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    • 5. 发明申请
    • INSERT CONTAINING APPARATUS FOR SEMICONDUCTOR PACKAGE
    • 用于半导体封装的插入装置
    • US20110199113A1
    • 2011-08-18
    • US13014774
    • 2011-01-27
    • Young-chul Lee
    • Young-chul Lee
    • G01R31/20H01L21/677H01L21/68B23Q3/00
    • G01R31/2893
    • An insert containing apparatus for a semiconductor package. The insert containing apparatus for a semiconductor package includes: a tray; an insert that is disposed in the tray, wherein at least one semiconductor package is seated on the insert and a through hole is formed around the semiconductor package; and an adapter including at least one finger of which an end portion passes through the through hole of the insert and guides the semiconductor package to a predetermined position so as to arrange the semiconductor package seated on the insert. The insert containing apparatus for a semiconductor package can be applied to semiconductor packages having any of various sizes by using a size-free insert. Thus, an investment cost of an instrument infrastructure can be greatly reduced, and an exchanging time of an insert can be reduced, and thus human power and time can be reduced.
    • 一种用于半导体封装的插入物包含装置。 一种用于半导体封装的插入式容纳装置,包括:托盘; 插入物,其设置在所述托盘中,其中至少一个半导体封装被放置在所述插入件上,并且在所述半导体封装周围形成通孔; 以及适配器,其包括至少一个手指,其端部穿过插入件的通孔并将半导体封装引导到预定位置,以便将半导体封装安置在插入件上。 可以通过使用无尺寸的插入件将用于半导体封装的插入式容纳装置应用于具有各种尺寸的任何一种的半导体封装。 因此,可以大大降低仪器基础设施的投资成本,并且可以减少插入物的交换时间,从而可以减少人力和时间。