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    • 10. 发明授权
    • Low density high frequency process for a parallel-plate electrode plasma reactor having an inductive antenna
    • 具有感性天线的平行板电极等离子体反应器的低密度高频工艺
    • US06444084B1
    • 2002-09-03
    • US09480007
    • 2000-01-10
    • Kenneth Collins
    • Kenneth Collins
    • H05H100
    • H01L21/6831H01J37/321H01J37/32165H01J37/32458H01J37/32467H01J37/32522
    • The present invention is embodied in a method of operating an inductively coupled plasma reactor for processing a semiconductor wafer, the reactor including a vacuum chamber for containing the wafer, a process gas source, a semiconductor window electrode facing an interior portion of the chamber, an inductive power radiator on an exterior side of the semiconductor window electrode, the inductive field having a skin depth generally decreasing with the frequency of the RF inductive field and with the density of the plasma in the chamber and generally increasing with the pressure inside the vacuum chamber, the inductive coupling of the RF field tending to approach extinguishment as the skin depth approaches the spacing between the wafer and the window electrode, a method for maintaining an intermediate plasma density inside the chamber without extinguishing the inductive coupling of the RF field, the method including operating the reactor at a selected flow rate of the process gas, a selected chamber pressure and a selected plasma source power level corresponding to the reduced plasma density, and maintaining the frequency of the RF field at least at a level sufficient to limit the skin depth to a depth less than the electrode-to-wafer spacing, whereby to maintain the inductive coupling of the RF field.
    • 本发明体现在一种操作用于处理半导体晶片的电感耦合等离子体反应器的方法,该反应器包括用于容纳晶片的真空室,工艺气体源,面向腔室内部的半导体窗口电极, 在半导体窗口电极的外侧上的感应功率辐射器,感应场具有通常随着RF感应场的频率以及腔室中的等离子体的密度而降低的皮肤深度,并且通常随着真空室内的压力而增加 随着皮肤深度接近晶片和窗户电极之间的间距,RF场的电感耦合趋于接近熄灭,一种用于在室内保持中间等离子体密度而不消除RF场的电感耦合的方法,该方法 包括以所选择的工艺气体流速操作反应器 并且将RF场的频率维持在至少足以将皮肤深度限制到小于电极到晶片间隔的深度的水平,由此, 以保持RF场的电感耦合。