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    • 1. 发明申请
    • METHOD FOR ENHANCING LITHOGRAPHIC IMAGING OF ISOLATED AND SEMI-ISOLATED FEATURES
    • 用于增强隔离和半隔离特征的图像成像的方法
    • US20100178619A1
    • 2010-07-15
    • US12354247
    • 2009-01-15
    • Wu-Song HuangGregory R. McIntyre
    • Wu-Song HuangGregory R. McIntyre
    • G03F7/20
    • G03F7/2022G03F7/095G03F7/26
    • The present invention relates to photolithography methods for enhancing lithographic imaging of isolated and semi-isolated features. A first layer of a first photoresist is formed over a substrate. A second layer of a second photoresist is formed over the first layer. The second photoresist includes a polymer containing an absorbing moiety. The second layer is exposed through a first patterned mask and developed to form a first relief image. The first relief image and the first layer are exposed through a second patterned mask. One of the first and the second patterned masks includes a dense pattern, while the other includes an isolated or a semi-isolated pattern. The first relief image and base soluble regions of the first layer are removed to form a second relief image with an isolated or a semi-isolated pattern. The second layer can also be bleachable upon exposure and bake in the present invention.
    • 本发明涉及用于增强孤立和半隔离特征的光刻成像的光刻方法。 在衬底上形成第一光致抗蚀剂的第一层。 在第一层上形成第二光致抗蚀剂层。 第二光致抗蚀剂包括含有吸收部分的聚合物。 第二层通过第一图案化掩模曝光并显影以形成第一浮雕图像。 第一浮雕图像和第一层通过第二图案掩模曝光。 第一和第二图案化掩模中的一个包括密集图案,而另一个包括隔离或半隔离图案。 去除第一层的第一浮雕图像和底部可溶区域以形成具有隔离或半隔离图案的第二浮雕图像。 第二层也可以在本发明中曝光和烘烤时可漂白。
    • 2. 发明授权
    • Method for enhancing lithographic imaging of isolated and semi-isolated features
    • 用于增强隔离和半隔离特征的光刻成像的方法
    • US08546069B2
    • 2013-10-01
    • US12354247
    • 2009-01-15
    • Wu-Song HuangGregory R. McIntyre
    • Wu-Song HuangGregory R. McIntyre
    • G03F7/40
    • G03F7/2022G03F7/095G03F7/26
    • The present invention relates to photolithography methods for enhancing lithographic imaging of isolated and semi-isolated features. A first layer of a first photoresist is formed over a substrate. A second layer of a second photoresist is formed over the first layer. The second photoresist includes a polymer containing an absorbing moiety. The second layer is exposed through a first patterned mask and developed to form a first relief image. The first relief image and the first layer are exposed through a second patterned mask. One of the first and the second patterned masks includes a dense pattern, while the other includes an isolated or a semi-isolated pattern. The first relief image and base soluble regions of the first layer are removed to form a second relief image with an isolated or a semi-isolated pattern. The second layer can also be bleachable upon exposure and bake in the present invention.
    • 本发明涉及用于增强孤立和半隔离特征的光刻成像的光刻方法。 在衬底上形成第一光致抗蚀剂的第一层。 在第一层上形成第二光致抗蚀剂层。 第二光致抗蚀剂包括含有吸收部分的聚合物。 第二层通过第一图案化掩模曝光并显影以形成第一浮雕图像。 第一浮雕图像和第一层通过第二图案掩模曝光。 第一和第二图案化掩模中的一个包括密集图案,而另一个包括隔离或半隔离图案。 去除第一层的第一浮雕图像和底部可溶区域以形成具有隔离或半隔离图案的第二浮雕图像。 第二层也可以在本发明中曝光和烘烤时可漂白。
    • 6. 发明申请
    • MULTI-EXPOSURE LITHOGRAPHY EMPLOYING DIFFERENTIALLY SENSITIVE PHOTORESIST LAYERS
    • 使用差分感光层的多次曝光光刻
    • US20120156450A1
    • 2012-06-21
    • US13406965
    • 2012-02-28
    • Wu-Song HuangWai-kin LiPing-Chuan Wang
    • Wu-Song HuangWai-kin LiPing-Chuan Wang
    • B32B3/00
    • G03F7/70466Y10S438/947Y10S438/948Y10T428/24802
    • A stack of a second photoresist having a second photosensitivity and a first photoresist having a first photosensitivity, which is greater than second photosensitivity, is formed on a substrate. A first pattern is formed in the first photoresist by a first exposure and a first development, while the second photoresist underneath remains intact. A second pattern comprising an array of lines is formed in the second photoresist. An exposed portion of the second photoresist underneath a remaining portion of the first photoresist forms a narrow portion of a line pattern, while an exposed portion of the second photoresist outside the area of the remaining portions of the photoresist forms a wide portion of the line pattern. Each wide portion of the line pattern forms a bulge in the second pattern, which increases overlay tolerance between the second pattern and the pattern of conductive vias.
    • 在基板上形成具有第二感光性的第二光致抗蚀剂的叠层和具有大于第二光敏性的第一光敏性的第一光致抗蚀剂。 通过第一曝光和第一显影在第一光致抗蚀剂中形成第一图案,而下面的第二光致抗蚀剂保持完整。 在第二光致抗蚀剂中形成包括线阵列的第二图案。 在第一光致抗蚀剂的剩余部分下面的第二光致抗蚀剂的暴露部分形成线图案的窄部分,而在光致抗蚀剂的剩余部分的区域外的第二光致抗蚀剂的暴露部分形成线图案的宽部分 。 线图案的每个宽部分在第二图案中形成凸起,这增加了第二图案和导电通孔图案之间的覆盖公差。
    • 8. 发明申请
    • PHOTORESIST COMPOSITIONS AND METHOD FOR MULTIPLE EXPOSURES WITH MULTIPLE LAYER RESIST SYSTEMS
    • 多层耐蚀系统多光照的组合物和方法
    • US20090155715A1
    • 2009-06-18
    • US12356187
    • 2009-01-20
    • Kuang-Jung ChenWu-Song HuangWai-Kin LiPushkara Rao VaranasiSen Liu
    • Kuang-Jung ChenWu-Song HuangWai-Kin LiPushkara Rao VaranasiSen Liu
    • G03F7/20G03F7/004
    • G03F7/0045G03F7/0035G03F7/0397G03F7/40
    • A method and a resist composition. The resist composition includes a polymer having repeating units having a lactone moiety, a thermal base generator capable of generating a base and a photosensitive acid generator. The polymer has the properties of being substantially soluble in a first solvent and becoming substantially insoluble after heating the polymer. The method includes forming a film of a photoresist including a polymer, a thermal base generator capable of releasing a base, a photosensitive acid generator, and a solvent. The film is patternwise imaged. The imaging includes exposing the film to radiation, resulting in producing an acid catalyst. The film is developed in an aqueous base, resulting in removing base-soluble regions and forming a patterned layer. The patterned layer is baked above the temperature, resulting in the thermal base generator releasing a base within the patterned layer and the patterned layer becoming insoluble in the solvent.
    • 一种方法和抗蚀剂组合物。 抗蚀剂组合物包括具有内酯部分的重复单元的聚合物,能够产生碱的热碱发生剂和感光酸产生剂。 聚合物具有基本上可溶于第一溶剂的性质,并且在加热聚合物之后变得基本上不溶。 该方法包括形成包含聚合物的光致抗蚀剂膜,能够释放碱的热碱发生器,光敏酸产生剂和溶剂。 该影片被图案化成像。 成像包括将膜暴露于辐射,导致产生酸催化剂。 该膜在水性碱中显影,导致去除碱溶性区域并形成图案层。 图案化层被烘烤高于该温度,导致热基发生器释放图案化层内的基底并且图案化层变得不溶于溶剂。
    • 10. 发明申请
    • Low refractive index polymers as underlayers for silicon-containing photoresists
    • 低折射率聚合物作为含硅光致抗蚀剂的底层
    • US20060134546A1
    • 2006-06-22
    • US11013971
    • 2004-12-16
    • Wu-Song HuangSean BurnsMahmoud Khojasteh
    • Wu-Song HuangSean BurnsMahmoud Khojasteh
    • G03C1/76
    • G03F7/091G03F7/094Y10S438/952
    • A new underlayer composition that exhibits high etch resistance and improved optical properties is disclosed. The underlayer composition comprises a vinyl or acrylate polymer, such as a methacrylate polymer, the polymer comprising at least one substituted or unsubstituted naphthalene or naphthol moiety, including mixtures thereof. Examples of the polymer of this invention include: where each R1 is independently selected from an organic moiety or a halogen; each A is independently a single bond or an organic moiety; R2 is hydrogen or a methyl group; and each X, Y and Z is an integer of 0 to 7, and Y+Z is 7 or less. The organic moiety mentioned above may be a substituted or unsubstituted hydrocarbon selected from the group consisting of a linear or branched alkyl, halogenated linear or branched alkyl, aryl, halogenated aryl, cyclic alkyl, and halogenated cyclic alkyl, and any combination thereof. The compositions are suitable for use as a planarizing underlayer in a multilayer lithographic process, including a trilayer lithographic process.
    • 公开了具有高耐蚀刻性和改善的光学性能的新型底层组合物。 底层组合物包含乙烯基或丙烯酸酯聚合物,例如甲基丙烯酸酯聚合物,该聚合物包含至少一个取代或未取代的萘或萘酚部分,包括其混合物。 本发明的聚合物的实例包括:其中每个R 1独立地选自有机部分或卤素; 每个A独立地是单键或有机部分; R 2是氢或甲基; X,Y,Z为0〜7的整数,Y + Z为7以下。 上述有机部分可以是选自直链或支链烷基,卤代直链或支链烷基,芳基,卤代芳基,环状烷基和卤代环状烷基的取代或未取代的烃及其任何组合。 该组合物适合用作多层光刻工艺中的平坦化底层,包括三层光刻工艺。