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1. 再颁专利

USRE40112E1 Semiconductor package and method for fabricating the same 有权
标题翻译：半导体封装及其制造方法
公开(公告)号：USRE40112E1
公开(公告)日：2008-02-26
申请号：US10825670
申请日：2004-04-14
申请人： Won Sun Shin , Do Sung Chun , Sang Ho Lee , Seon Goo Lee , Vincent DiCaprio
发明人： Won Sun Shin , Do Sung Chun , Sang Ho Lee , Seon Goo Lee , Vincent DiCaprio
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L21/568 , H01L21/56 , H01L21/561 , H01L21/565 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L23/49838 , H01L23/544 , H01L24/45 , H01L24/48 , H01L24/96 , H01L24/97 , H01L25/105 , H01L2223/54473 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2225/1035 , H01L2225/1094 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/15151 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/18165 , H01L2924/00014 , H01L2924/00
摘要： Semiconductor packages having a thin structure capable of easily discharging heat from a semiconductor chip included therein, and methods for fabricating such semiconductor packages, are disclosed. An embodiment of a semiconductor package includes a semiconductor chip having a first major surface and a second major surface, the semiconductor chip being provided at the second major surface with a plurality of input/output pads; a circuit board including a resin substrate having a first major surface and a second major surface, a first circuit pattern formed at the first major surface and provided with a plurality of ball lands, a second circuit pattern formed at the second major surface and provided with a plurality of bond fingers connected with he ball lands by conductive via holes through the resin substrate, cover coats respectively coating the first and second circuit patterns while allowing the bond fingers and the ball lands to be exposed therethrough, and a central through hole adapted to receive the semiconductor chip therein; electrical conductors that electrically connect the input/output pads of the semiconductor chip with the bond fingers of the circuit board, respectively; a resin encapsulate that covers the semiconductor chip, the electrical conductors, and at least part of the circuit board; and, a plurality of conductive balls fused on the ball lands of the circuit board, respectively.
摘要翻译：公开了具有能够容易地从包括在其中的半导体芯片放出热的薄结构的半导体封装以及制造这种半导体封装的方法。半导体封装的实施例包括具有第一主表面和第二主表面的半导体芯片，所述半导体芯片在第二主表面处设置有多个输入/输出焊盘; 包括具有第一主表面和第二主表面的树脂基板的电路板，形成在第一主表面处并设置有多个球接头的第一电路图案，形成在第二主表面处并且设置有第二主表面的第二电路图案通过导电通孔与树皮基板连接的多个粘结指状物，分别涂覆第一和第二电路图案的盖涂层，同时允许粘合指状物和球状区域暴露于其中;以及中心通孔，其适于在其中接收半导体芯片; 电导体，其将半导体芯片的输入/输出焊盘电连接到电路板的键合指; 覆盖半导体芯片，电导体和电路板的至少一部分的树脂封装; 以及多个导电球分别熔合在电路板的球面上。

2. 发明授权

US06515356B1 Semiconductor package and method for fabricating the same 有权
标题翻译：半导体封装及其制造方法
公开(公告)号：US06515356B1
公开(公告)日：2003-02-04
申请号：US09566069
申请日：2000-05-05
申请人： Won Sun Shin , Seon Goo Lee , Do Sung Chun , Tae Hoan Jang , Vincent DiCaprio
发明人： Won Sun Shin , Seon Goo Lee , Do Sung Chun , Tae Hoan Jang , Vincent DiCaprio
IPC分类号： H01L2302
CPC分类号： H01L21/568 , H01L21/56 , H01L21/561 , H01L21/565 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L23/49838 , H01L23/544 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/96 , H01L24/97 , H01L25/105 , H01L2223/54473 , H01L2224/32145 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2225/1035 , H01L2225/1058 , H01L2225/1094 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/15151 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/18165 , H01L2924/3511 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要： There is provided a semiconductor package and method for fabricating the same. An embodiment of the semiconductor package includes: a semiconductor chip having a first face and a second face, the first face having a plurality of input/output pads formed thereon; a circuit board composed of a resin film having a first face and a second face, a circuit pattern layer including a plurality of bond fingers and ball lands, and a cover coat covering the circuit pattern layer and selectively exposing the plurality of bond fingers and ball lands, the circuit pattern layer being formed on the first face of the resin film, the circuit board having a through hole at the center the semiconductor chip being placed in the through hole; electrical connection means for electrically connecting the input/output pads of the semiconductor chip to the bond fingers of the circuit board; an encapsulant for encapsulating the semiconductor chip, connection means and a part of the circuit board; and a plurality of conductive balls fused to the circuit board. Accordingly, the semiconductor package becomes very thin and its heat spreading performance is improved.
摘要翻译：提供了一种半导体封装及其制造方法。半导体封装的一个实施例包括：具有第一面和第二面的半导体芯片，第一面具有形成在其上的多个输入/输出焊盘; 由具有第一面和第二面的树脂膜构成的电路板，包括多个接合指和球面的电路图案层，以及覆盖电路图案层并且选择性地暴露多个键合指状物和球的覆盖层所述电路图案层形成在所述树脂膜的第一面上，所述电路板在所述半导体芯片的中心处具有通孔，所述通孔位于所述通孔中; 电连接装置，用于将半导体芯片的输入/输出焊盘电连接到电路板的键合指状物; 用于封装半导体芯片的密封剂，连接装置和电路板的一部分; 以及与电路板熔接的多个导电球。因此，半导体封装变得非常薄，并且其散热性能得到改善。

3. 发明授权

US07211900B2 Thin semiconductor package including stacked dies 有权
标题翻译：薄型半导体封装，包括堆叠裸片
公开(公告)号：US07211900B2
公开(公告)日：2007-05-01
申请号：US11129596
申请日：2005-05-13
申请人： Won Sun Shin , Do Sung Chun , Seon Goo Lee , Il Kwon Shim , Vincent DiCaprio
发明人： Won Sun Shin , Do Sung Chun , Seon Goo Lee , Il Kwon Shim , Vincent DiCaprio
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L23/34
CPC分类号： H01L24/97 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0657 , H01L25/105 , H01L2224/26175 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2224/97 , H01L2225/0651 , H01L2225/06513 , H01L2225/06555 , H01L2225/06568 , H01L2225/06586 , H01L2225/1035 , H01L2225/1058 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01079 , H01L2924/07802 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/1532 , H01L2924/15321 , H01L2924/15331 , H01L2924/181 , H01L2924/18165 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： A semiconductor package and method for fabricating the same is disclosed. In one embodiment, the semiconductor package includes a circuit board, at least two semiconductor chips, electric connection means, an encapsulant, and a plurality of conductive balls. The circuit board has a resin layer and a circuit pattern. The resin layer is provided with an opening at its center portion. The circuit pattern is formed on at least one of upper and lower surfaces of the resin layer and includes one or more bond fingers and ball lands exposed to the outside. The semiconductor chips have a plurality of input/output pads on an active surface thereof. The semiconductor chips are stacked at a position of the opening of the circuit board, with at least one of the chips being within the opening. Alternatively, both chips are in the opening. The electric connection means connects the input/output pads of the semiconductor chips to the bond fingers of the circuit board. The encapsulant surrounds the semiconductor chips so as to protect the chips from the external environment. The conductive balls are fusion-bonded on the ball lands of the circuit board.
摘要翻译：公开了半导体封装及其制造方法。在一个实施例中，半导体封装包括电路板，至少两个半导体芯片，电连接装置，密封剂和多个导电球。电路板具有树脂层和电路图案。树脂层在其中心部分设置有开口。电路图案形成在树脂层的上表面和下表面中的至少一个上，并且包括暴露于外部的一个或多个粘合指状物和球状区域。半导体芯片在其有效表面上具有多个输入/输出焊盘。半导体芯片堆叠在电路板的开口的位置，其中至少一个芯片在开口内。或者，两个芯片都在开口中。电连接装置将半导体芯片的输入/输出焊盘连接到电路板的键合指状物。密封剂围绕半导体芯片，以保护芯片免受外部环境的影响。导电球熔接在电路板的球面上。

4. 发明授权

US07190071B2 Semiconductor package and method for fabricating the same 有权
标题翻译：半导体封装及其制造方法
公开(公告)号：US07190071B2
公开(公告)日：2007-03-13
申请号：US10785528
申请日：2004-02-24
申请人： Won Sun Shin , Seon Goo Lee , Do Sung Chun , Tae Hoan Jang , Vincent DiCaprio
发明人： Won Sun Shin , Seon Goo Lee , Do Sung Chun , Tae Hoan Jang , Vincent DiCaprio
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L23/02
CPC分类号： H01L21/568 , H01L21/56 , H01L21/561 , H01L21/565 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L23/49838 , H01L23/544 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/96 , H01L24/97 , H01L25/105 , H01L2223/54473 , H01L2224/32145 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2225/1035 , H01L2225/1058 , H01L2225/1094 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/15151 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/18165 , H01L2924/3511 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要： There is provided a semiconductor package and method for fabricating the same. An embodiment of the semiconductor package includes: a semiconductor chip having a first face and a second face, the first face having a plurality of input/output pads formed thereon; a circuit board composed of a resin film having a first face and a second face, a circuit pattern layer including a plurality of bond fingers and ball lands, and a cover coat covering the circuit pattern layer and selectively exposing the plurality of bond fingers and ball lands, the circuit pattern layer being formed on the first face of the resin film, the circuit board having a through hole at the center thereof, the semiconductor chip being placed in the through hole; electrical connection means for electrically connecting the input/output pads of the semiconductor chip to the bond fingers of the circuit board; an encapsulant for encapsulating the semiconductor chip, connection means and a part of the circuit board; and a plurality of conductive balls fused to the circuit board. Accordingly, the semiconductor package becomes very thin and its heat spreading performance is improved.
摘要翻译：提供了一种半导体封装及其制造方法。半导体封装的一个实施例包括：具有第一面和第二面的半导体芯片，第一面具有形成在其上的多个输入/输出焊盘; 由具有第一面和第二面的树脂膜构成的电路板，包括多个接合指和球面的电路图案层，以及覆盖电路图案层并且选择性地暴露多个键合指状物和球的覆盖层电路图案层形成在树脂膜的第一面上，电路板在其中心具有通孔，半导体芯片放置在通孔中; 电连接装置，用于将半导体芯片的输入/输出焊盘电连接到电路板的键合指状物; 用于封装半导体芯片的密封剂，连接装置和电路板的一部分; 以及与电路板熔接的多个导电球。因此，半导体封装变得非常薄，并且其散热性能得到改善。

5. 发明授权

US06798049B1 Semiconductor package and method for fabricating the same 失效
标题翻译：半导体封装及其制造方法
公开(公告)号：US06798049B1
公开(公告)日：2004-09-28
申请号：US09648284
申请日：2000-08-24
申请人： Won Sun Shin , Do Sung Chun , Seon Goo Lee , Il Kwon Shim , Vincent DiCaprio
发明人： Won Sun Shin , Do Sung Chun , Seon Goo Lee , Il Kwon Shim , Vincent DiCaprio
IPC分类号： H01L2302
CPC分类号： H01L24/97 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0657 , H01L25/105 , H01L2224/26175 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2224/97 , H01L2225/0651 , H01L2225/06513 , H01L2225/06555 , H01L2225/06568 , H01L2225/06586 , H01L2225/1035 , H01L2225/1058 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01079 , H01L2924/07802 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/1532 , H01L2924/15321 , H01L2924/15331 , H01L2924/181 , H01L2924/18165 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： A semiconductor package and method for fabricating the same is disclosed. In one embodiment, the semiconductor package includes a circuit board, at least two semiconductor chips, electric connection means, an encapsulant, and a plurality of conductive balls. The circuit board has a resin layer and a circuit pattern. The resin layer is provided with an opening at its center portion. The circuit pattern is formed on at least one of upper and lower surfaces of the resin layer and includes one or more bond fingers and ball lands exposed to the outside. The semiconductor chips have a plurality of input/output pads on an active surface thereof. The semiconductor chips are stacked at a position of the opening of the circuit board, with at least one of the chips being within the opening. Alternatively, both chips are in the opening. The electric connection means connects the input/output pads of the semiconductor chips to the bond fingers of the circuit board. The encapsulant surrounds the semiconductor chips so as to protect the chips from the external environment. The conductive balls are fusion-bonded on the ball lands of the circuit board.
摘要翻译：公开了半导体封装及其制造方法。在一个实施例中，半导体封装包括电路板，至少两个半导体芯片，电连接装置，密封剂和多个导电球。电路板具有树脂层和电路图案。树脂层在其中心部分设置有开口。电路图案形成在树脂层的上表面和下表面中的至少一个上，并且包括暴露于外部的一个或多个粘合指状物和球状区域。半导体芯片在其有效表面上具有多个输入/输出焊盘。半导体芯片堆叠在电路板的开口的位置，其中至少一个芯片在开口内。或者，两个芯片都在开口中。电连接装置将半导体芯片的输入/输出焊盘连接到电路板的键合指状物。密封剂围绕半导体芯片，以保护芯片免受外部环境的影响。导电球熔接在电路板的球面上。

6. 发明授权

US06982488B2 Semiconductor package and method for fabricating the same 失效
标题翻译：半导体封装及其制造方法
公开(公告)号：US06982488B2
公开(公告)日：2006-01-03
申请号：US10600931
申请日：2003-06-20
申请人： Won Sun Shin , Do Sung Chun , Soon Goo Lee , Il Kwon Shim , Vincent DiCaprio
发明人： Won Sun Shin , Do Sung Chun , Soon Goo Lee , Il Kwon Shim , Vincent DiCaprio
IPC分类号： H01L23/02 , H01L23/12 , H01L23/34 , H01L23/64 , H01L23/52 , H01L23/48
CPC分类号： H01L24/97 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0657 , H01L25/105 , H01L2224/26175 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2224/97 , H01L2225/0651 , H01L2225/06513 , H01L2225/06555 , H01L2225/06568 , H01L2225/06586 , H01L2225/1035 , H01L2225/1058 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01079 , H01L2924/07802 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/1532 , H01L2924/15321 , H01L2924/15331 , H01L2924/181 , H01L2924/18165 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： A semiconductor package and method for fabricating the same is disclosed. In one embodiment, the semiconductor package includes a circuit board, at least two semiconductor chips, electric connection means, an encapsulant, and a plurality of conductive balls. The circuit board has a resin layer and a circuit pattern. The resin layer is provided with an opening at its center portion. The circuit pattern is formed on at least one of upper and lower surfaces of the resin layer and includes one or more bond fingers and ball lands exposed to the outside. The semiconductor chips have a plurality of input/output pads on an active surface thereof. The semiconductor chips are stacked at a position of the opening of the circuit board, with at least one of the chips being within the opening. Alternatively, both chips are in the opening. The electric connection means connects the input/output pads of the semiconductor chips to the bond fingers of the circuit board. The encapsulant surrounds the semiconductor chips so as to protect the chips from the external environment. The conductive balls are fusion-bonded on the ball lands of the circuit board.
摘要翻译：公开了半导体封装及其制造方法。在一个实施例中，半导体封装包括电路板，至少两个半导体芯片，电连接装置，密封剂和多个导电球。电路板具有树脂层和电路图案。树脂层在其中心部分设置有开口。电路图案形成在树脂层的上表面和下表面中的至少一个上，并且包括暴露于外部的一个或多个粘合指状物和球状区域。半导体芯片在其有效表面上具有多个输入/输出焊盘。半导体芯片堆叠在电路板的开口的位置，其中至少一个芯片在开口内。或者，两个芯片都在开口中。电连接装置将半导体芯片的输入/输出焊盘连接到电路板的键合指状物。密封剂围绕半导体芯片，以保护芯片免受外部环境的影响。导电球熔接在电路板的球面上。

7. 发明申请

US20050205979A1 Semiconductor package and method for fabricating the same 有权
标题翻译：半导体封装及其制造方法
公开(公告)号：US20050205979A1
公开(公告)日：2005-09-22
申请号：US11129596
申请日：2005-05-13
申请人： Won Shin , Do Chun , Seon Lee , Il Shim , Vincent DiCaprio
发明人： Won Shin , Do Chun , Seon Lee , Il Shim , Vincent DiCaprio
IPC分类号： H01L23/12 , H01L23/02 , H01L23/13 , H01L23/31 , H01L23/498 , H01L25/065 , H01L25/07 , H01L25/10 , H01L25/18
CPC分类号： H01L24/97 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0657 , H01L25/105 , H01L2224/26175 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2224/97 , H01L2225/0651 , H01L2225/06513 , H01L2225/06555 , H01L2225/06568 , H01L2225/06586 , H01L2225/1035 , H01L2225/1058 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01079 , H01L2924/07802 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/1532 , H01L2924/15321 , H01L2924/15331 , H01L2924/181 , H01L2924/18165 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： A semiconductor package and method for fabricating the same is disclosed. In one embodiment, the semiconductor package includes a circuit board, at least two semiconductor chips, electric connection means, an encapsulant, and a plurality of conductive balls. The circuit board has a resin layer and a circuit pattern. The resin layer is provided with an opening at its center portion. The circuit pattern is formed on at least one of upper and lower surfaces of the resin layer and includes one or more bond fingers and ball lands exposed to the outside. The semiconductor chips have a plurality of input/output pads on an active surface thereof. The semiconductor chips are stacked at a position of the opening of the circuit board, with at least one of the chips being within the opening. Alternatively, both chips are in the opening. The electric connection means connects the input/output pads of the semiconductor chips to the bond fingers of the circuit board. The encapsulant surrounds the semiconductor chips so as to protect the chips from the external environment. The conductive balls are fusion-bonded on the ball lands of the circuit board.
摘要翻译：公开了半导体封装及其制造方法。在一个实施例中，半导体封装包括电路板，至少两个半导体芯片，电连接装置，密封剂和多个导电球。电路板具有树脂层和电路图案。树脂层在其中心部分设置有开口。电路图案形成在树脂层的上表面和下表面中的至少一个上，并且包括暴露于外部的一个或多个粘合指状物和球状区域。半导体芯片在其有效表面上具有多个输入/输出焊盘。半导体芯片堆叠在电路板的开口的位置，其中至少一个芯片在开口内。或者，两个芯片都在开口中。电连接装置将半导体芯片的输入/输出焊盘连接到电路板的键合指状物。密封剂围绕半导体芯片，以保护芯片免受外部环境的影响。导电球熔接在电路板的球面上。

8. 发明授权

US06683377B1 Multi-stacked memory package 有权
标题翻译：多堆叠内存包
公开(公告)号：US06683377B1
公开(公告)日：2004-01-27
申请号：US09583183
申请日：2000-05-30
申请人： Il Kwon Shim , Vincent DiCaprio
发明人： Il Kwon Shim , Vincent DiCaprio
IPC分类号： H01L2334
CPC分类号： H01L25/0657 , H01L23/5387 , H01L24/45 , H01L24/48 , H01L2224/16 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/4824 , H01L2224/73215 , H01L2225/0651 , H01L2225/06575 , H01L2225/06579 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/181 , H01L2224/05599 , H01L2924/00
摘要： A multiple chip package and method of making the package allow multiple same size or different size chips to be stacked over each other, thereby creating a thin profile multi-chip package. Chips are attached to one surface of a continuous flexible substrate. The substrate has a metallization layer, which is electrically connected to the chips, such as via bond wires attached to center bond pads of the chips and to bond fingers on the metallization layer. Interconnections, such as solder balls, are attached to the other surface of the substrate and only at the portion opposite to the first chip. The substrate is folded to bring the first chip toward a second chip, which are then attached, such as with an insulative adhesive spacer. If any additional chips remain on the substrate, the substrate is folded to sequentially bring each additional chip toward the surface of the substrate opposite to the preceding chip and is secured thereto.
摘要翻译：制造封装的多芯片封装和方法允许多个相同尺寸或不同尺寸的芯片彼此堆叠，从而形成薄型多芯片封装。芯片连接到连续柔性基板的一个表面。衬底具有电连接到芯片的金属化层，例如连接到芯片的中心接合焊盘的通孔接合线，并且在金属化层上粘合指状物。诸如焊球之类的互连连接到衬底的另一表面，并且仅在与第一芯片相对的部分处。将基板折叠以将第一芯片朝向第二芯片，然后将其连接，例如用绝缘粘合剂间隔件。如果在基板上剩余另外的芯片，则将基板折叠成顺序地使每个附加芯片朝向与先前芯片相对的基板的表面并固定到其上。

9. 发明授权

US06531784B1 Semiconductor package with spacer strips 有权
标题翻译：半导体封装带间隔条
公开(公告)号：US06531784B1
公开(公告)日：2003-03-11
申请号：US09585915
申请日：2000-06-02
申请人： Il Kwon Shim , Kambhampati Ramakrishna , Vincent DiCaprio
发明人： Il Kwon Shim , Kambhampati Ramakrishna , Vincent DiCaprio
IPC分类号： H01L2348
CPC分类号： H01L24/48 , H01L23/49833 , H01L24/45 , H01L24/49 , H01L25/0657 , H01L2224/05553 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48095 , H01L2224/4813 , H01L2224/48472 , H01L2224/48599 , H01L2224/48699 , H01L2224/4899 , H01L2224/4911 , H01L2224/49171 , H01L2224/73265 , H01L2224/85201 , H01L2224/85205 , H01L2225/0651 , H01L2225/06572 , H01L2225/06586 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01031 , H01L2924/01079 , H01L2924/014 , H01L2924/10162 , H01L2924/15311 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/85399 , H01L2224/05599
摘要： A semiconductor package incorporates spacer strips enabling one or more semiconductor dies having central terminal pads to be stacked on top of one another within the package and reliably wire bonded to an associated substrate without shorting of the bonded wires. Each of the spacer strips comprises a flat, elongated strip of an insulative material that mount at edges of a surface of a die such that they straddle the central terminal pads thereon. The die is electrically connected to the substrate by a plurality of fine conductive wires having a first end bonded to one of the central terminal pad on the die, a second end bonded to a terminal pad on the substrate, and an intermediate portion between the first and second ends that passes transversely across the top surface of one of the spacer strips. The spacer strips have spaced pads or grooves on or in their top surfaces that captivate the individual wires and thereby redistribute the wires and prevent them from contacting the die and each other.
摘要翻译：半导体封装包括间隔条，使得一个或多个具有中心端子焊盘的半导体管芯能够在封装内堆叠在彼此的顶部，并且可靠地引线键合到相关联的衬底而不会使接合的引线短路。每个间隔条包括平坦的，细长的绝缘材料条，其安装在管芯的表面的边缘处，使得它们跨越其上的中心端子焊盘。芯片通过多个细导电线电连接到基板上，该细导电线具有与芯片上的一个中心端子焊盘接合的第一端，接合到基板上的端子焊盘的第二端和第一端并且横向穿过一个间隔条的顶表面的第二端。间隔条在其顶表面上或其顶表面上具有间隔的垫或凹槽，其吸引各个线，从而重新分布电线并防止它们与管芯和彼此接触。

10. 发明授权

US06517656B1 Method of making an integrated circuit package using a batch step for curing a die attachment film and a tool system for performing the method 有权
标题翻译：使用用于固化模具附着膜的批量步骤制造集成电路封装的方法和用于执行该方法的工具系统
公开(公告)号：US06517656B1
公开(公告)日：2003-02-11
申请号：US09412889
申请日：1999-10-05
申请人： Vincent DiCaprio
发明人： Vincent DiCaprio
IPC分类号： B32B3120
CPC分类号： H01L24/83 , H01L24/75 , H01L2224/2919 , H01L2224/8319 , H01L2224/83855 , H01L2224/83856 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01033 , H01L2924/01074 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/00
摘要： Methods of making packages for integrated circuit devices, and in particular for attaching a plurality of integrated circuit die to a substrate strip, are disclosed. The substrate includes a plurality of die mounting sites. A B-staged epoxy film is on each site. An exemplary method includes placing an integrated circuit die on the adhesive film of each site. After a plurality of integrated circuit die are individually placed on the substrate, the adhesive films of a plurality of sites are cured simultaneously in a batch process. The curing permanently attaches the die to the substrate. Subsequently, the die are wire bonded to their respective substrate sites and encapsulated. The encapsulated substrate is cut to form individual packages. A tool system for performing the die attachment process includes a head for picking up a die and placing the die on an adhesive film on the substrate strip, and a pair of opposing plates capable of pressing together and applying pressure and heat to a plurality of sites simultaneously so as to cure the adhesive film of the plurality of sites.
摘要翻译：公开了用于集成电路器件的封装的方法，特别是用于将多个集成电路管芯附着到衬底条上的方法。基板包括多个模具安装位置。每个站点都有一个B级环氧膜。一种示例性方法包括将集成电路管芯放置在每个部位的粘合膜上。在将多个集成电路芯片分别放置在基板上之后，多个部位的粘合膜在批处理中同时固化。固化将模具永久地附着到基底上。随后，管芯被引线键合到它们各自的衬底部位并封装。封装的衬底被切割以形成单独的封装。用于执行模具附接工艺的工具系统包括用于拾取模具并将模具放置在衬底条上的粘合剂膜上的头部，以及一对能够压在一起并向多个部位施加压力和热量的相对板同时固化多个部位的粘合膜。

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