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    • 2. 发明申请
    • System, method, and apparatus for improved packaging of data tape cartridges
    • 用于改进数据磁带盒封装的系统,方法和装置
    • US20050006270A1
    • 2005-01-13
    • US10618028
    • 2003-07-11
    • Dennis ByrneDavid DavisJames Karp
    • Dennis ByrneDavid DavisJames Karp
    • G11B23/023G11B33/08B65D85/30
    • G11B23/0236G11B33/08
    • A plastic cartridge holder for restraining and protecting data tape cartridges during shipping has individual cartridge slots with corrugated padding between adjacent slots and on the sides of the slots to decouple the cartridges from virtually any shock event. The cartridges do not separate or fall apart from each other when the external bundling material or shrink-wrapping is removed. The corrugations and slots hold the cartridges in place with a retention force that is firm yet comfortable for the user to overcome. The slots on the beveled corners allow individual cartridge actuation of access doors for inspection of the tape leader pins before the cartridges are removed. The opposite side of the holder has a full, cartridge-length access to the individual slots. The holder also has an access slot to allow the user to manually push all of the cartridges out of the holder simultaneously.
    • 用于在运输期间限制和保护数据带盒的塑料盒保持架具有在相邻狭槽之间和槽的侧面上的波纹填充物的单独的盒式插槽,以将盒与几乎任何冲击事件解耦。 当外部捆扎材料或收缩包装被去除时,墨盒不会彼此分离或分离。 波纹和狭槽将墨盒固定在适当位置,并具有坚固而舒适的使用者克服的保持力。 倾斜角上的槽口可以在拆卸墨盒之前,单独的墨盒驱动检修门,以检查磁带引导销。 保持架的相对侧有一个完整的,长度可达到单个插槽长度的插槽。 支架还具有一个进出口,允许用户手动将所有墨盒同时推出保持架。
    • 5. 发明授权
    • Operating a programmable integrated circuit with functionally equivalent configuration bitstreams
    • 操作具有功能等效配置比特流的可编程集成电路
    • US08519741B1
    • 2013-08-27
    • US13543508
    • 2012-07-06
    • James KarpMichael J. Hart
    • James KarpMichael J. Hart
    • H03K19/173
    • H03K19/1776G06F17/5054H03K19/17736
    • Approaches for operating a programmable integrated circuit (IC) are disclosed. One configuration bitstream of two or more configuration bitstreams is selected. Each configuration bitstream implements a functionally equivalent circuit on the programmable IC and programs a respective subset of pass gates of the programmable IC. Each subset of pass gates programmed by the configuration bitstreams is disjoint from each other subset of pass gates. The programmable IC, which is defect-free, is configured with the selected configuration bitstream. The defect-free programmable IC is then operated for a period of time. The selecting, configuring and operating are repeated, and for successive selecting operations, different ones of the configuration bitstreams are selected.
    • 公开了用于操作可编程集成电路(IC)的方法。 选择两个或多个配置比特流的一个配置比特流。 每个配置比特流在可编程IC上实现功能上等效的电路,并对可编程IC的相应子集的通道进行编程。 由配置比特流编程的每个通道的子集与传递门的每个其他子集不相交。 无缺陷的可编程IC配置有所选配置比特流。 然后,无缺陷的可编程IC运行一段时间。 重复选择,配置和操作,并且对于连续选择操作,选择不同的配置比特流。
    • 8. 发明授权
    • Integrated circuit device with low capacitance and high thermal conductivity interface
    • 具有低电容和高导热性界面的集成电路器件
    • US08174112B1
    • 2012-05-08
    • US12544850
    • 2009-08-20
    • James KarpVassili Kireev
    • James KarpVassili Kireev
    • H01L23/34
    • H01L23/42H01L23/10H01L2224/16225H01L2224/73253H01L2924/15311
    • An integrated circuit device includes an integrated circuit formed in a semiconductor die and an integrated circuit package containing the semiconductor die. The integrated circuit package includes a thermal interface material substantially between the semiconductor die and a heat spreader of the integrated circuit device for conducting heat from the semiconductor die to the heat spreader. The thermal interface material includes diamond particles and has a thickness selected to reduce capacitance between the semiconductor die and the heat spreader over that of a conventional integrated circuit device without reducing the rate of thermal conduction from the semiconductor die to the heat spreader. As a result, the integrated circuit device has improved electrostatic discharge immunity.
    • 集成电路器件包括形成在半导体管芯中的集成电路和包含半导体管芯的集成电路封装。 集成电路封装包括基本上在半导体管芯和用于将热量从半导体管芯传导到散热器的集成电路器件的散热器之间的热界面材料。 热界面材料包括金刚石颗粒,并且具有选择的厚度以减小半导体管芯和散热器之间的电容,而不降低从半导体管芯到散热器的热传导速率。 结果,集成电路器件具有改进的静电放电抗扰度。