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    • 6. 发明申请
    • High precision die bonding apparatus
    • 高精度贴片装置
    • US20070134904A1
    • 2007-06-14
    • US11301121
    • 2005-12-12
    • Ming WanWing Lam
    • Ming WanWing Lam
    • H01L21/44
    • H01L21/67144H01L21/681Y10T29/53091
    • A die bonding apparatus and a bonding method are provided wherein the apparatus comprises a bond head movable between a supply of semiconductor dice and a die bonding site, a pick-up tool attached to the bond head for holding a die to be bonded at the die bonding site and an optical assembly positioned for viewing an orientation of the die bonding site. The bond head is configured such that an orientation of the die being held by the pick-up tool between the optical assembly and the die bonding site is viewable by the optical assembly, whereby the orientation of the die may be aligned with the orientation of the die bonding site.
    • 提供了一种管芯接合装置和接合方法,其中该设备包括可在半导体晶片的供给和芯片接合位置之间移动的接合头,附接到接合头的拾取工具,用于保持待接合的管芯的模具 粘合部位和用于观察芯片焊接部位的取向的光学组件。 结合头被构造成使得由拾取工具保持的模具在光学组件和芯片粘合位置之间的取向可由光学组件观察,由此模具的取向可以与模具的取向对齐 芯片焊接部位。