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1. 发明申请

US20190151266A1 PHARMACEUTICAL COMPOSITION FOR TREATING OR PREVENTING BURN INJURIES 审中-公开
公开(公告)号：US20190151266A1
公开(公告)日：2019-05-23
申请号：US16095356
申请日：2017-03-06
申请人： Jong Hyun NAM
发明人： Jong Hyun NAM
IPC分类号： A61K31/19 , A61K36/15
摘要： The present invention relates to a pharmaceutical composition useful for treating or preventing burn injury and a method of treating or preventing burn injury. The pharmaceutical composition includes, as an effective component, abieta-6,8,11,13-tetraaen-18-oic acid of Formula 1, or a pharmaceutically acceptable salt or solvate thereof:

2. 发明授权

US08907487B2 Electronic device packages having bumps and methods of manufacturing the same 有权
标题翻译：具有凸块的电子器件封装及其制造方法
公开(公告)号：US08907487B2
公开(公告)日：2014-12-09
申请号：US13618813
申请日：2012-09-14
申请人： Seung Jee Kim , Qwan Ho Chung , Jong Hyun Nam , Si Han Kim , Sang Yong Lee , Seong Cheol Shin
发明人： Seung Jee Kim , Qwan Ho Chung , Jong Hyun Nam , Si Han Kim , Sang Yong Lee , Seong Cheol Shin
IPC分类号： H01L23/52
CPC分类号： H01L24/11 , H01L21/56 , H01L21/768 , H01L23/3121 , H01L23/49827 , H01L23/5389 , H01L24/03 , H01L24/05 , H01L24/13 , H01L24/19 , H01L24/83 , H01L2224/02333 , H01L2224/02351 , H01L2224/02372 , H01L2224/02379 , H01L2224/03334 , H01L2224/0346 , H01L2224/03472 , H01L2224/03474 , H01L2224/03903 , H01L2224/03906 , H01L2224/0401 , H01L2224/04105 , H01L2224/05017 , H01L2224/05026 , H01L2224/05144 , H01L2224/05147 , H01L2224/05548 , H01L2224/05567 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/11334 , H01L2224/11602 , H01L2224/1184 , H01L2224/12105 , H01L2224/13022 , H01L2224/131 , H01L2224/211 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/014 , H01L2224/05552 , H01L2924/00
摘要： An electronic device package includes a bump having a post disposed on a contact portion of a semiconductor chip and an enlarged portion laterally protruded from an upper portion of the post; an interconnection portion having a locking portion that substantially surrounds the enlarged portion and an upper sidewall of the post; and a dielectric layer substantially surrounding the bump and the locking portion to separate the interconnection portion from the semiconductor chip.
摘要翻译：电子器件封装包括具有设置在半导体芯片的接触部分上的柱和从柱的上部侧向突出的扩大部分的凸块; 互连部分，其具有基本上围绕所述柱的扩大部分和上侧壁的锁定部分; 以及基本上围绕所述凸起和所述锁定部分的绝缘层，以将所述互连部分与所述半导体芯片分离。

3. 发明申请

US20130334685A1 EMBEDDED PACKAGES AND METHODS OF MANUFACTURING THE SAME 审中-公开
标题翻译：嵌入式封装及其制造方法
公开(公告)号：US20130334685A1
公开(公告)日：2013-12-19
申请号：US13613479
申请日：2012-09-13
申请人： Si Han KIM , Qwan Ho CHUNG , Seung Jee KIM , Jong Hyun NAM , Sang Yong LEE
发明人： Si Han KIM , Qwan Ho CHUNG , Seung Jee KIM , Jong Hyun NAM , Sang Yong LEE
IPC分类号： H01L23/498 , H01L21/56
CPC分类号： H01L24/19 , H01L21/56 , H01L21/561 , H01L23/3128 , H01L23/5389 , H01L24/97 , H01L2224/12105 , H01L2224/45144 , H01L2224/48091 , H01L2224/48465 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2924/00011 , H01L2924/12042 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2224/82 , H01L2224/83 , H01L2924/00012 , H01L2924/01033
摘要： An embedded package that may be realized by surrounding a semiconductor chip (or a semiconductor die) in a package substrate. A semiconductor chip of an embedded package may be electrically connected to external connection terminals through interconnection wires instead of bumps, and the interconnection wires may be formed using a wire bonding process. A high reliability embedded package results.
摘要翻译：可以通过围绕封装衬底中的半导体芯片（或半导体管芯）来实现的嵌入式封装。嵌入式封装的半导体芯片可以通过互连线代替凸块而电连接到外部连接端子，并且互连线可以使用引线接合工艺形成。高可靠性的嵌入式封装结果。

4. 发明申请

US20130334683A1 ELECTRONIC DEVICE PACKAGES HAVING BUMPS AND METHODS OF MANUFACTURING THE SAME 有权
公开(公告)号：US20130334683A1
公开(公告)日：2013-12-19
申请号：US13618813
申请日：2012-09-14
申请人： Seung Jee KIM , Qwan Ho CHUNG , Jong Hyun NAM , Si Han KIM , Sang Yong LEE , Seong Cheol SHIN
发明人： Seung Jee KIM , Qwan Ho CHUNG , Jong Hyun NAM , Si Han KIM , Sang Yong LEE , Seong Cheol SHIN
IPC分类号： H01L23/48 , H01L21/60
CPC分类号： H01L24/11 , H01L21/56 , H01L21/768 , H01L23/3121 , H01L23/49827 , H01L23/5389 , H01L24/03 , H01L24/05 , H01L24/13 , H01L24/19 , H01L24/83 , H01L2224/02333 , H01L2224/02351 , H01L2224/02372 , H01L2224/02379 , H01L2224/03334 , H01L2224/0346 , H01L2224/03472 , H01L2224/03474 , H01L2224/03903 , H01L2224/03906 , H01L2224/0401 , H01L2224/04105 , H01L2224/05017 , H01L2224/05026 , H01L2224/05144 , H01L2224/05147 , H01L2224/05548 , H01L2224/05567 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/11334 , H01L2224/11602 , H01L2224/1184 , H01L2224/12105 , H01L2224/13022 , H01L2224/131 , H01L2224/211 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/014 , H01L2224/05552 , H01L2924/00
摘要： An electronic device package includes a bump having a post disposed on a contact portion of a semiconductor chip and an enlarged portion laterally protruded from an upper portion of the post; an interconnection portion having a locking portion that substantially surrounds the enlarged portion and an upper sidewall of the post; and a dielectric layer substantially surrounding the bump and the locking portion to separate the interconnection portion from the semiconductor chip.

5. 发明授权

US08399975B2 Stacked semiconductor package 失效
标题翻译：堆叠半导体封装
公开(公告)号：US08399975B2
公开(公告)日：2013-03-19
申请号：US13334366
申请日：2011-12-22
申请人： Jong Hyun Nam
发明人： Jong Hyun Nam
IPC分类号： H01L23/02
CPC分类号： H01L29/0657 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L23/49838 , H01L24/16 , H01L24/17 , H01L24/32 , H01L24/33 , H01L24/73 , H01L25/0652 , H01L25/0657 , H01L2224/131 , H01L2224/14155 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/17106 , H01L2224/17181 , H01L2224/29034 , H01L2224/29035 , H01L2224/291 , H01L2224/2919 , H01L2224/32106 , H01L2224/32111 , H01L2224/32145 , H01L2224/32227 , H01L2224/33051 , H01L2224/33181 , H01L2224/33505 , H01L2224/73203 , H01L2224/73253 , H01L2224/81385 , H01L2225/06513 , H01L2225/06517 , H01L2225/06562 , H01L2924/15151 , H01L2924/15159 , H01L2924/15311 , H01L2924/15788 , H01L2924/181 , H01L2924/00012 , H01L2924/014 , H01L2924/00014 , H01L2924/00
摘要： A stacked semiconductor package includes a substrate having an upper surface and a lower surface, and divided into a first region and a second region that adjoins the first region; a support member formed in the second region on the upper surface of the substrate; and a semiconductor chip module including a plurality of semiconductor chips each of which is bent and has bonding pads near one lower edge of a declining slope of a first surface thereof and which are stacked on the support member in a step-like shape such that their bonding pads face the first region and are electrically connected with the substrate.
摘要翻译：堆叠的半导体封装包括具有上表面和下表面的基板，并且被分成与第一区域相邻的第一区域和第二区域; 支撑构件，形成在所述基板的上表面上的所述第二区域中; 以及半导体芯片模块，其包括多个半导体芯片，每个半导体芯片被弯曲并且具有在其第一表面的下降斜率的一个下边缘附近的接合焊盘，并且以阶梯形形式堆叠在支撑构件上，接合焊盘面对第一区域并且与衬底电连接。

6. 发明授权

US08394433B2 Hair growth stimulant and preparation method thereof 有权
标题翻译：头发生长兴奋剂及其制备方法
公开(公告)号：US08394433B2
公开(公告)日：2013-03-12
申请号：US12376278
申请日：2007-07-26
申请人： Jong Hyun Nam
发明人： Jong Hyun Nam
IPC分类号： A61K36/899 , A61K36/906 , A61K36/00
CPC分类号： A61K8/922 , A61K8/97 , A61Q7/00
摘要： A hair growth stimulant is provided. The hair growth stimulant uses carbonized chestnut burrs that exhibit excellent stimulatory effects on hair restoration and hair growth effects without causing side effect and toxicity. The hair growth stimulant exhibits excellent stimulatory effects on hair restoration without causing any side effect and toxicity in humans and stimulates hair roots to greatly contribute to hair growth. Therefore, the hair growth stimulant is effective in preventing hair loss and grayness. In addition, the hair growth stimulant is formulated into a cream or ointment preparation, which is highly effective in promoting the restoration of hair, to considerably shorten the time required for the treatment of hair loss. Furthermore, the hair growth stimulant uses vegetable ingredients only, thus causing no side effect in humans. Moreover, the hair growth stimulant is softly applicable to the scalp, thus offering convenience in use.
摘要翻译：提供毛发生长兴奋剂。头发生长兴奋剂使用碳化栗子毛刺，对毛发修复和毛发生长作用表现出极好的刺激作用，而不会引起副作用和毒性。毛发生长刺激剂对头发修复物表现出优异的刺激作用，而不会在人体中引起任何副作用和毒性，并刺激发根大大促进毛发生长。因此，头发生长刺激剂有效防止脱发和灰白。此外，将头发生长兴奋剂配制成膏霜或软膏剂，其对促进头发的恢复是高度有效的，大大缩短了治疗脱发所需的时间。此外，头发生长兴奋剂仅使用植物成分，因此在人体中不产生副作用。此外，头发生长兴奋剂柔软地适用于头皮，从而提供使用方便。

7. 发明申请

US20120225140A1 COMPOSITION FOR COUNTERACTING SMOKING TOXICITY 审中-公开
标题翻译：防止吸烟毒性的组合物
公开(公告)号：US20120225140A1
公开(公告)日：2012-09-06
申请号：US13509595
申请日：2010-04-20
申请人： Jong Hyun Nam
发明人： Jong Hyun Nam
IPC分类号： A61K36/82 , A61K36/886 , A61K36/8962 , A61K36/81
CPC分类号： A61K36/73 , A23L33/105 , A61K36/185 , A61K36/30 , A61K36/748 , A61K2300/00
摘要： The present invention relates to a composition for counteracting the toxicity of smoking. More particularly, the present invention relates to a composition including an extract from a whole tomato plant Hedyotis diffusa, Sorbus commixta, Lithospermum erythrorhizon Siebold & Zucc, and Alnus japonica Steud as an active ingredient counteracting the toxicity of smoking.
摘要翻译：本发明涉及一种用于抵消吸烟毒性的组合物。更具体地，本发明涉及一种组合物，其包含来自番茄植物Hedyotis diffusa，Sorbus commixta，Lithospermum erythrorhizon Siebold＆Zucc和Alnus japonica Steud的提取物作为抵消吸烟毒性的活性成分。

8. 发明申请

US20110193213A1 STACKED SEMICONDUCTOR PACKAGE 有权
标题翻译：堆叠式半导体封装
公开(公告)号：US20110193213A1
公开(公告)日：2011-08-11
申请号：US12980772
申请日：2010-12-29
申请人： Jin Ho BAE , Ki Young KIM , Jong Hyun NAM
发明人： Jin Ho BAE , Ki Young KIM , Jong Hyun NAM
IPC分类号： H01L23/48
CPC分类号： H01L24/17 , H01L23/49816 , H01L24/09 , H01L24/16 , H01L24/18 , H01L24/20 , H01L24/29 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L2224/0401 , H01L2224/04105 , H01L2224/17104 , H01L2224/18 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/49113 , H01L2224/73265 , H01L2224/73267 , H01L2225/06506 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06562 , H01L2225/06586 , H01L2924/00014 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/014 , H01L2924/078 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： A stacked semiconductor chip includes a main substrate supporting a semiconductor chip module, wherein the semiconductor module comprises at least two sub semiconductor chip modules each having a sub substrate in which a first semiconductor chip is embedded and at least two second semiconductor chips are stacked on the sub substrate.
摘要翻译：叠层半导体芯片包括支撑半导体芯片模块的主衬底，其中半导体模块包括至少两个次半导体芯片模块，每个子半导体芯片模块具有嵌入第一半导体芯片的子衬底和至少两个第二半导体芯片堆叠在其上副底物。

9. 发明授权

US07862839B2 Functional food composition for treating allergy, natural tea using the same and the manufacturing method thereof 有权
标题翻译：用于治疗过敏的功能性食品组合物，使用其的天然茶及其制造方法
公开(公告)号：US07862839B2
公开(公告)日：2011-01-04
申请号：US12094797
申请日：2007-11-27
申请人： Jong Hyun Nam
发明人： Jong Hyun Nam
IPC分类号： A61K36/68 , A61K36/00
CPC分类号： A61K36/75 , A23F3/14 , A23F3/163 , A23L33/105 , A23V2002/00 , A61K36/68 , A61K36/78 , A61K36/79 , A61K2300/00 , A23V2250/21 , A23V2200/304
摘要： A functional food composition for treating allergy, comprising Saururus chinensis, Plantago asiatica, Poncirus trifoliata and Schisandra chinensis extracts, as active ingredients, a tea composition comprising the same and a manufacturing method thereof. The functional food and tea compositions for treatment of allergy in accordance with the present invention are therapeutically effective for any type of allergic diseases, irrespective of allergic causes. In particular, the tea composition advantageously enables easy and regular administration at need, which can achieve anti-allergic effects without particular efforts for treatment of diseases.
摘要翻译：一种用于治疗过敏的功能性食品组合物，其包含中华S ensis，车前子，三堇菜，五味子提取物作为活性成分，含有该组合物的茶组合物及其制造方法。用于治疗根据本发明的变态反应的功能性食品和茶组合物对任何类型的过敏性疾病都是治疗有效的，不管过敏原因如何。特别地，茶叶组合物有利地使得需要时容易且定期地施用，其可以实现抗变态反应，而无需特别地治疗疾病。

10. 发明授权

US5968520A Natural teas for taking off the effects of drink and process for the production thereof 失效
标题翻译：用于脱除饮料和加工的效果的天然茶用于生产
公开(公告)号：US5968520A
公开(公告)日：1999-10-19
申请号：US101361
申请日：1998-07-07
申请人： Jong Hyun Nam , Sam Rye Shin
发明人： Jong Hyun Nam , Sam Rye Shin
IPC分类号： A23F3/34 , A23L20060101 , A23L2/38 , A61K20060101 , A61K36/185 , A61K36/488 , A61K36/638 , A61K36/73 , A61P20060101 , A61P1/16 , A61P25/32 , A61P39/00 , A01N65/00
CPC分类号： A61K36/185 , A23F3/34 , A61K36/488 , A61K36/638 , A61K36/73 , A23V2002/00
摘要： Natural teas for taking off the effects of drink and getting rid of or curing the hangover. The teas can be prepared by using as the main raw materials extracts of leaves, stems or roots of alder and mountain ash or powders obtained by direct pulverization of leaves, stems or roots thereof, and optionally mixing the above extracts or powders with antidotal crude herb medicines including an extract of fructus ligustic fruit and an extract of radix puerariae at various mixing ratios. The effects of the teas for curing hangover are produced by taking the teas before or after drinking.
摘要翻译： PCT No.PCT / KR97 / 00058 Sec。 371日期：1998年7月7日 102（e）1998年7月7日PCT PCT 1997年4月3日PCT公布。第WO98 / 19687号公报日期1998年5月14日天然茶脱掉饮用和摆脱或治愈宿醉的效果。茶叶可以通过使用作为主要原料的檀香山和山灰的叶子，茎或根的提取物或通过直接粉碎叶，茎或根而获得的粉末来制备，并且任选地将上述提取物或粉末与解毒草原草药物包括枸杞子提取物和葛根提取物，各种混合比例。用于治疗宿醉的茶的效果是通过在饮酒之前或之后服用茶来产生的。

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