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    • 3. 发明授权
    • Bipolar transistor with high breakdown voltage
    • 具有高击穿电压的双极晶体管
    • US09099489B2
    • 2015-08-04
    • US13545746
    • 2012-07-10
    • Xin LinDaniel J. BlombergJiang-Kai Zuo
    • Xin LinDaniel J. BlombergJiang-Kai Zuo
    • H01L29/02H01L21/02H01L29/66H01L29/732H01L29/06H01L29/417H01L29/08
    • H01L29/66272H01L29/0607H01L29/063H01L29/0808H01L29/0821H01L29/41708H01L29/732
    • A higher breakdown voltage transistor has separated emitter, base contact, and collector contact. Underlying the emitter and the base contact are, respectively, first and second base portions of a first conductivity type. Underlying and coupled to the collector contact is a collector region of a second, opposite, conductivity type, having a central portion extending laterally toward, underneath, or beyond the base contact and separated therefrom by the second base portion. A floating collector region of the same conductivity type as the collector region underlies and is separated from the emitter by the first base portion. The collector and floating collector regions are separated by a part of the semiconductor (SC) region in which the base is formed. A further part of the SC region in which the base is formed, laterally bounds or encloses the collector region.
    • 较高的击穿电压晶体管具有分离的发射极,基极接触和集电极接触。 分别位于发射极和基极接触面之下的第一和第二基极部分是第一导电类型。 底部并且耦合到集电极触点的是第二相对导电类型的集电极区域,其具有横向朝向,在下面或超过基部触点延伸并且由第二基部分离的中心部分。 与集电极区域相同的导电类型的浮置集电极区域位于第一基底部分的下方并与发射极分离。 集电极和集电极区域由形成有基极的半导体(SC)区域的一部分分开。 SC区域的另一部分,其中形成基底,横向界定或围绕收集器区域。
    • 4. 发明申请
    • SEMICONDUCTOR DEVICE AND RELATED FABRICATION METHODS
    • 半导体器件及相关制造方法
    • US20150104920A1
    • 2015-04-16
    • US14575204
    • 2014-12-18
    • Xin LinDaniel J. BlombergJiang-Kai Zuo
    • Xin LinDaniel J. BlombergJiang-Kai Zuo
    • H01L29/66H01L21/265
    • H01L29/6625H01L21/265H01L29/0649H01L29/36H01L29/66234H01L29/66272H01L29/73H01L29/732H01L29/735
    • Semiconductor device structures and related fabrication methods are provided. An exemplary semiconductor device structure includes a collector region of semiconductor material having a first conductivity type, a base region of semiconductor material within the collector region, the base region having a second conductivity type opposite the first conductivity type, and a doped region of semiconductor material having the second conductivity type, wherein the doped region is electrically connected to the base region and the collector region resides between the base region and the doped region. In exemplary embodiments, the dopant concentration of the doped region is greater than a dopant concentration of the collector region to deplete the collector region as the electrical potential of the base region exceeds that of the collector region.
    • 提供半导体器件结构和相关的制造方法。 示例性的半导体器件结构包括具有第一导电类型的半导体材料的集电极区域,在集电极区域内的半导体材料的基极区域,具有与第一导电类型相反的第二导电类型的基极区域和半导体材料的掺杂区域 具有第二导电类型,其中所述掺杂区域电连接到所述基极区域,并且所述集电极区域位于所述基极区域和所述掺杂区域之间。 在示例性实施例中,掺杂区域的掺杂剂浓度大于集电极区域的掺杂剂浓度以消耗集电极区域,因为基极区域的电位超过集电极区域的电位。
    • 5. 发明授权
    • Methods for forming high gain tunable bipolar transistors
    • 用于形成高增益可调双极晶体管的方法
    • US08946041B2
    • 2015-02-03
    • US13534971
    • 2012-06-27
    • Xin LinDaniel J. BlombergJiang-Kai Zuo
    • Xin LinDaniel J. BlombergJiang-Kai Zuo
    • H01L21/331H01L29/66H01L29/08H01L29/10H01L29/732H01L21/8249H01L27/06
    • H01L29/66272H01L21/8249H01L27/0623H01L29/0804H01L29/1004H01L29/7322
    • Embodiments for forming improved bipolar transistors are provided, manufacturable by a CMOS IC process. The improved transistor comprises an emitter having first and second portions of different depths, a base underlying the emitter having a central portion of a first base width underlying the first portion of the emitter, a peripheral portion having a second base width larger than the first base width partly underlying the second portion of the emitter, and a transition zone of a third base width and lateral extent lying laterally between the first and second portions of the base, and a collector underlying the base. The gain of the transistor is larger than a conventional bipolar transistor made using the same CMOS process. By adjusting the lateral extent of the transition zone, the properties of the improved transistor can be tailored to suit different applications without modifying the underlying CMOS IC process.
    • 提供用于形成改进的双极晶体管的实施例,可通过CMOS IC工艺制造。 改进的晶体管包括具有不同深度的第一和第二部分的发射器,发射器下面的基底具有位于发射器的第一部分下方的第一基底宽度的中心部分,具有大于第一基底的第二基底宽度的周边部分 部分位于发射体的第二部分下方的宽度,以及位于基底的第一和第二部分之间横向置换的第三基底宽度和横向范围的过渡区,以及位于基底的收集器。 晶体管的增益大于使用相同CMOS工艺制造的常规双极晶体管。 通过调整过渡区域的横向范围,可以调整改进晶体管的性能以适应不同的应用,而无需修改底层的CMOS IC工艺。
    • 8. 发明授权
    • Methods for producing bipolar transistors with improved stability
    • 制造稳定性提高的双极晶体管的方法
    • US09466687B2
    • 2016-10-11
    • US14157317
    • 2014-01-16
    • Xin LinDaniel J. BlombergHongning YangJiang-Kai Zuo
    • Xin LinDaniel J. BlombergHongning YangJiang-Kai Zuo
    • H01L21/331H01L29/66H01L21/8228H01L27/082H01L29/735
    • H01L29/6625H01L21/82285H01L27/0826H01L29/735
    • Instability and drift sometimes observed in bipolar transistors, having a portion of the base extending to the transistor surface between the emitter and base contact, can be reduced or eliminated by providing a further doped region of the same conductivity type as the emitter at the transistor surface between the emitter and the base contact. The further region is desirably more heavily doped than the base region at the surface and less heavily doped than the adjacent emitter. In another embodiment, a still or yet further region of the same conductivity type as the emitter is provided either between the further region and the emitter or laterally within the emitter. The still or yet further region is desirably more heavily doped than the further region. Such further regions shield the near surface base region from trapped charge that may be present in dielectric layers or interfaces overlying the transistor surface.
    • 通过提供与晶体管表面上的发射极相同的导电类型的另外的掺杂区域,可以减少或消除具有延伸到发射极和基极接触之间的晶体管表面的基极的一部分的双极晶体管中的不稳定性和漂移 在发射极和基极之间。 另外的区域期望比表面上的基极区域重掺杂,并且比相邻的发射极更重掺杂。 在另一个实施例中,与发射器相同的导电类型的仍然还是另外的区域被提供在另外的区域和发射极之间或者在发射极内侧。 仍然还是进一步的区域期望比其他区域更重掺杂。 这样的另外的区域屏蔽近表面碱基区域可能存在于覆盖晶体管表面的电介质层或界面中的俘获电荷。