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1. 再颁专利

USRE40112E1 Semiconductor package and method for fabricating the same 有权
标题翻译：半导体封装及其制造方法
公开(公告)号：USRE40112E1
公开(公告)日：2008-02-26
申请号：US10825670
申请日：2004-04-14
申请人： Won Sun Shin , Do Sung Chun , Sang Ho Lee , Seon Goo Lee , Vincent DiCaprio
发明人： Won Sun Shin , Do Sung Chun , Sang Ho Lee , Seon Goo Lee , Vincent DiCaprio
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L21/568 , H01L21/56 , H01L21/561 , H01L21/565 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L23/49838 , H01L23/544 , H01L24/45 , H01L24/48 , H01L24/96 , H01L24/97 , H01L25/105 , H01L2223/54473 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2225/1035 , H01L2225/1094 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/15151 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/18165 , H01L2924/00014 , H01L2924/00
摘要： Semiconductor packages having a thin structure capable of easily discharging heat from a semiconductor chip included therein, and methods for fabricating such semiconductor packages, are disclosed. An embodiment of a semiconductor package includes a semiconductor chip having a first major surface and a second major surface, the semiconductor chip being provided at the second major surface with a plurality of input/output pads; a circuit board including a resin substrate having a first major surface and a second major surface, a first circuit pattern formed at the first major surface and provided with a plurality of ball lands, a second circuit pattern formed at the second major surface and provided with a plurality of bond fingers connected with he ball lands by conductive via holes through the resin substrate, cover coats respectively coating the first and second circuit patterns while allowing the bond fingers and the ball lands to be exposed therethrough, and a central through hole adapted to receive the semiconductor chip therein; electrical conductors that electrically connect the input/output pads of the semiconductor chip with the bond fingers of the circuit board, respectively; a resin encapsulate that covers the semiconductor chip, the electrical conductors, and at least part of the circuit board; and, a plurality of conductive balls fused on the ball lands of the circuit board, respectively.
摘要翻译：公开了具有能够容易地从包括在其中的半导体芯片放出热的薄结构的半导体封装以及制造这种半导体封装的方法。半导体封装的实施例包括具有第一主表面和第二主表面的半导体芯片，所述半导体芯片在第二主表面处设置有多个输入/输出焊盘; 包括具有第一主表面和第二主表面的树脂基板的电路板，形成在第一主表面处并设置有多个球接头的第一电路图案，形成在第二主表面处并且设置有第二主表面的第二电路图案通过导电通孔与树皮基板连接的多个粘结指状物，分别涂覆第一和第二电路图案的盖涂层，同时允许粘合指状物和球状区域暴露于其中;以及中心通孔，其适于在其中接收半导体芯片; 电导体，其将半导体芯片的输入/输出焊盘电连接到电路板的键合指; 覆盖半导体芯片，电导体和电路板的至少一部分的树脂封装; 以及多个导电球分别熔合在电路板的球面上。

2. 发明授权

US06515356B1 Semiconductor package and method for fabricating the same 有权
标题翻译：半导体封装及其制造方法
公开(公告)号：US06515356B1
公开(公告)日：2003-02-04
申请号：US09566069
申请日：2000-05-05
申请人： Won Sun Shin , Seon Goo Lee , Do Sung Chun , Tae Hoan Jang , Vincent DiCaprio
发明人： Won Sun Shin , Seon Goo Lee , Do Sung Chun , Tae Hoan Jang , Vincent DiCaprio
IPC分类号： H01L2302
CPC分类号： H01L21/568 , H01L21/56 , H01L21/561 , H01L21/565 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L23/49838 , H01L23/544 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/96 , H01L24/97 , H01L25/105 , H01L2223/54473 , H01L2224/32145 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2225/1035 , H01L2225/1058 , H01L2225/1094 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/15151 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/18165 , H01L2924/3511 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要： There is provided a semiconductor package and method for fabricating the same. An embodiment of the semiconductor package includes: a semiconductor chip having a first face and a second face, the first face having a plurality of input/output pads formed thereon; a circuit board composed of a resin film having a first face and a second face, a circuit pattern layer including a plurality of bond fingers and ball lands, and a cover coat covering the circuit pattern layer and selectively exposing the plurality of bond fingers and ball lands, the circuit pattern layer being formed on the first face of the resin film, the circuit board having a through hole at the center the semiconductor chip being placed in the through hole; electrical connection means for electrically connecting the input/output pads of the semiconductor chip to the bond fingers of the circuit board; an encapsulant for encapsulating the semiconductor chip, connection means and a part of the circuit board; and a plurality of conductive balls fused to the circuit board. Accordingly, the semiconductor package becomes very thin and its heat spreading performance is improved.
摘要翻译：提供了一种半导体封装及其制造方法。半导体封装的一个实施例包括：具有第一面和第二面的半导体芯片，第一面具有形成在其上的多个输入/输出焊盘; 由具有第一面和第二面的树脂膜构成的电路板，包括多个接合指和球面的电路图案层，以及覆盖电路图案层并且选择性地暴露多个键合指状物和球的覆盖层所述电路图案层形成在所述树脂膜的第一面上，所述电路板在所述半导体芯片的中心处具有通孔，所述通孔位于所述通孔中; 电连接装置，用于将半导体芯片的输入/输出焊盘电连接到电路板的键合指状物; 用于封装半导体芯片的密封剂，连接装置和电路板的一部分; 以及与电路板熔接的多个导电球。因此，半导体封装变得非常薄，并且其散热性能得到改善。

3. 发明授权

US07211900B2 Thin semiconductor package including stacked dies 有权
标题翻译：薄型半导体封装，包括堆叠裸片
公开(公告)号：US07211900B2
公开(公告)日：2007-05-01
申请号：US11129596
申请日：2005-05-13
申请人： Won Sun Shin , Do Sung Chun , Seon Goo Lee , Il Kwon Shim , Vincent DiCaprio
发明人： Won Sun Shin , Do Sung Chun , Seon Goo Lee , Il Kwon Shim , Vincent DiCaprio
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L23/34
CPC分类号： H01L24/97 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0657 , H01L25/105 , H01L2224/26175 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2224/97 , H01L2225/0651 , H01L2225/06513 , H01L2225/06555 , H01L2225/06568 , H01L2225/06586 , H01L2225/1035 , H01L2225/1058 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01079 , H01L2924/07802 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/1532 , H01L2924/15321 , H01L2924/15331 , H01L2924/181 , H01L2924/18165 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： A semiconductor package and method for fabricating the same is disclosed. In one embodiment, the semiconductor package includes a circuit board, at least two semiconductor chips, electric connection means, an encapsulant, and a plurality of conductive balls. The circuit board has a resin layer and a circuit pattern. The resin layer is provided with an opening at its center portion. The circuit pattern is formed on at least one of upper and lower surfaces of the resin layer and includes one or more bond fingers and ball lands exposed to the outside. The semiconductor chips have a plurality of input/output pads on an active surface thereof. The semiconductor chips are stacked at a position of the opening of the circuit board, with at least one of the chips being within the opening. Alternatively, both chips are in the opening. The electric connection means connects the input/output pads of the semiconductor chips to the bond fingers of the circuit board. The encapsulant surrounds the semiconductor chips so as to protect the chips from the external environment. The conductive balls are fusion-bonded on the ball lands of the circuit board.
摘要翻译：公开了半导体封装及其制造方法。在一个实施例中，半导体封装包括电路板，至少两个半导体芯片，电连接装置，密封剂和多个导电球。电路板具有树脂层和电路图案。树脂层在其中心部分设置有开口。电路图案形成在树脂层的上表面和下表面中的至少一个上，并且包括暴露于外部的一个或多个粘合指状物和球状区域。半导体芯片在其有效表面上具有多个输入/输出焊盘。半导体芯片堆叠在电路板的开口的位置，其中至少一个芯片在开口内。或者，两个芯片都在开口中。电连接装置将半导体芯片的输入/输出焊盘连接到电路板的键合指状物。密封剂围绕半导体芯片，以保护芯片免受外部环境的影响。导电球熔接在电路板的球面上。

4. 发明授权

US07190071B2 Semiconductor package and method for fabricating the same 有权
标题翻译：半导体封装及其制造方法
公开(公告)号：US07190071B2
公开(公告)日：2007-03-13
申请号：US10785528
申请日：2004-02-24
申请人： Won Sun Shin , Seon Goo Lee , Do Sung Chun , Tae Hoan Jang , Vincent DiCaprio
发明人： Won Sun Shin , Seon Goo Lee , Do Sung Chun , Tae Hoan Jang , Vincent DiCaprio
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L23/02
CPC分类号： H01L21/568 , H01L21/56 , H01L21/561 , H01L21/565 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L23/49838 , H01L23/544 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/96 , H01L24/97 , H01L25/105 , H01L2223/54473 , H01L2224/32145 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2225/1035 , H01L2225/1058 , H01L2225/1094 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/15151 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/18165 , H01L2924/3511 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要： There is provided a semiconductor package and method for fabricating the same. An embodiment of the semiconductor package includes: a semiconductor chip having a first face and a second face, the first face having a plurality of input/output pads formed thereon; a circuit board composed of a resin film having a first face and a second face, a circuit pattern layer including a plurality of bond fingers and ball lands, and a cover coat covering the circuit pattern layer and selectively exposing the plurality of bond fingers and ball lands, the circuit pattern layer being formed on the first face of the resin film, the circuit board having a through hole at the center thereof, the semiconductor chip being placed in the through hole; electrical connection means for electrically connecting the input/output pads of the semiconductor chip to the bond fingers of the circuit board; an encapsulant for encapsulating the semiconductor chip, connection means and a part of the circuit board; and a plurality of conductive balls fused to the circuit board. Accordingly, the semiconductor package becomes very thin and its heat spreading performance is improved.
摘要翻译：提供了一种半导体封装及其制造方法。半导体封装的一个实施例包括：具有第一面和第二面的半导体芯片，第一面具有形成在其上的多个输入/输出焊盘; 由具有第一面和第二面的树脂膜构成的电路板，包括多个接合指和球面的电路图案层，以及覆盖电路图案层并且选择性地暴露多个键合指状物和球的覆盖层电路图案层形成在树脂膜的第一面上，电路板在其中心具有通孔，半导体芯片放置在通孔中; 电连接装置，用于将半导体芯片的输入/输出焊盘电连接到电路板的键合指状物; 用于封装半导体芯片的密封剂，连接装置和电路板的一部分; 以及与电路板熔接的多个导电球。因此，半导体封装变得非常薄，并且其散热性能得到改善。

5. 发明授权

US06798049B1 Semiconductor package and method for fabricating the same 失效
标题翻译：半导体封装及其制造方法
公开(公告)号：US06798049B1
公开(公告)日：2004-09-28
申请号：US09648284
申请日：2000-08-24
申请人： Won Sun Shin , Do Sung Chun , Seon Goo Lee , Il Kwon Shim , Vincent DiCaprio
发明人： Won Sun Shin , Do Sung Chun , Seon Goo Lee , Il Kwon Shim , Vincent DiCaprio
IPC分类号： H01L2302
CPC分类号： H01L24/97 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0657 , H01L25/105 , H01L2224/26175 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2224/97 , H01L2225/0651 , H01L2225/06513 , H01L2225/06555 , H01L2225/06568 , H01L2225/06586 , H01L2225/1035 , H01L2225/1058 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01079 , H01L2924/07802 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/1532 , H01L2924/15321 , H01L2924/15331 , H01L2924/181 , H01L2924/18165 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： A semiconductor package and method for fabricating the same is disclosed. In one embodiment, the semiconductor package includes a circuit board, at least two semiconductor chips, electric connection means, an encapsulant, and a plurality of conductive balls. The circuit board has a resin layer and a circuit pattern. The resin layer is provided with an opening at its center portion. The circuit pattern is formed on at least one of upper and lower surfaces of the resin layer and includes one or more bond fingers and ball lands exposed to the outside. The semiconductor chips have a plurality of input/output pads on an active surface thereof. The semiconductor chips are stacked at a position of the opening of the circuit board, with at least one of the chips being within the opening. Alternatively, both chips are in the opening. The electric connection means connects the input/output pads of the semiconductor chips to the bond fingers of the circuit board. The encapsulant surrounds the semiconductor chips so as to protect the chips from the external environment. The conductive balls are fusion-bonded on the ball lands of the circuit board.
摘要翻译：公开了半导体封装及其制造方法。在一个实施例中，半导体封装包括电路板，至少两个半导体芯片，电连接装置，密封剂和多个导电球。电路板具有树脂层和电路图案。树脂层在其中心部分设置有开口。电路图案形成在树脂层的上表面和下表面中的至少一个上，并且包括暴露于外部的一个或多个粘合指状物和球状区域。半导体芯片在其有效表面上具有多个输入/输出焊盘。半导体芯片堆叠在电路板的开口的位置，其中至少一个芯片在开口内。或者，两个芯片都在开口中。电连接装置将半导体芯片的输入/输出焊盘连接到电路板的键合指状物。密封剂围绕半导体芯片，以保护芯片免受外部环境的影响。导电球熔接在电路板的球面上。

6. 发明授权

US06717248B2 Semiconductor package and method for fabricating the same 失效
公开(公告)号：US06717248B2
公开(公告)日：2004-04-06
申请号：US10306627
申请日：2002-11-26
申请人： Won Sun Shin , Seon Goo Lee , Do Sung Chun , Tae Hoan Jang , Vincent D. DiCaprio
发明人： Won Sun Shin , Seon Goo Lee , Do Sung Chun , Tae Hoan Jang , Vincent D. DiCaprio
IPC分类号： H01L2302
CPC分类号： H01L21/568 , H01L21/56 , H01L21/561 , H01L21/565 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L23/49838 , H01L23/544 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/96 , H01L24/97 , H01L25/105 , H01L2223/54473 , H01L2224/32145 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2225/1035 , H01L2225/1058 , H01L2225/1094 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/15151 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/18165 , H01L2924/3511 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要： There is provided a semiconductor package and method for fabricating the same. An embodiment of the semiconductor package includes: a semiconductor chip having a first face and a second face, the first face having a plurality of input/output pads formed thereon; a circuit board composed of a resin film having a first face and a second face, a circuit pattern layer including a plurality of bond fingers and ball lands, and a cover coat covering the circuit pattern layer and selectively exposing the plurality of bond fingers and ball lands, the circuit pattern layer being formed on the first face of the resin film, the circuit board having a through hole at the center thereof, the semiconductor chip being placed in the through hole; electrical connection means for electrically connecting the input/output pads of the semiconductor chip to the bond fingers of the circuit board; an encapsulant for encapsulating the semiconductor chip, connection means and a part of the circuit board; and a plurality of conductive balls fused to the circuit board. Accordingly, the semiconductor package becomes very thin and its heat spreading performance is improved.

7. 发明授权

US06469258B1 Circuit board for semiconductor package 有权
标题翻译：半导体封装电路板
公开(公告)号：US06469258B1
公开(公告)日：2002-10-22
申请号：US09648946
申请日：2000-08-23
申请人： Choon Heung Lee , Won Dai Shin , Chang Hoon Ko , Won Sun Shin , Seon Goo Lee , Won Kyun Lee , Tae Hoan Jang , Jun Young Yang
发明人： Choon Heung Lee , Won Dai Shin , Chang Hoon Ko , Won Sun Shin , Seon Goo Lee , Won Kyun Lee , Tae Hoan Jang , Jun Young Yang
IPC分类号： H01R1204
CPC分类号： H05K1/0259 , H01L23/60 , H01L2924/0002 , H05K1/0215 , H05K3/0052 , H05K3/28 , H05K2201/09354 , H01L2924/00
摘要： A circuit board for semiconductor package is designed to provide a complete grounding with corresponding equipment in the manufacture of the semiconductor package based on a circuit board, thereby preventing a breakdown of the circuit board or semiconductor chip caused by electrostatic charges. The printed circuit board for semiconductor package includes: a resinous substrate; a chip mounting region formed on the top surface of the resinous substrate for mounting a semiconductor chip thereon; a plurality of fine circuit patterns radially disposed in the circumference of the chip mounting region and extending to the edge of the chip mounting region; a plurality of ball lands formed in an array on the bottom surface of the resinous substrate, to be fused to conductive balls; a conductive via hole connecting the circuit patterns on the top surface of the resinous substrate to the ball lands on the bottom surface of the resinous substrate; a cover coat applied to the top and bottom surfaces of the resinous substrate to protect the circuit patterns from an external environment and make the ball lands open to the exterior; and a means for removing electrostatic charges provided at the edge of the substrate and connected to the plural circuit patterns to remove electrostatic charges in the manufacture of semiconductors.
摘要翻译：用于半导体封装的电路板被设计为在基于电路板的半导体封装的制造中提供与相应设备的完全接地，从而防止由静电电荷引起的电路板或半导体芯片的损坏。用于半导体封装的印刷电路板包括：树脂基板; 芯片安装区，形成在树脂基板的顶表面上，用于在其上安装半导体芯片; 多个精细电路图案，其径向设置在芯片安装区域的周边并延伸到芯片安装区域的边缘; 在树脂基板的底面上以阵列形成的多个球状接头，与导电球熔合; 导电通孔，其将树脂基材的顶表面上的电路图案连接到树脂基材的底表面上的球接头; 涂覆在树脂基材的顶表面和底表面上的保护层，以保护电路图案免受外部环境的影响，并使球体向外露出; 以及用于去除设置在基板的边缘并连接到多个电路图案以在半导体制造中去除静电电荷的静电电荷的装置。

8. 发明授权

US06995448B2 Semiconductor package including passive elements and method of manufacture 失效
公开(公告)号：US06995448B2
公开(公告)日：2006-02-07
申请号：US10107656
申请日：2002-03-25
申请人： Sang Ho Lee , Jun Young Yang , Seon Goo Lee , Jong Hae Hyun , Choon Heung Lee
发明人： Sang Ho Lee , Jun Young Yang , Seon Goo Lee , Jong Hae Hyun , Choon Heung Lee
IPC分类号： H01L29/00 , H01L23/02
CPC分类号： H01L24/32 , H01L23/52 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/16 , H01L2224/05554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16145 , H01L2224/16225 , H01L2224/27013 , H01L2224/32057 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83051 , H01L2224/83385 , H01L2924/00014 , H01L2924/01013 , H01L2924/01033 , H01L2924/01079 , H01L2924/07802 , H01L2924/10162 , H01L2924/14 , H01L2924/15151 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/351 , Y10S257/927 , H01L2924/00012 , H01L2924/3512 , H01L2924/00 , H01L2224/05599
摘要： A semiconductor package including passive elements and a method of manufacturing provide reduced package size, improved performance and higher process yield by mounting the passive elements beneath the semiconductor die on the substrate. The semiconductor die may be mounted above the passive elements by mechanically bonding the semiconductor die to the passive elements, mounting the passive elements within a recess in the substrate or mounting the semiconductor using an adhesive retaining wall on the substrate that protrudes above and extends around the passive elements. The recess may include an aperture through the substrate to vent the package to the outside environment or may comprise an aperture through the substrate and larger than the semiconductor die, permitting the encapsulation to entirely fill the aperture, covering the die and the passive elements to secure them mechanically within the package.

9. 发明授权

US07790482B2 Light emitting diode package with diffuser and method of manufacturing the same 有权
标题翻译：具有扩散器的发光二极管封装及其制造方法
公开(公告)号：US07790482B2
公开(公告)日：2010-09-07
申请号：US12370194
申请日：2009-02-12
申请人： Seong Yeon Han , Seon Goo Lee , Chang Ho Song , Jung Kyu Park , Young Sam Park , Kyung Taeg Han
发明人： Seong Yeon Han , Seon Goo Lee , Chang Ho Song , Jung Kyu Park , Young Sam Park , Kyung Taeg Han
IPC分类号： H01L21/00
CPC分类号： H01L33/58 , H01L33/505 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2924/181 , H01L2933/0091 , H01L2924/00014 , H01L2924/00012
摘要： The invention relates to an LED package for facilitating color mixing using a diffuser and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, and an LED chip mounted on the substrate. The LED package also includes an encapsulant applied around the light emitting diode chip, containing a diffuser. The LED package further includes a lens part disposed on the light emitting diode chip and the encapsulant to radiate light in a wide angle. The LED package allows light from the light emitting diode chip to be emitted out of the package without distortion. The invention allows light to exit through the encapsulant containing the diffuser and the lens part, achieving uniform diffusion and emission of light from the LED chip, thereby increasing a radiating angle and obtaining a uniform light source.
摘要翻译：本发明涉及一种便于使用扩散器进行混色的LED封装及其制造方法。 LED封装包括其上形成有电极的基板和安装在基板上的LED芯片。 LED封装还包括施加在发光二极管芯片周围的密封剂，其包含扩散器。 LED封装还包括设置在发光二极管芯片上的透镜部分和密封剂以广角度辐射光。 LED封装允许来自发光二极管芯片的光从封装外部发射而不变形。本发明允许光通过包含扩散器和透镜部分的密封剂而离开，实现来自LED芯片的均匀的扩散和发射，从而增加辐射角度并获得均匀的光源。

10. 发明授权

US07687292B2 Light emitting diode package with metal reflective layer and method of manufacturing the same 有权
标题翻译：具有金属反射层的发光二极管封装及其制造方法
公开(公告)号：US07687292B2
公开(公告)日：2010-03-30
申请号：US12153719
申请日：2008-05-23
申请人： Jung Kyu Park , Seon Goo Lee , Kyung Taeg Han , Seong Yeon Han
发明人： Jung Kyu Park , Seon Goo Lee , Kyung Taeg Han , Seong Yeon Han
IPC分类号： H01L21/56
CPC分类号： H01L33/60 , H01L24/97 , H01L33/486 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73204 , H01L2924/12041 , H01L2924/15787 , H01L2924/181 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to an LED package having a metal reflective layer for focusing and emitting light through a side of the package, and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, a light emitting diode chip disposed on the substrate, and an encapsulant covering the LED chip and the substrate to protect the LED chip. The LED package also includes a metal reflective layer surrounding side surfaces of the encapsulant to form a light transmitting surface on a top surface of the encapsulant. The invention minimizes light loss, improves luminance, can be mass-produced as a PCB type, and adopts EMC transfer molding to minimize irregular color distribution, thereby improving optical quality.
摘要翻译：本发明涉及一种具有用于聚焦并通过封装侧发光的金属反射层的LED封装及其制造方法。 LED封装包括其上形成有电极的基板，设置在基板上的发光二极管芯片以及覆盖LED芯片和基板的密封剂以保护LED芯片。 LED封装还包括围绕密封剂的侧表面的金属反射层，以在密封剂的顶表面上形成透光表面。本发明使光损失最小化，亮度提高，可以作为PCB类型批量生产，并采用EMC传递模塑，以减少不规则的颜色分布，从而提高光学质量。

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