会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 3. 发明授权
    • Method and apparatus for enhanced SOI passgate operations
    • 用于增强SOI通道操作的方法和装置
    • US06504212B1
    • 2003-01-07
    • US09497361
    • 2000-02-03
    • David Howard AllenJente Benedict KuangPong-Fei LuMary Joseph SaccamangoDaniel Lawrence Stasiak
    • David Howard AllenJente Benedict KuangPong-Fei LuMary Joseph SaccamangoDaniel Lawrence Stasiak
    • H01L2701
    • H01L29/78615G11C7/1048G11C2207/002H01L29/7841H03K17/063H03K17/162
    • A method and apparatus are provided for implementing enhanced silicon-on-insulator (SOI) passgate operations. The apparatus for implementing enhanced silicon-on-insulator (SOI) passgate operations includes a silicon-on-insulator (SOI) passgate field effect transistor. A select input is coupled to the silicon-on-insulator (SOI) passgate field effect transistor. A discharging field effect transistor of an opposite channel type is coupled to the silicon-on-insulator (SOI) passgate field effect transistor. The discharging field effect transistor is activated during an off cycle of the silicon-on-insulator (SOI) passgate field effect transistor. The discharging field effect transistor is coupled to the body of the SOI passgate field effect transistor. The discharging field effect transistor is deactivated during an on cycle of the SOI passgate field effect transistor, whereby the body of the SOI passgate field effect transistor floats during the on cycle. The method for implementing enhanced silicon-on-insulator (SOI) passgate operations can be used with N-channel or P-channel implementations as well as with a combination of N-channel and P-channel devices.
    • 提供了一种用于实现增强型绝缘体上硅(SOI)通孔操作的方法和装置。 用于实现增强型绝缘体上硅(SOI)门极操作的装置包括绝缘体上硅(SOI)通道场效应晶体管。 选择输入耦合到绝缘体上硅(SOI)通道场效应晶体管。 相反通道类型的放电场效应晶体管耦合到绝缘体上硅(SOI)门极场效应晶体管。 放电场效应晶体管在绝缘体上硅(SOI)门极场效应晶体管的关断周期期间被激活。 放电场效应晶体管耦合到SOI通道场效应晶体管的主体。 在SOI通道场效应晶体管的导通周期期间,放电场效应晶体管被去激活,由此SOI通道场效应晶体的主体在导通周期中浮动。 用于实现增强型绝缘体上硅(SOI)通道操作的方法可以与N沟道或P沟道实现以及N沟道和P沟道器件的组合一起使用。
    • 6. 发明授权
    • Process for fabricating low capacitance bipolar junction transistor
    • 制造低电容双极结型晶体管的工艺
    • US5106767A
    • 1992-04-21
    • US683408
    • 1991-04-10
    • Janes H. ComfortTze-Chiang ChenPong-Fei LuBernard S. MeyersonYuan-Chen SunDenny D. Tang
    • Janes H. ComfortTze-Chiang ChenPong-Fei LuBernard S. MeyersonYuan-Chen SunDenny D. Tang
    • H01L21/285H01L21/331H01L21/762
    • H01L29/66287H01L21/28525H01L21/76229H01L29/66242Y10S148/102Y10S148/117Y10S148/124
    • This invention relates to a bipolar transistor which incorporates, in a raised base regime, an emitter, collector pedestal and intrinsic and extrinsic bases all of which are self-aligned. The invention also relates to a process for fabricating such devices which obtains the self-alignment of the above mentioned elements using a single lithographic and masking step. The structure of the transistor, in addition to having the self-algined elements, incorporates a composite dielectric isolation layer which not only permits the carrying out of a number of functions during device fabrication but also provides for desired electrical characteristics during device operation. The composite isolation layer consists of an oxide layer adjacent the semiconductor surface; a nitride layer on the oxide layer and an oxide layer on the nitride layer in the final structure of the device. The last mentioned oxide layer starts out early in the fabrication process as a layer of oxidizable material, preferably polycrystalline silicon, which, at later steps in the process, acts as an etch-stop in its unoxidized state and as a memory element and mask in its oxidized state when a self-aligned datum element is removed and the thus exposed underlying dielectric elements must be removed to provide a planar emitter opening. The resulting transistor includes a planar emitter-emitter contact interface which provides for fine control of emitter depth in the underlying intrinsic base region.
    • 本发明涉及一种双极晶体管,其在升高的基极方面包含发射极,集电极基座以及所有这些基底都是自对准的内在和外在基极。 本发明还涉及一种用于制造这样的器件的方法,其使用单个光刻和掩蔽步骤获得上述元件的自对准。 晶体管的结构除了具有自嵌入元件之外,还包括复合介电隔离层,其不仅允许在器件制造期间执行多种功能,而且还可以在器件操作期间提供期望的电特性。 复合隔离层由邻近半导体表面的氧化物层组成; 氧化物层上的氮化物层和该器件的最终结构中的氮化物层上的氧化物层。 最后提到的氧化物层在制造过程的早期开始为可氧化材料层,优选多晶硅,其在该工艺的后续步骤中用作其未氧化状态的蚀刻停止,并且作为存储元件和掩模 当自对准基准元件被去除并且必须去除这样暴露的下面的介质元件以提供平面发射器开口时,其氧化态。 所产生的晶体管包括平面的发射极 - 发射极接触界面,其提供对底层本征基极区域的发射极深度的精细控制。
    • 8. 发明授权
    • Method and apparatus for reducing parasitic bipolar current in a silicon-on-insulator transistor
    • 用于减小绝缘体上硅晶体管中的寄生双极电流的方法和装置
    • US06281737B1
    • 2001-08-28
    • US09196907
    • 1998-11-20
    • Jente Benedict KuangPong-Fei LuMary Joseph Saccamango
    • Jente Benedict KuangPong-Fei LuMary Joseph Saccamango
    • H03K1716
    • H03K19/00361H03K17/162H03K19/0027H03K2217/0018
    • In a method and apparatus for reducing parasitic bipolar current in an insulated body, field effect transistor (“FET”), for an n-type FET, the body of the insulated body NFET is electrically isolated, responsive to turning on the NFET. This permits a charge to accumulate on the body in connection with turning the NFET on, temporarily lowering the threshold voltage for the insulated body NFET. Responsive to turning off the insulated body NFET, at least a portion of the charge on the body is discharged. This discharging of the body reduces parasitic bipolar current which would otherwise occur upon turning the NFET back on if the body had charged up during the time when the NFET was off. For a p-type FET that is susceptible to parasitic bipolar current, the body is discharged responsive to turning off the PFET, and isolated responsive to turning on the PFET.
    • 在用于减小绝缘体中的寄生双极性电流的方法和装置中,用于n型FET的场效应晶体管(“FET”),绝缘体NFET的主体是电绝缘的,这是响应于导通NFET的。 这允许电荷在与NFET导通相关的情况下积聚在体上,暂时降低绝缘体NFET的阈值电压。 响应于关闭绝缘体NFET,物体上的电荷的至少一部分被排出。 如果在NFET关闭时,如果身体充电,则本体放电会减少寄生双极电流,否则会在NFET转向NTD时发生。 对于易受寄生双极性电流影响的p型FET,响应于关断PFET而使体被放电,并且响应于导通PFET而被隔离。