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    • 10. 发明授权
    • Apparatus for guiding and aligning semiconductor chip package
    • 用于引导和对准半导体芯片封装的装置
    • US08628069B2
    • 2014-01-14
    • US12659717
    • 2010-03-18
    • Young-Chul Lee
    • Young-Chul Lee
    • B23Q1/25
    • G01R31/2893
    • Provided is an apparatus for guiding and aligning a semiconductor chip package. The apparatus may include an insert, a plate above the insert, and an adapter. The insert may be configured to house various sizes of semiconductor chip packages. The plate may be configured to move vertically with respect to the insert. The adapter may be coupled to the plate and may be configured to guide at least one semiconductor chip package into the insert and to perform alignment of the at least one semiconductor chip package. In accordance with example embodiments, the at least one semiconductor chip package may have a size corresponding to at least one of the various sizes.
    • 提供一种用于引导和对准半导体芯片封装的装置。 该装置可以包括插入件,插入件上方的板和适配器。 插入件可以被配置成容纳各种尺寸的半导体芯片封装。 板可以被配置为相对于插入件垂直移动。 适配器可以耦合到板并且可以被配置为将至少一个半导体芯片封装引导到插入件中并且执行至少一个半导体芯片封装的对准。 根据示例实施例,所述至少一个半导体芯片封装可以具有对应于各种尺寸中的至少一个的尺寸。