two opposite sides of the signal transmission line and substantially parallel to the signal transmission line, each ground line and the signal transmission line is spaced at a first predetermined distance. Each ground line and the signal transmission line are spaced at a first predetermined distance.
摘要翻译： FPCB包括位于信号层和接地层之间的信号层，接地层和电介质层。在信号层上形成至少一条高速信号传输线。接地层具有对应于传输线的铜去除区域。两个接地线对称地设置在信号传输线的两个相对侧并且基本上平行于信号传输线，每个接地线和信号传输线以第一预定距离间隔开。每个接地线和信号传输线以第一预定距离隔开。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式