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1. 发明申请

US20090140426A1 FLIP CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：卷芯片包装及其制造方法
公开(公告)号：US20090140426A1
公开(公告)日：2009-06-04
申请号：US11965365
申请日：2007-12-27
申请人： Woong Sun LEE , Il Hwan CHO , Myung Geun PARK , Cheol Ho JOH , Eun Hye DO , Ki Young KIM , Ji Eun KIM , Jong Hyun NAM
发明人： Woong Sun LEE , Il Hwan CHO , Myung Geun PARK , Cheol Ho JOH , Eun Hye DO , Ki Young KIM , Ji Eun KIM , Jong Hyun NAM
IPC分类号： H01L23/48 , H01L21/02
CPC分类号： H01L23/49811 , H01L21/563 , H01L24/12 , H01L24/16 , H01L24/81 , H01L2224/05571 , H01L2224/05573 , H01L2224/13099 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/81191 , H01L2224/81205 , H01L2224/81395 , H01L2224/81801 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/12044 , H05K3/282 , H05K2201/10674 , H05K2203/0568 , H05K2203/1361 , H05K2203/1554 , H01L2924/00 , H01L2224/05599
摘要： A flip chip package includes a substrate and a semiconductor chip. The substrate includes a substrate body, a metal wiring having a terminal part some of which is disposed in the substrate body, a solder resist pattern formed on the substrate body with an opening for exposing the terminal part, and an organic anti-oxidation layer for covering the terminal part. The semiconductor chip has a bump formed through (e.g., penetrates) the organic anti-oxidation layer and is electrically connected to the terminal part. The present invention prevents oxidation of the terminal part and allows easy coupling of a bump of a semiconductor chip and the terminal part of the substrate, since an anti-oxidation layer including an organic matter is formed over a surface of a terminal part including copper which is easily oxidized.
摘要翻译：倒装芯片封装包括衬底和半导体芯片。基板包括基板主体，具有端子部分的金属布线，其中一部分设置在基板主体中，形成在基板主体上的阻焊图案具有用于暴露端子部分的开口，以及有机抗氧化层，覆盖终端部分。半导体芯片具有穿过（例如，穿透）有机抗氧化层并且电连接到端子部分的凸块。本发明防止了端子部分的氧化，并且容易地将半导体芯片的凸起与基板的端子部分耦合，因为包括有机物的抗氧化层在包括铜的端子部分的表面上形成容易氧化。

2. 发明申请

US20110272798A1 CHIP UNIT AND STACK PACKAGE HAVING THE SAME 有权
标题翻译：芯片单元和堆叠包装
公开(公告)号：US20110272798A1
公开(公告)日：2011-11-10
申请号：US13038831
申请日：2011-03-02
申请人： Kyu Won LEE , Cheol Ho JOH , Eun Hye DO , Ji Eun KIM , Hee Min SHIN
发明人： Kyu Won LEE , Cheol Ho JOH , Eun Hye DO , Ji Eun KIM , Hee Min SHIN
IPC分类号： H01L23/28
CPC分类号： H01L25/0657 , H01L23/3121 , H01L23/5389 , H01L23/562 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L25/105 , H01L2224/0401 , H01L2224/13022 , H01L2224/16225 , H01L2224/48091 , H01L2224/48147 , H01L2224/48227 , H01L2225/06517 , H01L2225/0652 , H01L2225/06524 , H01L2225/06527 , H01L2225/06548 , H01L2225/06558 , H01L2225/06562 , H01L2225/06572 , H01L2225/1035 , H01L2225/1052 , H01L2225/1058 , H01L2924/00014 , H01L2924/181 , H01L2924/19107 , H01L2924/3511 , H01L2924/3512 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A chip unit includes: a first semiconductor chip and a second semiconductor chip disposed such that their surfaces for forming first bonding pads and second bonding pads face each other; first and second connection members disposed on the surfaces of the first and second semiconductor chips for forming the first and second bonding pads, and having redistribution lines which have one ends connected with the first and second bonding pads and the other ends projecting beyond one edges of the first and second semiconductor chips and films; an adhesive member interposed between the first connection members and the second connection members; and via patterns passing through the adhesive member and connecting projecting portions of the redistribution lines of the first and second connection members with each other.
摘要翻译：芯片单元包括：第一半导体芯片和第二半导体芯片，其布置成使得其用于形成第一焊盘和第二焊盘的表面彼此面对; 第一和第二连接构件，设置在第一和第二半导体芯片的表面上，用于形成第一和第二接合焊盘，并且具有一端与第一和第二接合焊盘连接的再分配线，另一端突出超过第一和第二半导体芯片和薄膜; 插入在所述第一连接构件和所述第二连接构件之间的粘合构件; 并且通过图案通过粘合构件并将第一和第二连接构件的再分配线的突出部彼此连接。

3. 发明申请

US20110189928A1 WAFER MOUNT TAPE, WAFER PROCESSING APPARATUS AND METHOD OF USING THE SAME FOR USE IN THINNING WAFERS 审中-公开
标题翻译：带式加工带，加工方法及其使用方法在薄膜加工中的应用
公开(公告)号：US20110189928A1
公开(公告)日：2011-08-04
申请号：US13050325
申请日：2011-03-17
申请人： Hee Min SHIN , Cheol Ho JOH , Eun Hye DO , Ji Eun KIM , Kyu Won LEE
发明人： Hee Min SHIN , Cheol Ho JOH , Eun Hye DO , Ji Eun KIM , Kyu Won LEE
IPC分类号： B24B1/00 , B32B3/14 , C09J7/02
CPC分类号： H01L21/6835 , C09J7/20 , C09J2201/28 , C09J2203/326 , H01L21/67005 , H01L21/67132 , H01L21/6836 , H01L2221/68327 , H01L2221/6834 , Y10T156/10 , Y10T156/17 , Y10T428/215
摘要： A wafer mount tape, a wafer processing apparatus and an associated method of using the wafer mount tape for use in wafer thinning operations is presented. The wafer mount tape includes a tape body, a first adhesive member and a second adhesive member. The tape body has a first region, a second region and a third region. The first region of the tape body is for being disposed onto a wafer. The second region of the tape body is defined along a periphery of the first region. The third region of the tape body is defined along a periphery of the second region. The first adhesive is member is disposed at the first region. The second adhesive member is disposed at the third region.
摘要翻译：提出了一种晶片安装带，晶片处理设备和使用晶片安装带用于晶片间隔操作的相关方法。晶片安装带包括带体，第一粘合构件和第二粘合构件。带体具有第一区域，第二区域和第三区域。带体的第一区域用于设置在晶片上。带体的第二区域沿着第一区域的周边限定。带体的第三区域沿着第二区域的周边限定。第一粘合剂是构件设置在第一区域。第二粘合构件设置在第三区域。

4. 发明申请

US20110272820A1 STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：堆叠式半导体封装及其制造方法
公开(公告)号：US20110272820A1
公开(公告)日：2011-11-10
申请号：US13096143
申请日：2011-04-28
申请人： Kyu Won LEE , Cheol Ho JOH , Eun-Hye DO , Ji Eun KIM , Hee Min SHIN
发明人： Kyu Won LEE , Cheol Ho JOH , Eun-Hye DO , Ji Eun KIM , Hee Min SHIN
IPC分类号： H01L23/48 , H01L21/82
CPC分类号： H01L23/481 , H01L21/561 , H01L23/3128 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L25/03 , H01L25/105 , H01L25/50 , H01L2224/05553 , H01L2224/05554 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2224/97 , H01L2225/1023 , H01L2225/1064 , H01L2225/1076 , H01L2924/00014 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/10161 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/3511 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A stacked semiconductor package includes a semiconductor package module including a plurality of semiconductor packages each of which has a first surface, a second surface facing away from the first surface, side surfaces connecting the first surface and the second surface and through-holes formed on the side surfaces to pass through the first surface and the second surface and which are stacked such that their through-holes vertically connect with one another, and adhesive members which are formed between the semiconductor packages and attach the semiconductor packages to one another, a main substrate supporting the semiconductor package module and formed, on a third surface thereof facing the semiconductor package module, with main connection pads which are aligned with the through-holes, and conductive connection members formed in the through-holes and electrically connecting the semiconductor packages with the main connection pads.
摘要翻译：堆叠半导体封装包括半导体封装模块，其包括多个半导体封装，每个半导体封装具有第一表面，背离第一表面的第二表面，连接第一表面和第二表面的侧表面和形成在第一表面上的通孔侧表面通过第一表面和第二表面并且堆叠成使得它们的通孔彼此垂直连接;以及粘合构件，其形成在半导体封装之间并将半导体封装彼此附接，主基板支撑半导体封装模块，并在其面向半导体封装模块的第三表面上形成与通孔对准的主连接焊盘，以及形成在通孔中的导电连接构件，并将半导体封装与主连接垫

5. 发明申请

US20100092718A1 WAFER MOUNT TAPE, WAFER PROCESSING APPARATUS AND METHOD OF USING THE SAME FOR USE IN THINNING WAFERS 审中-公开
标题翻译：带式加工带，加工方法及其使用方法在薄膜加工中的应用
公开(公告)号：US20100092718A1
公开(公告)日：2010-04-15
申请号：US12346097
申请日：2008-12-30
申请人： Hee Min SHIN , Cheol Ho JOH , Eun Hye DO , Ji Eun KIM , Kyu Won LEE
发明人： Hee Min SHIN , Cheol Ho JOH , Eun Hye DO , Ji Eun KIM , Kyu Won LEE
IPC分类号： B32B3/02 , B32B37/00
CPC分类号： H01L21/6835 , C09J7/20 , C09J2201/28 , C09J2203/326 , H01L21/67005 , H01L21/67132 , H01L21/6836 , H01L2221/68327 , H01L2221/6834 , Y10T156/10 , Y10T156/17 , Y10T428/215
摘要： A wafer mount tape, a wafer processing apparatus and an associated method of using the wafer mount tape for use in wafer thinning operations is presented. The wafer mount tape includes a tape body, a first adhesive member and a second adhesive member. The tape body has a first region, a second region and a third region. The first region of the tape body is for being disposed onto a wafer. The second region of the tape body is defined along a periphery of the first region. The third region of the tape body is defined along a periphery of the second region. The first adhesive member is disposed at the first region. The second adhesive member is disposed at the third region.
摘要翻译：提出了一种晶片安装带，晶片处理设备和使用晶片安装带用于晶片间隔操作的相关方法。晶片安装带包括带体，第一粘合构件和第二粘合构件。带体具有第一区域，第二区域和第三区域。带体的第一区域用于设置在晶片上。带体的第二区域沿着第一区域的周边限定。带体的第三区域沿着第二区域的周边限定。第一粘合构件设置在第一区域。第二粘合构件设置在第三区域。

6. 发明申请

US20130177247A1 METHOD AND APPARATUS FOR SEQUENCING OFF-LINE CHARACTER FROM NATURAL SCENE 有权
标题翻译：用于从自然场景中排序离线字符的方法和装置
公开(公告)号：US20130177247A1
公开(公告)日：2013-07-11
申请号：US13599111
申请日：2012-08-30
申请人： Ho Sub YOON , Ji Eun KIM , Kyu Dae BAN , Dong Jin LEE , Jae Hong KIM , Joo Chan SOHN
发明人： Ho Sub YOON , Ji Eun KIM , Kyu Dae BAN , Dong Jin LEE , Jae Hong KIM , Joo Chan SOHN
IPC分类号： G06K9/78
CPC分类号： G06K9/00865 , G06K9/3258 , G06K9/348 , G06K2209/01
摘要： Disclosed is a method of sequencing character information in order to increase precision of character recognition. The method includes: a pre-processing that extracts character information from an image to binarize the extracted character information through a predetermined threshold and extracts and thins a center line of the binarized character information; normalizing the pre-processed character information to character information according to a predetermined criteria; and sequencing the normalized character information using structural features including an end point or a divergence point of the character information. The present invention suggests an angle normalization method of input character information, a structural feature position determining method, and a structural feature numeral string generating method to strongly recognize characters configured by various fonts obtained from a natural scene regardless of an angle or a size of the characters.
摘要翻译：公开了一种对字符信息进行排序以提高字符识别精度的方法。该方法包括：预处理，其从图像提取字符信息，以将所提取的字符信息二值化为预定阈值，并提取并清除二值化字符信息的中心线; 根据预定标准将预处理字符信息规范化为字符信息; 以及使用包括字符信息的终点或发散点的结构特征对归一化字符信息进行排序。本发明提出了一种输入字符信息的角度归一化方法，结构特征位置确定方法和结构特征数字串生成方法，用于强烈地识别从自然场景获得的各种字体配置的字符，而不管角度或尺寸如何人物。

7. 发明申请

US20130065284A1 MODIFIED MICROORGANISM FOR HIGHLY EFFICIENT PRODUCTION OF LACTIC ACID 有权
标题翻译：用于高效生产乳酸的改性微生物
公开(公告)号：US20130065284A1
公开(公告)日：2013-03-14
申请号：US13531356
申请日：2012-06-22
申请人： Soon Chun CHUNG , Hyun Min KOO , Jae Young KIM , Ji Eun KIM , Jin Woo KIM , Young kyoung PARK , So Young LEE , Hwa Young CHO , Dae Huck KWON , Jae Chan PARK
发明人： Soon Chun CHUNG , Hyun Min KOO , Jae Young KIM , Ji Eun KIM , Jin Woo KIM , Young kyoung PARK , So Young LEE , Hwa Young CHO , Dae Huck KWON , Jae Chan PARK
IPC分类号： C12P7/56 , C12P7/62 , C12N1/15 , C12N15/63 , C12N1/19 , C12N1/21
CPC分类号： C12N9/0006 , C12N15/81 , C12N15/815 , C12P7/56 , C12Y101/01027
摘要： A modified microorganism for high efficient production of lactic acid, an expression vector for constructing the modified microorganism, and a method of producing a lactic acid using the same are disclosed. The modified microorganism may produce lactic acid at a high level under acid conditions.
摘要翻译：公开了一种用于高效生产乳酸的改性微生物，用于构建修饰微生物的表达载体和使用其的乳酸生产方法。改性微生物可在酸性条件下高水平生产乳酸。

8. 发明申请

US20110226515A1 TEXTILE-TYPE ELECTRONIC COMPONENT PACKAGE, METHOD FOR MANUFACTURING THE SAME, AND METHOD FOR MOUNTING THE SAME ON TEXTILE 失效
标题翻译：纺织类电子元件包装及其制造方法及其在纺织品上的安装方法
公开(公告)号：US20110226515A1
公开(公告)日：2011-09-22
申请号：US13049431
申请日：2011-03-16
申请人： Yong Ki SON , Baesun KIM , Ji Eun KIM
发明人： Yong Ki SON , Baesun KIM , Ji Eun KIM
IPC分类号： H05K1/02 , H05K3/42 , H05K13/04
CPC分类号： H01L23/49827 , H01L23/49838 , H01L2924/0002 , H05K1/038 , H05K1/141 , H05K3/323 , H05K3/4053 , H05K2201/0129 , H05K2201/029 , H05K2201/0329 , H05K2201/0979 , H01L2924/00
摘要： A textile-type electronic component package includes a textile base; a textile-type electronic component and a plurality of conductive patterns having end contact points formed on the top surface of the textile base; a thermoplastic adhesive formed on the bottom surface of the textile base; a plurality of mounting pads formed on the thermoplastic adhesive and facing the conductive patterns, respectively; and a plurality of via-hole-type coupling parts penetrating end contact points of the conductive patterns, the textile base, and the thermoplastic adhesive, and electrically coupling the mounting pads and the conductive patterns, wherein the via-hole-type coupling parts includes a bunch of via-holes filled with a conductive polymer.
摘要翻译：纺织型电子部件包装包括纺织品基部; 织物型电子部件和多个导电图案，其具有形成在纺织品基部的顶表面上的端部接触点; 形成在纺织品基底的底表面上的热塑性粘合剂; 分别形成在所述热塑性粘合剂上并面对所述导电图案的多个安装焊盘; 以及穿过导电图案，织物基底和热塑性粘合剂的端接触点的多个通孔型耦合部件，并且电连接安装焊盘和导电图案，其中通孔型耦合部件包括一堆填充有导电聚合物的通孔。

9. 发明申请

US20110015142A1 METHOD FOR PREPARING GYNOSTEMMA PENTAPHYLLUM EXTRACT WITH INCREASING DAMULIN A AND DAMULIN B CONTENTS, AND PHARMACEUTICAL COMPOSITIONS OF THE SAME FOR TREATING METABOLIC DISEASE 有权
标题翻译：用于制备具有增加大黄酸A和大豆B含量的GYNOSTEMMA PENTAPHLLUM提取物的方法及其药代动力学组合物用于治疗代谢疾病
公开(公告)号：US20110015142A1
公开(公告)日：2011-01-20
申请号：US12696362
申请日：2010-01-29
申请人： Tae Lin HUH , He Bok SONG , Ji Eun KIM , So Young JOON , Won Keun OH
发明人： Tae Lin HUH , He Bok SONG , Ji Eun KIM , So Young JOON , Won Keun OH
IPC分类号： A61K31/58 , C07J17/00 , A61P3/06 , A61P3/10 , A61P3/04
CPC分类号： A61K36/424 , A23L33/105 , A23V2002/00 , A23V2250/21
摘要： Disclosed is an AMPK activating material used for improving and treating metabolic syndrome, in which AMPK (AMP-activated protein kinase) is a main enzyme for regulating an energy sensor and lipid/glucose metabolism in the body. The activation of AMPK inhibits the synthesis of fat and cholesterol, and accelerates the reduction of body fat and blood glucose, thereby improving obesity, diabetes, and hyperlipidaemia. The disclosed AMPK activating material contains, as active ingredients having an improving and treating effect on metabolic syndrome, including obesity, diabetes, and hyperlipidaemia, a novel compound 2α,3β,12β-trihydroxydammar-20(22)-E,24-diene-3-O-[β-D-glucopyranosyl-(1→)-β-D-glucopyranoside], named Damulin A, and a novel compound 2α,3β,12β-trihydroxydammara-20,24-diene-3-O-[β-D-glucopyranosyl-(1→)-β-D-glucopyranoside], named Damulin B. Herein, the contents of damulin A and damulin B (as active indicator ingredients for AMPK activation) can be increased by treating a Gynostemma pentaphyllum extract with high temperature/high pressure. Accordingly, the novel Gynostemma pentaphyllum extract with a significantly increased AMPK activating capability can be used for improving or treating metabolic syndrome, such as obesity, diabetes, and hyperlipidaemia.
摘要翻译：公开了用于改善和治疗代谢综合征的AMPK活化材料，其中AMPK（AMP激活的蛋白激酶）是调节体内能量传感器和脂质/葡萄糖代谢的主要酶。 AMPK的激活抑制脂肪和胆固醇的合成，并加速体脂肪和血糖的降低，从而改善肥胖，糖尿病和高脂血症。所公开的AMPK活化材料含有作为对代谢综合征（包括肥胖症，糖尿病和高脂血症）具有改善和治疗作用的活性成分，新型化合物2α，3β，12β-三氢羟基-20（22）-E 24- 二烯-3-O- [[b] -D-吡喃葡萄糖基 - （1→） - ＆bgr-D-吡喃葡萄糖苷]，命名为Damulin A，和新化合物2α，3＆bgr，12b-三氢羟基-20,24-二烯 -3-O- [＆bgr-D-吡喃葡萄糖基 - （1→） - ＆bgr-D-吡喃葡萄糖苷]，命名为Damulin B.本文中，damulin A和damulin B（作为AMPK活化的活性指标成分）的含量可以通过用高温/高压处理绞股蓝五叶萃取物来增加。因此，具有显着增加的AMPK活化能力的新型绞股蓝五叶萃取物可用于改善或治疗代谢综合征，例如肥胖症，糖尿病和高脂血症。

10. 发明申请

US20140043698A1 PHOTOGRAPHIC LENS OPTICAL SYSTEM 有权
标题翻译：摄影镜头光学系统
公开(公告)号：US20140043698A1
公开(公告)日：2014-02-13
申请号：US13569740
申请日：2012-08-08
申请人： Pil Sun Jung , Hyong Bae PARK , Chi Ho AN , Jae Hoon CHO , Ji Eun KIM
发明人： Pil Sun Jung , Hyong Bae PARK , Chi Ho AN , Jae Hoon CHO , Ji Eun KIM
IPC分类号： G02B13/18
CPC分类号： G02B13/0035 , G02B15/173
摘要： In a lens optical system having first, second, and third lenses that are arranged between an object and an image sensor where an image of the object is formed, in order from an object side, the first lens has a positive (+) refractive power and is convex toward the object, the second lens has a negative (−) refractive power and is convex toward the image sensor, and the third lens has a positive (+) refractive power and at least one of an incident surface and an exit surface of the third lens has at least one inflection point between a center portion and an edge thereof. The lens optical system satisfies the following inequality that 0.5
摘要翻译：在具有第一，第二和第三透镜的透镜光学系统中，第一透镜具有正的（+）折射光焦度，该透镜具有布置在物体和形成有物体的图像的图像传感器之间的第一透镜，第二透镜和第三透镜，并且朝向物体凸出，第二透镜具有负（ - ）屈光力并且朝向图像传感器凸起，并且第三透镜具有正（+）屈光力，并且入射表面和出射表面中的至少一个第三透镜的中心部分和边缘之间具有至少一个拐点。透镜光学系统满足0.5

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