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    • 1. 发明授权
    • Top coat material and use thereof in lithography processes
    • 面漆材料及其在光刻工艺中的应用
    • US07700262B2
    • 2010-04-20
    • US12044004
    • 2008-03-07
    • Wenjie LiMargaret C. LawsonPushkara Rao Varanasi
    • Wenjie LiMargaret C. LawsonPushkara Rao Varanasi
    • G03F7/00G03F7/004
    • G03F7/11G03F7/0046G03F7/2041Y10T428/3154
    • A top coat material for applying on top of a photoresist material is disclosed. The top coat material includes a polymer, which includes at least one fluorosulfonamide monomer unit having one of the following two structures: wherein: M is a polymerizable backbone moiety; Z is a linking moiety selected from the group consisting of —C(O)O—, —C(O)—, —OC(O)—, and —O—C(O)—C(O)—O—; R1 is selected from the group consisting of an alkylene, an arylene, a semi- or perfluorinated alkylene, and a semi- or perfluorinated arylene; p and q are 0 or 1; R2 is selected from the group consisting of hydrogen, fluorine, an alkyl group of 1 to 6 carbons, and a semi- or perfluorinated alkyl group of 1 to 6 carbons; n is an integer from 1 to 6; and R3 is selected from the group consisting of hydrogen, an alkyl, an aryl, a semi- or perfluorinated alkyl, and a semi- or perfluorinated aryl. The top coat material may be used in lithography processes, wherein the top coat material is applied on a photoresist layer. The top coat material is preferably soluble in aqueous alkaline developer. The top coat material is also preferably insoluble in water, and is therefore particularly useful in immersion lithography techniques using water as the imaging medium.
    • 公开了一种用于涂覆在光致抗蚀剂材料上的顶涂层材料。 面漆材料包括聚合物,其包括至少一种具有以下两种结构之一的氟磺酰胺单体单元:其中:M是可聚合主链部分; Z是选自-C(O)O-,-C(O) - , - OC(O) - 和-O-C(O)-C(O)-O-的连接部分; R1选自亚烷基,亚芳基,半或全氟亚烷基,以及半或全氟化亚芳基; p和q为0或1; R2选自氢,氟,1至6个碳的烷基和1至6个碳的半或全氟化烷基; n是1至6的整数; 并且R 3选自氢,烷基,芳基,半或全氟烷基和半或全氟芳基。 面漆材料可以用在光刻工艺中,其中将顶涂层材料施加在光致抗蚀剂层上。 顶涂层材料优选可溶于含水碱性显影剂。 面漆材料也优选不溶于水,因此特别适用于使用水作为成像介质的浸渍光刻技术。
    • 4. 发明授权
    • Top coat material and use thereof in lithography processes
    • 面漆材料及其在光刻工艺中的应用
    • US07335456B2
    • 2008-02-26
    • US10855045
    • 2004-05-27
    • Wenjie LiMargaret C. LawsonPushkara Rao Varanasi
    • Wenjie LiMargaret C. LawsonPushkara Rao Varanasi
    • G03F7/00G03F7/004
    • G03F7/11G03F7/0046G03F7/2041Y10T428/3154
    • A top coat material for applying on top of a photoresist material is disclosed. The top coat material includes a polymer, which includes at least one fluorosulfonamide monomer unit having one of the following two structures: wherein: M is a polymerizable backbone moiety; Z is a linking moiety selected from the group consisting of —C(O)O—, —C(O)—, —OC(O)—, and —O—C(O)—C(O)—O—; R1 is selected from the group consisting of an alkylene, an arylene, a semi- or perfluorinated alkylene, and a semi- or perfluorinated arylene; p and q are 0 or 1; R2 is selected from the group consisting of hydrogen, fluorine, an alkyl group of 1 to 6 carbons, and a semi- or perfluorinated alkyl group of 1 to 6 carbons; n is an integer from 1 to 6; and R3 is selected from the group consisting of hydrogen, an alkyl, an aryl, a semi- or perfluorinated alkyl, and a semi- or perfluorinated aryl. The top coat material may be used in lithography processes, wherein the top coat material is applied on a photoresist layer. The top coat material is preferably soluble in aqueous alkaline developer. The top coat material is also preferably insoluble in water, and is therefore particularly useful in immersion lithography techniques using water as the imaging medium.
    • 公开了一种用于涂覆在光致抗蚀剂材料上的顶涂层材料。 面漆材料包括聚合物,其包括至少一种具有以下两种结构之一的氟磺酰胺单体单元:其中:M是可聚合主链部分; Z是选自-C(O)O-,-C(O) - , - OC(O) - 和-O-C(O)-C(O)-O-的连接部分; R 1选自亚烷基,亚芳基,半或全氟亚烷基,以及半或全氟化亚芳基; p和q为0或1; R 2选自氢,氟,1至6个碳的烷基和1至6个碳的半或全氟化烷基; n是1至6的整数; 和R 3 3选自氢,烷基,芳基,半或全氟烷基和半或全氟芳基。 面漆材料可以用在光刻工艺中,其中将顶涂层材料施加在光致抗蚀剂层上。 顶涂层材料优选可溶于含水碱性显影剂。 面漆材料也优选不溶于水,因此特别适用于使用水作为成像介质的浸渍光刻技术。
    • 7. 发明授权
    • Positive photoresist composition with a polymer including a fluorosulfonamide group and process for its use
    • 具有包含氟磺酰胺基团的聚合物的正性光致抗蚀剂组合物及其使用方法
    • US07063931B2
    • 2006-06-20
    • US10753989
    • 2004-01-08
    • Wenjie LiPushkara Rao Varanasi
    • Wenjie LiPushkara Rao Varanasi
    • G03C1/73G03F7/039
    • G03F7/0397G03F7/0046Y10S430/106Y10S430/108Y10S430/111
    • A positive photoresist composition comprises a radiations sensitive acid generator, and a polymer that may include a first repeating unit derived from a sulfonamide monomer including a fluorosulfonamide functionality, and a second repeating unit, which may include a pendant acid-labile moiety. The positive photoresist composition may also comprise at least one of a solvent, a quencher, and a surfactant. A patterned photoresist layer, made of the positive photoresist composition, may be formed on a substrate, the positive photoresist layer may be exposed to a pattern of imaging radiation, a portion of the positive photoresist layer that is exposed to the pattern of imaging radiation may be removed to reveal a correspondingly patterned substrate for subsequent processing in the manufacture of a semiconductor device.
    • 正性光致抗蚀剂组合物包含辐射敏感性酸产生剂和可以包含衍生自包含氟磺酰胺官能团的磺酰胺单体的第一重复单元的聚合物和可包括侧酸不稳定部分的第二重复单元。 正性光致抗蚀剂组合物还可以包含溶剂,猝灭剂和表面活性剂中的至少一种。 由正型光致抗蚀剂组合物制成的图案化光致抗蚀剂层可以形成在衬底上,正性光致抗蚀剂层可以暴露于成像辐射的图案,暴露于成像辐射图案的正性光致抗蚀剂层的一部分可以 被去除以露出相应图案化的衬底,用于在制造半导体器件中进行后续处理。