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1. 发明授权

US5666722A Method of manufacturing printed circuit boards 失效
标题翻译：制造印刷电路板的方法
公开(公告)号：US5666722A
公开(公告)日：1997-09-16
申请号：US403445
申请日：1995-03-15
申请人： Wilhelm Tamm , Walter Olbrich , Siegfrid Dippon , Michael Weitmann , Si-Ty Lam
发明人： Wilhelm Tamm , Walter Olbrich , Siegfrid Dippon , Michael Weitmann , Si-Ty Lam
IPC分类号： B23K26/04 , B23K26/067 , H05K1/03 , H05K3/00 , H05K3/04 , H05K3/10 , H05K3/18 , H05K3/38 , H05K3/42 , H05K3/02
CPC分类号： B23K26/0673 , B23K26/04 , B23K26/067 , H05K3/045 , H05K3/107 , H05K3/188 , H05K1/036 , H05K2201/0329 , H05K2201/0347 , H05K2201/0376 , H05K2201/09036 , H05K2203/025 , H05K3/0023 , H05K3/0032 , H05K3/105 , H05K3/108 , H05K3/388 , H05K3/426 , Y10T29/49131 , Y10T29/49156 , Y10T29/49165
摘要： A printed circuit board is made by producing recesses and/or holes in an electric insulating substrate by laser ablation. The recesses correspond to a desired pattern of conductor structures and/or holes. Conductive material is then deposited on substantially an entire face of the substrate. Conductive material is then removed from the substrate outside the desired pattern of conductor structures and/or holes.
摘要翻译：通过激光烧蚀在电绝缘基板上制造凹部和/或孔来制造印刷电路板。凹部对应于导体结构和/或孔的期望图案。然后将导电材料沉积在基底的基本上整个表面上。然后将导电材料从导体结构和/或孔的期望图案外部的基板移除。

2. 发明授权

US5676866A Apparatus for laser machining with a plurality of beams 失效
标题翻译：具有多个光束的激光加工装置
公开(公告)号：US5676866A
公开(公告)日：1997-10-14
申请号：US422577
申请日：1995-04-14
申请人： Joachim Schulte in den Baumen , Robert Grub , Herbert Gross , Jurgen Schweizer , Hans-Jurgen Kahlert , Siegfrid Dippon , Wilhelm Tamm , Si-Ty Lam , Heinrich Endert
发明人： Joachim Schulte in den Baumen , Robert Grub , Herbert Gross , Jurgen Schweizer , Hans-Jurgen Kahlert , Siegfrid Dippon , Wilhelm Tamm , Si-Ty Lam , Heinrich Endert
IPC分类号： B23K26/04 , B23K26/06 , B23K26/067 , B23K26/42 , B23K101/42 , H05K1/03 , H05K3/00 , H05K3/04 , H05K3/10 , H05K3/18 , H05K3/38 , H05K3/42
CPC分类号： B23K26/0673 , B23K26/04 , B23K26/0604 , B23K26/067 , B23K26/702 , H05K3/045 , H05K3/107 , H05K3/188 , H05K1/036 , H05K2201/0329 , H05K2201/0347 , H05K2201/0376 , H05K2201/09036 , H05K2203/025 , H05K2203/107 , H05K3/0017 , H05K3/0023 , H05K3/0032 , H05K3/105 , H05K3/108 , H05K3/388 , H05K3/426
摘要： An apparatus for laser machining by creating a plurality of discrete and separate beams which are sent to a deflecting device including a support and a plurality of individual elements that act independently and are individually controlled to machine different points on the workpiece simultaneously.
摘要翻译：一种用于激光加工的设备，其通过产生多个离散和分离的梁，其被发送到偏转装置，所述偏转装置包括支撑件和独立地起作用并且被单独地控制以在所述工件上同时加工不同点的多个单独元件。

3. 发明授权

US08525646B2 Miniature RFID tag 有权
标题翻译：微型RFID标签
公开(公告)号：US08525646B2
公开(公告)日：2013-09-03
申请号：US12763919
申请日：2010-04-20
申请人： Wilhelm Tamm , Lior Shtram , Peter Sartorius
发明人： Wilhelm Tamm , Lior Shtram , Peter Sartorius
IPC分类号： H04Q5/22 , H01L21/00
CPC分类号： H04Q5/22 , G06K19/07749 , G06K19/07758 , G06K19/07779 , G06K19/07783 , H05K1/165 , H05K3/107 , H05K3/426 , H05K2201/09036
摘要： A technique for making an RFID tag that includes creating recesses or trenches in an insulated substrate. Conductive traces are created in the trenches so as to create an inductor coil for the RFID tag.
摘要翻译：一种用于制造RFID标签的技术，其包括在绝缘基板中产生凹槽或沟槽。在沟槽中形成导电迹线，以便为RFID标签创建电感线圈。

4. 发明授权

US6035527A Method for the production of printed circuit boards 失效
标题翻译：生产印刷电路板的方法
公开(公告)号：US6035527A
公开(公告)日：2000-03-14
申请号：US854468
申请日：1997-05-12
申请人： Wilhelm Tamm
发明人： Wilhelm Tamm
IPC分类号： H05K3/00 , H05K3/02 , H05K3/04 , H05K3/10 , H05K3/14 , H05K3/18 , H05K3/42 , H01K3/10
CPC分类号： H05K3/185 , H05K3/027 , H05K3/048 , H05K3/107 , H05K2201/0376 , H05K2201/09036 , H05K3/0032 , H05K3/108 , H05K3/146 , H05K3/426 , Y10T29/49155 , Y10T29/49165
摘要： A method for the production of printed circuit boards comprises the steps of producing recesses (2, 3, 4, 5) and/or through holes (2a) in a substrate (1) made from insulating material, in particular by means of laser-ablation, wherein the recesses and/or through holes correspond to the desired structure of conductive tracks and/or plated through holes; introducing a base layer (6) on one or both sides of the substrate (1); and introducing a conductive material (7) onto the base layer (6) which is catalytic and/or activating relative to the conductive material (7). The base layer (6) is selectively removed from the substrate (1), except in the recesses and/or in the through holes, by means of laser-ablation prior to introduction of the conductive material (7). Processing of the surface of the conductive material, the base layer or of the substrate is no longer necessary.
摘要翻译：制造印刷电路板的方法包括以下步骤：在由绝缘材料制成的基片（1）中产生凹陷（2,3,4,5）和/或通孔（2a），特别是通过激光 - 消融，其中凹部和/或通孔对应于导电轨道和/或电镀通孔的期望结构; 在衬底（1）的一侧或两侧上引入基底层（6）; 并将导电材料（7）引入到相对于导电材料（7）催化和/或激活的基层（6）上。在引入导电材料（7）之前，通过激光烧蚀，除了凹部和/或通孔中，从基板（1）选择性地去除基底层（6）。不再需要对导电材料，基底层或基底的表面进行处理。

5. 发明申请

US20100308968A1 MINIATURE RFID TAG 有权
标题翻译：微型RFID标签
公开(公告)号：US20100308968A1
公开(公告)日：2010-12-09
申请号：US12763919
申请日：2010-04-20
申请人： Wilhelm Tamm , Lior Shtram , Peter Sartorius
发明人： Wilhelm Tamm , Lior Shtram , Peter Sartorius
IPC分类号： H04Q5/22 , B29C35/08
CPC分类号： H04Q5/22 , G06K19/07749 , G06K19/07758 , G06K19/07779 , G06K19/07783 , H05K1/165 , H05K3/107 , H05K3/426 , H05K2201/09036
摘要： A technique for making an RFID tag that includes creating recesses or trenches in an insulated substrate. Conductive traces are created in the trenches so as to create an inductor coil for the RFID tag.
摘要翻译：一种用于制造RFID标签的技术，其包括在绝缘基板中产生凹槽或沟槽。在沟槽中形成导电迹线，以便为RFID标签创建电感线圈。

6. 发明授权

US06147505A Adapter arrangement for electrically testing printed circuit boards 失效
标题翻译：用于电测试印刷电路板的适配器布置
公开(公告)号：US06147505A
公开(公告)日：2000-11-14
申请号：US997008
申请日：1997-12-23
申请人： Albert Ott , Wilhelm Tamm , Steffen Laur , Volker Harr
发明人： Albert Ott , Wilhelm Tamm , Steffen Laur , Volker Harr
IPC分类号： G01R1/073 , G01R31/02 , G01R31/28 , H05K3/00
CPC分类号： G01R1/07328
摘要： An adapter arrangement for electrically testing printed circuit boards consists of two probe adapters with a uniform grid separation of the probes and two translator foils on whose sides facing the probe adapters there are contact areas with the pitch of the probe adapter. On the sides facing the printed circuit board, the arrangement of the contact areas and the contact points located thereon is the same as the grid on the printed circuit board under test. Between the translator foils a vacuum is generated with the help of rubber seals, a through hole, a valve and a suction hose. This vacuum creates a rigid package which permits good contact with the probes on both sides. The inserted support layers, which can be conventional printed circuit boards, prevent the translator foils from buckling. The various types of extremely complex printed circuit board can be electrically tested rapidly and cheaply using this arrangement. The arrangement can be employed on both double-sided and one-sided electrical test installations.
摘要翻译：用于电测试印刷电路板的适配器装置由两个探针适配器组成，两个探头适配器具有均匀的探针间隔格，并且两个翻转箔在其两侧面向探针适配器的位置处具有与探头适配器的间距的接触区域。在面向印刷电路板的一侧，接触区域和位于其上的接触点的布置与被测印刷电路板上的格栅相同。在翻译器箔之间，借助橡胶密封件，通孔，阀门和抽吸软管产生真空。这种真空产生了一个刚性的包装，可以在两侧与探头良好的接触。插入的支撑层，其可以是常规的印刷电路板，防止转印箔弯曲。使用这种布置，可以快速且便宜地对各种类型的非常复杂的印刷电路板进行电测试。该装置可以用于双面和单面电气测试装置。

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