专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US09383145B2 System and method of boiling heat transfer using self-induced coolant transport and impingements 有权
标题翻译：使用自身引导的冷却剂输送和冲击进行沸腾传热的系统和方法
公开(公告)号：US09383145B2
公开(公告)日：2016-07-05
申请号：US12208641
申请日：2008-09-11
申请人： Richard M. Weber , Kerrin A. Rummel , Albert P. Payton
发明人： Richard M. Weber , Kerrin A. Rummel , Albert P. Payton
IPC分类号： H01L23/467 , F28D15/02 , F28F3/02 , H01L23/367 , H01L23/427 , H01L23/473 , F28F3/12
CPC分类号： F28D15/0266 , F28F3/022 , F28F3/12 , H01L23/3677 , H01L23/427 , H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： According to one embodiment of the invention, a cooling system for a heat-generating structure comprises a chamber and structure disposed within the chamber. The chamber has an inlet and an outlet. The inlet receives fluid coolant into the chamber substantially in the form of a liquid. The outlet dispenses the fluid coolant out of the chamber at least partially in the form of a vapor. The structure disposed within the chamber receive thermal energy from the heat generating structure and transfers at least a portion of the thermal energy to the fluid coolant. The thermal energy from the heat-generating structure causes at least a portion of the fluid coolant substantially in the form of a liquid to boil and effuse vapor upon contact with a portion of the structure. The effusion of vapor creates a self-induced flow in the chamber. The self-induced flow distributes non-vaporized fluid coolant substantially in the form of a liquid to other portions of the structure.
摘要翻译：根据本发明的一个实施例，用于发热结构的冷却系统包括设置在室内的室和结构。腔室有入口和出口。入口将基本上以液体形式的流体冷却剂接收到室中。出口将流体冷却剂至少部分地以蒸气形式排出室外。设置在室内的结构接收来自发热结构的热能，并将至少一部分热能传递到流体冷却剂。来自发热结构的热能导致基本上为液体形式的流体冷却剂的至少一部分在与结构的一部分接触时沸腾并喷射蒸气。蒸汽的积液在室内产生自身的流动。自感应流将基本上以液体形式的非汽化流体冷却剂分配到该结构的其它部分。

2. 发明授权

US08698691B2 Internal cooling system for a radome 有权
标题翻译：天线罩的内部冷却系统
公开(公告)号：US08698691B2
公开(公告)日：2014-04-15
申请号：US12511667
申请日：2009-07-29
申请人： Kevin W. Chen , Brandon H. Allen , Kerrin A. Rummel , Gary L. Seiferman , Richard M. Weber , William P. Harokopus
发明人： Kevin W. Chen , Brandon H. Allen , Kerrin A. Rummel , Gary L. Seiferman , Richard M. Weber , William P. Harokopus
IPC分类号： H01Q1/42 , H05K7/20 , F28D15/00
CPC分类号： H01Q1/422 , H01Q1/002 , H01Q1/02
摘要： According to one embodiment, a radome includes two dielectric layers separated by an internal layer. The internal layer is configured with an internal cooling system including a fluid channel that receives a fluid through an inlet port, conducts heat from the radome to the fluid, and exhausts the heated fluid through an outlet port.
摘要翻译：根据一个实施例，天线罩包括由内层隔开的两个电介质层。内层构造有内部冷却系统，该内部冷却系统包括通过入口接收流体的流体通道，将热量从天线罩传导到流体，并通过出口排出加热的流体。

3. 发明申请

US20100206523A1 INTERNAL COOLING SYSTEM FOR A RADOME 有权
标题翻译：内部冷却系统
公开(公告)号：US20100206523A1
公开(公告)日：2010-08-19
申请号：US12511667
申请日：2009-07-29
申请人： Kevin W. Chen , Brandon H. Allen , Kerrin A. Rummel , Gary L. Seiferman , Richard M. Weber , William P. Harokopus
发明人： Kevin W. Chen , Brandon H. Allen , Kerrin A. Rummel , Gary L. Seiferman , Richard M. Weber , William P. Harokopus
IPC分类号： F28D15/00 , H01Q1/42
CPC分类号： H01Q1/422 , H01Q1/002 , H01Q1/02
摘要： According to one embodiment, a radome includes two dielectric layers separated by an internal layer. The internal layer is configured with an internal cooling system including a fluid channel that receives a fluid through an inlet port, conducts heat from the radome to the fluid, and exhausts the heated fluid through an outlet port.
摘要翻译：根据一个实施例，天线罩包括由内层隔开的两个电介质层。内层构造有内部冷却系统，该内部冷却系统包括通过入口接收流体的流体通道，将热量从天线罩传导到流体，并通过出口排出加热的流体。

4. 发明授权

US07940524B2 Remote cooling of a phased array antenna 有权
标题翻译：相控阵天线的远程冷却
公开(公告)号：US07940524B2
公开(公告)日：2011-05-10
申请号：US11865475
申请日：2007-10-01
申请人： Kerrin A. Rummel , Gregory Schaefer , Kevin W. Chen , Brandon H. Allen , Daniel J. Weissman
发明人： Kerrin A. Rummel , Gregory Schaefer , Kevin W. Chen , Brandon H. Allen , Daniel J. Weissman
IPC分类号： H05K7/20
CPC分类号： H01Q1/02 , H01Q3/26
摘要： A self-contained cooling system for a phased array antenna includes a cooling structure, a heat exchanger, and a pump for circulating a fluid coolant around a coolant loop. The cooling system receives power from a remote power source. The cooling structure includes a plurality of coolant inlet pipes, a plurality of coolant outlet pipes, and a plurality of cooling platforms. Each of the cooling platforms has a coolant channel that begins at one of the plurality of coolant inlet pipes, terminates at one of the plurality of coolant outlet pipes, and provides a flow path for a fluid coolant. The cooling structure further includes at least one base plate releasably mounted to at least one of the plurality of cooling platforms. One or more antenna elements associated with the phased array antenna are mounted on the base plate releasably mounted to at least one of the plurality of cooling platforms. The flow of the fluid coolant through the coolant channel dissipates thermal energy produced by the one or more antenna elements.
摘要翻译：用于相控阵天线的独立冷却系统包括冷却结构，热交换器和用于使流体冷却剂围绕冷却剂回路循环的泵。冷却系统从远程电源接收电力。冷却结构包括多个冷却剂入口管，多个冷却剂出口管和多个冷却平台。每个冷却平台具有从多个冷却剂入口管中的一个开始的冷却剂通道，终止于多个冷却剂出口管中的一个，并为流体冷却剂提供流动路径。冷却结构还包括至少一个可释放地安装到多个冷却平台中的至少一个的底板。与相控阵天线相关联的一个或多个天线元件安装在可释放地安装到多个冷却平台中的至少一个的基座上。流体冷却剂通过冷却剂通道的流动消散了由一个或多个天线元件产生的热能。

5. 发明授权

US08490418B2 Method and apparatus for cooling electronics with a coolant at a subambient pressure 有权
标题翻译：用于在低于环境压力下用冷却剂冷却电子设备的方法和装置
公开(公告)号：US08490418B2
公开(公告)日：2013-07-23
申请号：US13043675
申请日：2011-03-09
申请人： Richard M. Weber , William G. Wyatt , Kerrin A. Rummel
发明人： Richard M. Weber , William G. Wyatt , Kerrin A. Rummel
IPC分类号： F25B1/00
CPC分类号： F25B23/006 , F25B43/00 , F28D15/0266 , F28D2021/0031 , F28F23/00 , H01L2924/0002 , H01Q1/02 , H01L2924/00
摘要： According to one embodiment of the invention, a method is provided for cooling heat-generating structure disposed in an environment having an ambient pressure. The heat-generating structure includes electronics. The method includes providing a coolant, reducing a pressure of the coolant to a subambient pressure at which the coolant has a boiling temperature less than a temperature of the heat-generating structure, and bringing the heat-generating structure and the coolant at the subambient pressure into contact with one another, so that the coolant boils and vaporizes to thereby absorb heat from the heat-generating structure. In a more particular embodiment the coolant is either pure water or pure methanol with an electrical resistivity level of greater than one million Ohms-cm. Further, in another particular embodiment the method includes filtering the coolant to maintain its purity above a particular level.
摘要翻译：根据本发明的一个实施例，提供一种用于冷却设置在具有环境压力的环境中的发热结构的方法。发热结构包括电子产品。该方法包括提供冷却剂，将冷却剂的压力降低到冷却剂的沸腾温度低于发热结构的温度的次环境压力，并使发热结构和冷却剂处于低于环境压力彼此接触，使得冷却剂沸腾并蒸发，从而从发热结构吸收热量。在更具体的实施方案中，冷却剂是纯水或具有大于100万欧姆 - 厘米的电阻率水平的纯甲醇。此外，在另一个具体实施方案中，该方法包括过滤冷却剂以将其纯度保持在特定水平以上。

6. 发明授权

US06959753B1 Construction of phase change material embedded electronic circuit boards and electronic circuit board assemblies using porous and fibrous media 失效
标题翻译：使用多孔和纤维介质构建相变材料嵌入式电子电路板和电子电路板组件
公开(公告)号：US06959753B1
公开(公告)日：2005-11-01
申请号：US08675280
申请日：1996-07-01
申请人： Richard M. Weber , Kerrin A. Rummel
发明人： Richard M. Weber , Kerrin A. Rummel
IPC分类号： F28D20/02 , H01L23/373 , H01L23/427 , F28D15/00
CPC分类号： H01L23/4275 , F28D20/02 , H01L23/3733 , H01L2924/0002 , Y02E60/145 , Y10S165/042 , Y10S165/901 , Y10S165/902 , Y10S165/905 , Y10S165/907 , H01L2924/00
摘要： A heat sink which comprises an enclosure having a highly thermally conductive surface region and defining an enclosed cavity. A porous, highly thermally conductive material is disposed in the cavity, preferably homogeneously therein, and is thermally coupled to the thermally conductive surface. A phase change material changing from its initial phase, generally solid, to its final phase, generally liquid, responsive to the absorption of heat is disposed in the enclosed cavity and in the porous material. In accordance with a first embodiment, the highly thermally conductive surface region is preferably aluminum and the porous medium is a highly thermally conductive porous medium, preferably aluminum. In accordance with a second embodiment, the thermally conductive surface is composed of highly thermally conductive fibers disposed in a matrix and the porous material is a plurality of the thermally conductive fibers extending from the thermally conductive surface into the cavity. The highly thermally conductive fibers are preferably graphite and the matrix is preferably an epoxy.
摘要翻译：一种散热器，其包括具有高导热表面区域并限定封闭空腔的外壳。多孔的，高导热的材料优选地设置在空腔中，优选地在其中并且热耦合到导热表面。从其初始阶段（通常为固体）改变到其最终阶段（通常是液体）的响应于吸收热的相变材料设置在封闭空腔和多孔材料中。根据第一实施例，高导热表面区域优选为铝，多孔介质为高导热性多孔介质，优选为铝。根据第二实施例，导热表面由设置在基体中的高导热纤维构成，多孔材料是从导热表面延伸到空腔中的多个导热纤维。高导热性纤维优选为石墨，基质优选为环氧树脂。

7. 发明申请

US20110157828A1 Method And Apparatus for Cooling Electronics with a Coolant at a Subambient Pressure 有权
标题翻译：在低压下用冷却液冷却电子的方法和装置
公开(公告)号：US20110157828A1
公开(公告)日：2011-06-30
申请号：US13043675
申请日：2011-03-09
申请人： Richard M. Weber , William G. Wyatt , Kerrin A. Rummel
发明人： Richard M. Weber , William G. Wyatt , Kerrin A. Rummel
IPC分类号： H05K7/20 , F28D15/00 , H05K7/00
CPC分类号： F25B23/006 , F25B43/00 , F28D15/0266 , F28D2021/0031 , F28F23/00 , H01L2924/0002 , H01Q1/02 , H01L2924/00
摘要： According to one embodiment of the invention, a method is provided for cooling heat-generating structure disposed in an environment having an ambient pressure. The heat-generating structure includes electronics. The method includes providing a coolant, reducing a pressure of the coolant to a subambient pressure at which the coolant has a boiling temperature less than a temperature of the heat-generating structure, and bringing the heat-generating structure and the coolant at the subambient pressure into contact with one another, so that the coolant boils and vaporizes to thereby absorb heat from the heat-generating structure. In a more particular embodiment the coolant is either pure water or pure methanol with an electrical resistivity level of greater than one million Ohms-cm. Further, in another particular embodiment the method includes filtering the coolant to maintain its purity above a particular level.
摘要翻译：根据本发明的一个实施例，提供一种用于冷却设置在具有环境压力的环境中的发热结构的方法。发热结构包括电子产品。该方法包括提供冷却剂，将冷却剂的压力降低到冷却剂的沸腾温度低于发热结构的温度的次环境压力，并使发热结构和冷却剂处于低于环境压力彼此接触，使得冷却剂沸腾并蒸发，从而从发热结构吸收热量。在更具体的实施方案中，冷却剂是纯水或具有大于100万欧姆 - 厘米的电阻率水平的纯甲醇。此外，在另一个具体实施方案中，该方法包括过滤冷却剂以将其纯度保持在特定水平以上。

8. 发明授权

US07908874B2 Method and apparatus for cooling electronics with a coolant at a subambient pressure 有权
标题翻译：用于在低于环境压力下用冷却剂冷却电子设备的方法和装置
公开(公告)号：US07908874B2
公开(公告)日：2011-03-22
申请号：US11381297
申请日：2006-05-02
申请人： Richard M. Weber , William G. Wyatt , Kerrin A. Rummel
发明人： Richard M. Weber , William G. Wyatt , Kerrin A. Rummel
IPC分类号： F25D15/00
CPC分类号： F25B23/006 , F25B43/00 , F28D15/0266 , F28D2021/0031 , F28F23/00 , H01L2924/0002 , H01Q1/02 , H01L2924/00
摘要： According to one embodiment of the invention, a method is provided for cooling heat-generating structure disposed in an environment having an ambient pressure. The heat-generating structure includes electronics. The method includes providing a coolant, reducing a pressure of the coolant to a subambient pressure at which the coolant has a boiling temperature less than a temperature of the heat-generating structure, and bringing the heat-generating structure and the coolant at the subambient pressure into contact with one another, so that the coolant boils and vaporizes to thereby absorb heat from the heat-generating structure. In a more particular embodiment the coolant is either pure water or pure methanol with an electrical resistivity level of greater than one million Ohms-cm. Further, in another particular embodiment the method includes filtering the coolant to maintain its purity above a particular level.
摘要翻译：根据本发明的一个实施例，提供一种用于冷却设置在具有环境压力的环境中的发热结构的方法。发热结构包括电子产品。该方法包括提供冷却剂，将冷却剂的压力降低到冷却剂的沸腾温度低于发热结构的温度的次环境压力，并使发热结构和冷却剂处于低于环境压力彼此接触，使得冷却剂沸腾并蒸发，从而从发热结构吸收热量。在更具体的实施方案中，冷却剂是纯水或具有大于100万欧姆 - 厘米的电阻率水平的纯甲醇。此外，在另一个具体实施方案中，该方法包括过滤冷却剂以将其纯度保持在特定水平以上。

9. 发明申请

US20090211277A1 SYSTEM AND METHOD FOR COOLING A HEAT GENERATING STRUCTURE 有权
标题翻译：用于冷却发热结构的系统和方法
公开(公告)号：US20090211277A1
公开(公告)日：2009-08-27
申请号：US12036468
申请日：2008-02-25
申请人： Kerrin A. Rummel , Kevin W. Chen
发明人： Kerrin A. Rummel , Kevin W. Chen
IPC分类号： F25B41/00 , F25B39/02
CPC分类号： F28D15/0275 , F28D2021/0019 , F28D2021/0077
摘要： According to one embodiment of the disclosure, a cooling system for a heat generating structure comprises a first cooling segment and a second cooling segment. The first cooling segment and the second cooling segment each respectively comprise a cooling segment conduit and at least one cooling segment tube. The cooling segment conduits are operable to receive a fluid coolant and dispense of the fluid coolant after the fluid coolant has received thermal energy. The at least one cooling segment tubes are in thermal communication with both the cooling segment conduits and the heat generating structure. The at least one cooling segment tubes have a cooling fluid operable to transfer thermal energy from the heat generating structure to the cooling segment conduits. The cooling segment conduits transfer thermal energy from the cooling fluid to the fluid coolant. A heat transfer rate associated with the first cooling segment is substantially similar to a heat transfer rate associated with the second cooling segment.
摘要翻译：根据本公开的一个实施例，用于发热结构的冷却系统包括第一冷却段和第二冷却段。第一冷却段和第二冷却段各自分别包括冷却段管道和至少一个冷却段管。冷却段管道可操作以在流体冷却剂已经接收热能之后接收流体冷却剂并分配流体冷却剂。至少一个冷却段管与冷却段导管和发热结构热连通。至少一个冷却段管具有可操作以将热能从发热结构传递到冷却段导管的冷却流体。冷却段导管将热能从冷却流体传递到流体冷却剂。与第一冷却段相关联的传热速率基本上类似于与第二冷却段相关联的传热速率。

10. 发明授权

US07934386B2 System and method for cooling a heat generating structure 有权
标题翻译：用于冷却发热结构的系统和方法
公开(公告)号：US07934386B2
公开(公告)日：2011-05-03
申请号：US12036468
申请日：2008-02-25
申请人： Kerrin A. Rummel , Kevin W. Chen
发明人： Kerrin A. Rummel , Kevin W. Chen
IPC分类号： F25D17/02
CPC分类号： F28D15/0275 , F28D2021/0019 , F28D2021/0077
摘要： According to one embodiment of the disclosure, a cooling system for a heat generating structure comprises a first cooling segment and a second cooling segment. The first cooling segment and the second cooling segment each respectively comprise a cooling segment conduit and at least one cooling segment tube. The cooling segment conduits are operable to receive a fluid coolant and dispense of the fluid coolant after the fluid coolant has received thermal energy. The at least one cooling segment tubes are in thermal communication with both the cooling segment conduits and the heat generating structure. The at least one cooling segment tubes have a cooling fluid operable to transfer thermal energy from the heat generating structure to the cooling segment conduits. The cooling segment conduits transfer thermal energy from the cooling fluid to the fluid coolant. A heat transfer rate associated with the first cooling segment is substantially similar to a heat transfer rate associated with the second cooling segment.
摘要翻译：根据本公开的一个实施例，用于发热结构的冷却系统包括第一冷却段和第二冷却段。第一冷却段和第二冷却段各自分别包括冷却段管道和至少一个冷却段管。冷却段管道可操作以在流体冷却剂已经接收热能之后接收流体冷却剂并分配流体冷却剂。至少一个冷却段管与冷却段导管和发热结构热连通。至少一个冷却段管具有可操作以将热能从发热结构传递到冷却段导管的冷却流体。冷却段导管将热能从冷却流体传递到流体冷却剂。与第一冷却段相关联的传热速率基本上类似于与第二冷却段相关联的传热速率。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式