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    • 4. 发明授权
    • Integration of a receiver front-end in multilayer ceramic integrated circuit technology
    • 将接收机前端集成在多层陶瓷集成电路技术中
    • US06289204B1
    • 2001-09-11
    • US09112733
    • 1998-07-09
    • John EstesRong-Fong HuangRich Kommrusch
    • John EstesRong-Fong HuangRich Kommrusch
    • H04B144
    • H01P1/15
    • A multilayer ceramic integrated circuit module for a receiver front-end of a wireless communication device is provided. The module contains an embedded component portion, which has a plurality of thick film capacitors; a plurality of multilayer capacitors; and a plurality of transmission lines deposited internal to the multilayer ceramic integrated circuit module to interconnect the plurality of thick film capacitors and the plurality of multilayer capacitors. The module also contains a mounted component portion, which has a pair of pin diodes; a transistor and a plurality of resistors coupled thereto, for controlling the bias of the pair of pin diodes; and a low-noise-amplifier. The module reduces the size and weight of wireless devices and combines multiple functions into a highly integrated device.
    • 提供了一种用于无线通信设备的接收机前端的多层陶瓷集成电路模块。 该模块包含嵌入式组件部分,其具有多个厚膜电容器; 多层叠层电容器; 以及沉积在多层陶瓷集成电路模块内部的多个传输线,以互连多个厚膜电容器和多个多层电容器。 该模块还包含一个安装的组件部分,它具有一对pin二极管; 晶体管和耦合到其上的多个电阻器,用于控制所述一对pin二极管的偏置; 和低噪声放大器。 该模块降低了无线设备的尺寸和重量,并将多种功能组合到高度集成的设备中。