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    • 1. 发明申请
    • DETERMINATION OF TRAINING SET SIZE FOR A MACHINE LEARNING SYSTEM
    • 确定机器学习系统的训练尺寸
    • US20110307424A1
    • 2011-12-15
    • US12813431
    • 2010-06-10
    • Wen JinVi VuongWalter Dean Mieher
    • Wen JinVi VuongWalter Dean Mieher
    • G06F15/18
    • G06N99/005
    • Automated determination of a number of profiles for a training data set to be used in training a machine learning system for generating target function information from modeled profile parameters. In one embodiment, a first principal component analysis (PCA) is performed on a training data set, and a second PCA is performed on a combined data set which includes the training data set and a test data set. A test data set estimate is generated based on the first PCA transform and the second PCA matrix. The size of error between the test data set and the test data set estimate is used to determine whether a number of profiles associated with the training data set is sufficiently large for training a machine learning system to generate a library of spectral information.
    • 自动确定用于培训机器学习系统用于从建模的轮廓参数生成目标函数信息的训练数据集的轮廓数。 在一个实施例中,对训练数据集执行第一主成分分析(PCA),并且对包括训练数据集和测试数据集的组合数据集执行第二PCA。 基于第一PCA变换和第二PCA矩阵生成测试数据集估计。 测试数据集和测试数据集估计之间的误差大小用于确定与训练数据集相关联的多个简档是否足够大,用于训练机器学习系统以生成光谱信息库。
    • 2. 发明授权
    • Determination of training set size for a machine learning system
    • 确定机器学习系统的训练集大小
    • US08452718B2
    • 2013-05-28
    • US12813431
    • 2010-06-10
    • Wen JinVi VuongWalter Dean Mieher
    • Wen JinVi VuongWalter Dean Mieher
    • G06F15/18
    • G06N99/005
    • Automated determination of a number of profiles for a training data set to be used in training a machine learning system for generating target function information from modeled profile parameters. In one embodiment, a first principal component analysis (PCA) is performed on a training data set, and a second PCA is performed on a combined data set which includes the training data set and a test data set. A test data set estimate is generated based on the first PCA transform and the second PCA matrix. The size of error between the test data set and the test data set estimate is used to determine whether a number of profiles associated with the training data set is sufficiently large for training a machine learning system to generate a library of spectral information.
    • 自动确定用于培训机器学习系统用于从建模的轮廓参数生成目标函数信息的训练数据集的轮廓数。 在一个实施例中,对训练数据集执行第一主成分分析(PCA),并且对包括训练数据集和测试数据集的组合数据集执行第二PCA。 基于第一PCA变换和第二PCA矩阵生成测试数据集估计。 测试数据集和测试数据集估计之间的误差大小用于确定与训练数据集相关联的多个简档是否足够大,用于训练机器学习系统以生成光谱信息库。
    • 4. 发明授权
    • Azimuth angle measurement
    • 方位角测量
    • US08040511B1
    • 2011-10-18
    • US12357294
    • 2009-01-21
    • Shankar KrishnanHaixing ZhouHaiming WangDavid LidskyWalter Dean Mieher
    • Shankar KrishnanHaixing ZhouHaiming WangDavid LidskyWalter Dean Mieher
    • G01J4/00
    • G01N21/211G01B11/26
    • Methods and apparatus for measuring an optical azimuth angle φO of a substrate relative to a plane of detection in scatterometry tools are disclosed. A grating target on a stage of a scatterometry tool may be illuminated and positions of the resulting diffraction orders may be observed. The optical azimuth angle may be determined from the positions of the diffraction orders. Alternatively, polarization-dependent signals of radiation scattered from a line grating may be measured for equal and opposite polarization angles +A and −A. A combination signal may be computed from the polarization-dependent signals obtained at +A and −A and a property of the combination signal may be calculated for several mechanical Azimuth angles φM. A relationship between the optical azimuth angle φO and the mechanical azimuth angle φM may be determined from a behavior of the property as a function of mechanical azimuth angle φM.
    • 公开了用于测量基底相对于散射测量工具中的检测平面的光学方位角< O的方法和装置。 可以照射散射测量工具的台上的光栅目标,并且可以观察所得衍射级的位置。 光学方位角可以从衍射级的位置确定。 或者,可以测量从线光栅散射的辐射的偏振相关信号,以获得相等和相反的偏振角+ A和-A。 可以从在+ A和-A处获得的偏振相关信号计算组合信号,并且可以针对若干机械方位角& M来计算组合信号的特性。 可以根据作为机械方位角的函数的性质的行为来确定光学方位角< O和机械方位角& M之间的关系。
    • 5. 发明授权
    • Overlay marks, methods of overlay mark design and methods of overlay measurements
    • 叠加标记,叠加标记设计方法和覆盖测量方法
    • US07317824B2
    • 2008-01-08
    • US11394938
    • 2006-03-30
    • Mark GhinovkerMichael AdelWalter Dean MieherAdy LevyDan Wack
    • Mark GhinovkerMichael AdelWalter Dean MieherAdy LevyDan Wack
    • G06K9/00
    • G03F7/70633G03F9/7076G06K9/00281G06T7/0004G06T7/33G06T2207/30148Y10S438/975
    • An overlay mark for determining the relative shift between two or more successive layers of a substrate is disclosed. The overlay mark includes at least one test pattern for determining the relative shift between a first and a second layer of the substrate in a first direction. The test pattern includes a first set of working zones and a second set of working zones. The first set of working zones are disposed on a first layer of the substrate and have at least two working zones diagonally opposed and spatially offset relative to one another. The second set of working zones are disposed on a second layer of the substrate and have at least two working zones diagonally opposed and spatially offset relative to one another. The first set of working zones are generally angled relative to the second set of working zones thus forming an “X” shaped test pattern.
    • 公开了用于确定衬底的两个或更多个连续层之间的相对位移的重叠标记。 覆盖标记包括至少一个测试图案,用于确定在第一方向上的基板的第一和第二层之间的相对移动。 测试模式包括第一组工作区和第二组工作区。 第一组工作区域设置在基板的第一层上,并且具有相对于彼此对角地相对且空间上偏移的至少两个工作区域。 所述第二组工作区域设置在所述基板的第二层上,并且具有至少两个工作区域,所述至少两个工作区域相对于彼此对角地相对并且在空间上偏移。 第一组工作区域通常相对于第二组工作区域成角度,从而形成“X”形测试图案。
    • 7. 发明授权
    • Focus masking structures, focus patterns and measurements thereof
    • 聚焦掩模结构,聚焦图案及其测量
    • US07175945B2
    • 2007-02-13
    • US11084556
    • 2005-03-16
    • Walter Dean MieherDaniel WackAdy Levy
    • Walter Dean MieherDaniel WackAdy Levy
    • G03F9/00G03C5/00G01B11/00
    • G03F7/70641G03F1/28G03F1/44G06K7/0095
    • Methods and device structures used to determine the focus quality of a photolithographic pattern or a photolithographic system are disclosed. One aspect of the invention relates to focus masking structures configured to form focus patterns that contain focus information relating to the focus quality. The focus masking structures generally include a plurality of parallel source lines that are separated by alternating phase shift zones. Another aspect of the invention relates to focus patterns that change with changes in focus. The focus patterns generally include a plurality of periodic structures that form measurable shifts therebetween corresponding to the sign and magnitude of defocus. Another aspect of the invention relates to a method of determining the focus quality of a photolithographic pattern or a photolithographic system. The method generally includes: providing a focus masking structure, forming a focus pattern on a work piece with the focus masking structure, and obtaining focus information from the focus pattern. The focus information may be obtained using a variety of techniques, as for example, scatterometry techniques, scanning techniques, imaging techniques, phase based techniques, and the like.
    • 公开了用于确定光刻图案或光刻系统的焦点质量的方法和装置结构。 本发明的一个方面涉及被配置为形成聚焦图案的聚焦掩模结构,其包含与焦点质量相关的焦点信息。 聚焦掩模结构通常包括由交替的相移区域分开的多个平行的源极线。 本发明的另一方面涉及随焦点变化而变化的聚焦图案。 聚焦图案通常包括多个周期性结构,其在散焦的符号和大小之间形成可测量的偏移。 本发明的另一方面涉及一种确定光刻图案或光刻系统的焦点质量的方法。 该方法通常包括:提供聚焦掩蔽结构,在聚焦掩模结构的工件上形成聚焦图案,以及从焦点图案获得聚焦信息。 可以使用各种技术获得焦点信息,例如散射测量技术,扫描技术,成像技术,基于相位的技术等。
    • 9. 发明授权
    • Overlay alignment measurement mark
    • 覆盖对齐测量标记
    • US06486954B1
    • 2002-11-26
    • US09654318
    • 2000-09-01
    • Walter Dean MieherAdy Levy
    • Walter Dean MieherAdy Levy
    • G01B1127
    • G03F7/70633G01B11/002
    • An alignment mark comprising a first test zone and a second test zone for measuring the relative position between different layers of a semiconductor device. The alignment mark is used to determine the overlay error between layers of a semiconductor wafer while minimizing measurement inaccuracies caused by semiconductor manufacturing processes. The first test zone includes two sections, one in which test structures are formed on one layer and a second in which test structures are formed on a second layer. Each of these test structures is composed of smaller sub-structures. The second test zone includes two similar sections that are also composed of smaller sub-structures. The first and second test zones are configured so that the section of each test zone formed one layer is adjacent to the section of the other test zone that is formed on the other layer. By forming each of the periodic structures with smaller sized sub-structures, a more accurate measurement of any alignment error may be obtained. Another aspect of the present invention pertains to a method of utilizing the alignment mark so that an overlay measurement may be obtained.
    • 对准标记包括第一测试区和第二测试区,用于测量半导体器件的不同层之间的相对位置。 对准标记用于确定半导体晶片的层之间的重叠误差,同时最小化由半导体制造工艺引起的测量不准确。 第一测试区包括两个部分,一个测试结构形成在一个层上,另一个测试结构形成在第二层上。 这些测试结构中的每一个都由较小的子结构组成。 第二测试区域包括两个类似的部分,它们也由较小的子结构组成。 第一和第二测试区被配置成使得形成一层的每个测试区的部分与形成在另一层上的另一测试区的部分相邻。 通过用较小尺寸的子结构形成每个周期性结构,可以获得任何对准误差的更准确的测量。 本发明的另一方面涉及一种利用对准标记以便可以获得覆盖测量的方法。
    • 10. 发明授权
    • Overlay marks, methods of overlay mark design and methods of overlay measurements
    • 叠加标记,叠加标记设计方法和覆盖测量方法
    • US08330281B2
    • 2012-12-11
    • US11830782
    • 2007-07-30
    • Mark GhinovkerMichael AdelWalter Dean MieherAdy LevyDan Wack
    • Mark GhinovkerMichael AdelWalter Dean MieherAdy LevyDan Wack
    • H01L23/544
    • G03F7/70633G03F9/7076G06K9/00281G06T7/0004G06T7/33G06T2207/30148Y10S438/975
    • An overlay mark for determining the relative shift between two or more successive layers of a substrate is disclosed. The overlay mark includes at least one test pattern for determining the relative shift between a first and a second layer of the substrate in a first direction. The test pattern includes a first set of working zones and a second set of working zones. The first set of working zones are disposed on a first layer of the substrate and have at least two working zones diagonally opposed and spatially offset relative to one another. The second set of working zones are disposed on a second layer of the substrate and have at least two working zones diagonally opposed and spatially offset relative to one another. The first set of working zones are generally angled relative to the second set of working zones thus forming an “X” shaped test pattern.
    • 公开了用于确定衬底的两个或更多个连续层之间的相对位移的重叠标记。 覆盖标记包括至少一个测试图案,用于确定在第一方向上的基板的第一和第二层之间的相对移动。 测试模式包括第一组工作区和第二组工作区。 第一组工作区域设置在基板的第一层上,并且具有相对于彼此对角地相对且空间上偏移的至少两个工作区域。 所述第二组工作区域设置在所述基板的第二层上,并且具有至少两个工作区域,所述至少两个工作区域相对于彼此对角地相对并且在空间上偏移。 第一组工作区域通常相对于第二组工作区域成角度,从而形成X形测试图案。