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    • 3. 发明授权
    • Systems and methods for cooling a computing component in a computing rack
    • 用于冷却计算机架中计算组件的系统和方法
    • US07907409B2
    • 2011-03-15
    • US12406645
    • 2009-03-18
    • William G. WyattRichard M. Weber
    • William G. WyattRichard M. Weber
    • H05K7/20
    • H05K7/20809
    • According to one embodiment, a system for cooling computing components includes a computing rack housing a plurality of computing components of a computing system. A heat absorbing plate is disposed in and removable from the computing rack. The heat absorbing plate is thermally coupled to an outer surface of a computing component and comprises a plurality of walls defining a cavity containing a two-phase coolant. The cavity has a continuous volume allowing the two-phase coolant to absorb heat from the computing component and to transfer the heat to a heat transfer mechanism. The computing rack has a sidewall that is thermally coupled to the heat absorbing plate and comprises the heat transfer mechanism, which is operable to receive the heat transferred from the heat absorbing plate.
    • 根据一个实施例,用于冷却计算组件的系统包括容纳计算系统的多个计算组件的计算机架。 吸热板设置在计算机架中并从计算机架上移除。 吸热板热耦合到计算部件的外表面,并且包括限定包含两相冷却剂的空腔的多个壁。 空腔具有允许两相冷却剂从计算部件吸收热量并将热量传递到热传递机构的连续容积。 计算机架具有热耦合到吸热板的侧壁,并且包括传热机构,其可操作以接收从吸热板传递的热量。
    • 4. 发明申请
    • Topping Cycle for a Sub-Ambient Cooling System
    • 辅助环境冷却系统的顶循环
    • US20090077981A1
    • 2009-03-26
    • US11859591
    • 2007-09-21
    • William G. WyattJames F. KviatkofskyJames A. PruettTimothy E. AdamsChristopher Moshenrose
    • William G. WyattJames F. KviatkofskyJames A. PruettTimothy E. AdamsChristopher Moshenrose
    • F25B21/02
    • F25B23/006F25B21/02
    • According to one embodiment of the disclosure, a cooling system for a heat-generating structure comprises a heat exchanger, a first structure, a condenser heat exchanger, and a second condenser. The heat exchanger is in thermal communication with a heat-generating structure. The heat exchanger has an inlet and an outlet. The inlet is operable to receive fluid coolant substantially in the form of a liquid into the heat exchanger, and the outlet is operable to dispense fluid coolant at least partially in the form of a vapor out of the heat exchanger. The first structure directs a flow of the fluid coolant substantially in the form of a liquid to the heat exchanger. Thermal energy communicated from the heat-generating structure to the fluid coolant causes the fluid coolant substantially in the form of a liquid to boil and vaporize in the heat exchanger. The condenser heat exchanger receives a flow of the fluid coolant at least partially in the form of a vapor from the heat exchanger and transfers at least a portion of the thermal energy within the fluid coolant to a heat sink. The second condenser assists the condenser heat exchanger in transferring at least a portion of the thermal energy within the fluid coolant away from the fluid coolant. The second condenser is selectively activated when the heat sink reaches an undesirable temperature.
    • 根据本公开的一个实施例,用于发热结构的冷却系统包括热交换器,第一结构,冷凝器热交换器和第二冷凝器。 热交换器与发热结构热连通。 热交换器具有入口和出口。 入口可操作以将基本上以液体形式的流体冷却剂接收到热交换器中,并且出口可操作以将至少部分为蒸气形式的流体冷却剂分配出热交换器。 第一结构将基本上以液体形式的流体冷却剂的流动引导到热交换器。 从发热结构传递到流体冷却剂的热能导致基本上呈液体形式的流体冷却剂在热交换器中沸腾和汽化。 冷凝器热交换器至少部分地接收来自热交换器的蒸汽形式的流体冷却剂流,并将至少一部分流体冷却剂内的热能传递到散热器。 第二冷凝器帮助冷凝器热交换器将流体冷却剂内的热能的至少一部分转移离开流体冷却剂。 当散热器达到不期望的温度时,第二冷凝器被选择性地激活。
    • 6. 发明授权
    • Method of and apparatus for temperature conditioning of matter
    • 物质温度调节方法及装置
    • US4704804A
    • 1987-11-10
    • US589260
    • 1984-03-13
    • William G. WyattJack C. Page
    • William G. WyattJack C. Page
    • F26B21/06F26B5/04F26B3/00F26B19/00
    • F26B21/06
    • Method of and apparatus for temperature conditioning of matter of the type wherein matter to be conditioned is exposed to a vapor within a vessel for select heating and/or moisture absorption or desiccation. The system includes selectively providing a mixture of condensible and noncondensible gases while controlling the enthalpy, partial pressure and dew point thereof. The gas mixture is delivered to a vessel and interacted with matter disposed therein. The temperature of the matter is brought to the approximate dew point of the condensible and noncondensible gas mixture. In this manner, both the ultimate temperature and moisture content of the matter to be conditioned may be controlled by selectively controlling the aforesaid parameters of enthalpy, partial pressure and dew point. Control of the aforesaid parameters may likewise be affected by controlling the vessel pressure and the rate at which energy is supplied to the condensible and noncondensible gas mixture.
    • 用于物质的温度调节的方法和装置,其中要调节的物质暴露于容器内的蒸汽以进行选择性加热和/或吸湿或干燥。 该系统包括选择性地提供可冷凝和不可冷凝气体的混合物,同时控制其焓,分压和露点。 将气体混合物输送到容器中并与其中设置的物质相互作用。 该物质的温度达到可冷凝和不可冷凝气体混合物的大致露点。 以这种方式,可以通过选择性地控制上述焓,分压和露点参数来控制要调理的物质的最终温度和水分含量。 上述参数的控制同样可以通过控制容器压力和将能量供应到可冷凝和不可冷凝气体混合物的速率来影响。
    • 7. 发明申请
    • Systems and Methods for Cooling a Computing Component in a Computing Rack
    • 在计算机架中冷却计算组件的系统和方法
    • US20090244830A1
    • 2009-10-01
    • US12406645
    • 2009-03-18
    • William G. WyattRichard M. Weber
    • William G. WyattRichard M. Weber
    • G06F1/20
    • H05K7/20809
    • According to one embodiment, a system for cooling computing components includes a computing rack housing a plurality of computing components of a computing system. A heat absorbing plate is disposed in and removable from the computing rack. The heat absorbing plate is thermally coupled to an outer surface of a computing component and comprises a plurality of walls defining a cavity containing a two-phase coolant. The cavity has a continuous volume allowing the two-phase coolant to absorb heat from the computing component and to transfer the heat to a heat transfer mechanism. The computing rack has a sidewall that is thermally coupled to the heat absorbing plate and comprises the heat transfer mechanism, which is operable to receive the heat transferred from the heat absorbing plate.
    • 根据一个实施例,用于冷却计算组件的系统包括容纳计算系统的多个计算组件的计算机架。 吸热板设置在计算机架中并从计算机架上移除。 吸热板热耦合到计算部件的外表面,并且包括限定包含两相冷却剂的空腔的多个壁。 空腔具有允许两相冷却剂从计算部件吸收热量并将热量传递到热传递机构的连续容积。 计算机架具有热耦合到吸热板的侧壁,并且包括传热机构,其可操作以接收从吸热板传递的热量。
    • 9. 发明申请
    • System and Method for Cooling Using Two Separate Coolants
    • 使用两种独立冷却液进行冷却的系统和方法
    • US20090101311A1
    • 2009-04-23
    • US11876301
    • 2007-10-22
    • Richard M. WeberWilliam G. WyattKerrin A. Rummel
    • Richard M. WeberWilliam G. WyattKerrin A. Rummel
    • F28D15/00
    • F25B25/005H01L23/473H01L2924/0002H01Q1/02H05K7/20281H01L2924/00
    • According to one embodiment, a cooling system for a heat-generating structure includes a first cooling loop that directs a flow of a first fluid coolant from a heat-generating structure to a first heat exchanger. The system also includes a second cooling loop that directs a flow of a second fluid coolant from the first heat exchanger to a second heat exchanger. The first heat exchanger receives thermal energy from the first fluid coolant and transfers at least a portion of the thermal energy to the second fluid coolant. The first fluid coolant has a specific heat and a mass flow rate, and the second fluid coolant has a specific heat and a mass flow rate. A product of the specific heat and the mass flow rate of the first fluid coolant is greater than a product of the specific heat and the mass flow rate of the second fluid coolant.
    • 根据一个实施例,用于发热结构的冷却系统包括将第一流体冷却剂从发热结构流向第一热交换器的第一冷却回路。 该系统还包括第二冷却回路,其将来自第一热交换器的第二流体冷却剂的流引导到第二热交换器。 第一热交换器从第一流体冷却剂接收热能并将至少一部分热能传递到第二流体冷却剂。 第一流体冷却剂具有比热和质量流量,第二流体冷却剂具有比热和质量流量。 第一流体冷却剂的比热和质量流量的乘积大于第二流体冷却剂的比热和质量流量的乘积。
    • 10. 发明授权
    • Method and system for cryogenic cooling
    • 低温冷却方法与系统
    • US07415830B2
    • 2008-08-26
    • US11217142
    • 2005-08-31
    • William G. WyattMorris E. Finneburgh
    • William G. WyattMorris E. Finneburgh
    • F25B19/00F25B9/00
    • G01J5/061F25D19/00
    • According to one embodiment, a method for improving heat transfer between a cold finger of a cryogenic cooler and a Dewar includes forming an annulus between the cold finger of the cryogenic cooler and the Dewar by inserting the cold finger into the Dewar. The cold finger has a first end and a second end. The method also includes inhibiting the formation of convective currents within the annulus in a direction between the first end and the second end. According to another embodiment of the invention, the cooling system includes a cryogenic cooler that includes a cooling section operable to generate cooling fluid and a cold finger operable to receive the cooling fluid. The cooling system also includes a Dewar formed with a void region coupled to an infrared detector. The cold finger is positioned within the void region of the Dewar creating an annulus. The cooling system also includes at least one obstruction disposed within the annulus and operable to inhibit the formation of convective currents in a direction along a length of the cold finger.
    • 根据一个实施例,一种用于改善低温冷却器的冷指与杜瓦之间的热传递的方法包括通过将冷指插入杜瓦来在低温冷却器的冷指和杜瓦之间形成环。 冷手指具有第一端和第二端。 该方法还包括在第一端和第二端之间的方向上抑制环形空间内的对流电流的形成。 根据本发明的另一个实施例,冷却系统包括低温冷却器,其包括可操作以产生冷却流体的冷却部分和可操作以接收冷却流体的冷指状物。 冷却系统还包括形成有与红外检测器耦合的空隙区域的杜瓦。 冷指状物位于杜瓦的空隙区域中,形成环状物。 冷却系统还包括设置在环形空间内的至少一个障碍物,并且可操作以阻止沿着冷手指的长度方向形成对流电流。