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    • 9. 发明授权
    • Apparatus for guiding and aligning semiconductor chip package
    • 用于引导和对准半导体芯片封装的装置
    • US08628069B2
    • 2014-01-14
    • US12659717
    • 2010-03-18
    • Young-Chul Lee
    • Young-Chul Lee
    • B23Q1/25
    • G01R31/2893
    • Provided is an apparatus for guiding and aligning a semiconductor chip package. The apparatus may include an insert, a plate above the insert, and an adapter. The insert may be configured to house various sizes of semiconductor chip packages. The plate may be configured to move vertically with respect to the insert. The adapter may be coupled to the plate and may be configured to guide at least one semiconductor chip package into the insert and to perform alignment of the at least one semiconductor chip package. In accordance with example embodiments, the at least one semiconductor chip package may have a size corresponding to at least one of the various sizes.
    • 提供一种用于引导和对准半导体芯片封装的装置。 该装置可以包括插入件,插入件上方的板和适配器。 插入件可以被配置成容纳各种尺寸的半导体芯片封装。 板可以被配置为相对于插入件垂直移动。 适配器可以耦合到板并且可以被配置为将至少一个半导体芯片封装引导到插入件中并且执行至少一个半导体芯片封装的对准。 根据示例实施例,所述至少一个半导体芯片封装可以具有对应于各种尺寸中的至少一个的尺寸。
    • 10. 发明授权
    • Apparatus for testing semiconductor device package and multilevel pusher thereof
    • 半导体器件封装及其多级推进器测试装置
    • US07893702B2
    • 2011-02-22
    • US12319329
    • 2009-01-06
    • Young-Chul Lee
    • Young-Chul Lee
    • G01R31/20
    • G01R31/2887G01R1/0466
    • A semiconductor package testing apparatus comprises a test substrate that electrically tests a semiconductor package chip; a socket having an electrical contact between the test substrate and the semiconductor package; an insert block inserted into the socket, wherein the semiconductor package is mounted to the insert block; and a pusher that brings the socket into contact with the semiconductor package by compressing an upper part of the semiconductor package, wherein the pusher is multilevel-controlled to compress the semiconductor package by a predefined pressure according to a thickness of the semiconductor package.
    • 一种半导体封装测试装置,包括对半导体封装芯片进行电测试的测试基板; 插座,其在所述测试基板和所述半导体封装之间具有电接触; 插入块插入到插座中,其中半导体封装被安装到插入块上; 以及推动器,其通过压缩半导体封装的上部而使插座与半导体封装接触,其中推动器被多级控制,以根据半导体封装的厚度以预定的压力压缩半导体封装。